Germanium [Ge]

Industry

CPC
H01L2924/10252

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10252Germanium [Ge]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package having an electronic component and an encapsulant encapsula...
- Patent number 12,112,992
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 12,094,729
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,916,028
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct filter hybridization for an optical sensor and filter assembly
- Patent number 11,788,884
- Issue date Oct 17, 2023
- Raytheon Company
- Thomas P. Sprafke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-to-back bonding with through-substrate via (TSV)
- Patent number 11,791,241
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages and methods of forming packages
- Patent number 11,715,727
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,658,150
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with semiconductor die having a low ohmic port...
- Patent number 11,605,572
- Issue date Mar 14, 2023
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,502,039
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,488,930
- Issue date Nov 1, 2022
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming same
- Patent number 11,387,118
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a cleaning compo...
- Patent number 11,380,537
- Issue date Jul 5, 2022
- Samsung Electronics Co., Ltd.
- Hoyoung Kim
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,373,990
- Issue date Jun 28, 2022
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 11,222,793
- Issue date Jan 11, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming modular 3D semiconductor...
- Patent number 11,211,359
- Issue date Dec 28, 2021
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bump structure and method of making semic...
- Patent number 11,127,704
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large channel interconnects with through silicon Vias (TSVs) and me...
- Patent number 11,127,715
- Issue date Sep 21, 2021
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device including support patterns and method of...
- Patent number 11,114,398
- Issue date Sep 7, 2021
- Samsung Electronics Co., Ltd.
- Dongwoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 11,107,740
- Issue date Aug 31, 2021
- ABB Power Grids Switzerland AG
- Jürgen Schuderer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages and methods of forming packages
- Patent number 11,094,680
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,069,636
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,069,658
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having metal bump and method of manufacturing...
- Patent number 11,037,894
- Issue date Jun 15, 2021
- Samsung Electronics Co., Ltd.
- Jinchan Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on package structure and method
- Patent number 10,964,666
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonder and methods of using the same
- Patent number 10,964,663
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonder and methods of using the same
- Patent number 10,950,572
- Issue date Mar 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Fabrication method of packaging structure
- Patent number 10,950,525
- Issue date Mar 16, 2021
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Zhong Jin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321799
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240170419
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages
- Publication number 20230075602
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Semiconductor Die for S...
- Publication number 20220285334
- Publication date Sep 8, 2022
- SEMTECH CORPORATION
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Encapsulant Deposited Along Sides and Sur...
- Publication number 20220093417
- Publication date Mar 24, 2022
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips and Methods of Forming Same
- Publication number 20210343680
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20210343666
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20210143131
- Publication date May 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210082844
- Publication date Mar 18, 2021
- Samsung Electronics Co., Ltd.
- Dongwoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)
- Publication number 20210043547
- Publication date Feb 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20210005554
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method to Minimize Stress on Stack Via
- Publication number 20200402855
- Publication date Dec 24, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING METAL BUMP AND METHOD OF MANUFACTURING...
- Publication number 20200343204
- Publication date Oct 29, 2020
- Samsung Electronics Co., Ltd.
- JINCHAN AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages and Methods of Forming Packages
- Publication number 20200118987
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200118953
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Encapsulant Deposited Along Sides and Sur...
- Publication number 20200090954
- Publication date Mar 19, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonder and Methods of Using the Same
- Publication number 20200066674
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B32 - LAYERED PRODUCTS
Information Patent Application
Die Bonder and Methods of Using the Same
- Publication number 20200066673
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B32 - LAYERED PRODUCTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20190393195
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, MANUFACTURING METHOD THEREOF, AND COMMUNICATI...
- Publication number 20190372676
- Publication date Dec 5, 2019
- RENESAS ELECTRONICS CORPORATION
- Tetsuya IIDA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CURRENT SENSOR ISOLATION
- Publication number 20190277889
- Publication date Sep 12, 2019
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A CLEANING COMPO...
- Publication number 20190198315
- Publication date Jun 27, 2019
- Samsung Electronics Co., Ltd.
- Hoyoung KIM
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUBSTRATE
- Publication number 20190164881
- Publication date May 30, 2019
- Intel Corporation
- Mathew J. MANUSHAROW
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20190157252
- Publication date May 23, 2019
- Kabushiki Kaisha Toshiba
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE CHANNEL INTERCONNECTS WITH THROUGH SILICON VIAS (TSVS) AND ME...
- Publication number 20190139938
- Publication date May 9, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages and Methods of Forming Packages
- Publication number 20190115332
- Publication date Apr 18, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming Same
- Publication number 20190096698
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips and Methods of Forming Same
- Publication number 20190027465
- Publication date Jan 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages with Thermal-Electrical-Mechanical Chips and...
- Publication number 20180374824
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip on Package Structure and Method
- Publication number 20180374822
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Germanium [Ge]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package having an electronic component and an encapsulant encapsula...

Semiconductor device with encapsulant deposited along sides and sur...

Semiconductor device and method to minimize stress on stack via

Package structure and method of forming the same

Semiconductor device and method of stacking semiconductor die for s...

Bonding process with inhibited oxide formation

Direct filter hybridization for an optical sensor and filter assembly

Front-to-back bonding with through-substrate via (TSV)

Packages and methods of forming packages

System on integrated chips and methods of forming same

Electronic component with semiconductor die having a low ohmic port...

Semiconductor package and method

Bonding process with inhibited oxide formation

Integrated circuit packages and methods of forming same

Method of manufacturing a semiconductor device and a cleaning compo...

Semiconductor device and method of stacking semiconductor die for s...

Semiconductor device with encapsulant deposited along sides and sur...

Semiconductor device and method of forming modular 3D semiconductor...

Semiconductor device with bump structure and method of making semic...

Large channel interconnects with through silicon Vias (TSVs) and me...

Integrated circuit device including support patterns and method of...

Power semiconductor module

Packages and methods of forming packages

Package structure and method of forming the same

System on integrated chips and methods of forming same

Semiconductor device having metal bump and method of manufacturing...

Chip on package structure and method

Die bonder and methods of using the same

Die bonder and methods of using the same

Fabrication method of packaging structure

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE

Semiconductor Packages

Semiconductor Device and Method of Stacking Semiconductor Die for S...

Semiconductor Device with Encapsulant Deposited Along Sides and Sur...

System on Integrated Chips and Methods of Forming Same

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Device and Method for UBM/RDL Routing

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)

Semiconductor Package and Method

Semiconductor Device and Method to Minimize Stress on Stack Via

SEMICONDUCTOR DEVICE HAVING METAL BUMP AND METHOD OF MANUFACTURING...

Packages and Methods of Forming Packages

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Semiconductor Device with Encapsulant Deposited Along Sides and Sur...

Die Bonder and Methods of Using the Same

Die Bonder and Methods of Using the Same

Device and Method for UBM/RDL Routing

SEMICONDUCTOR MODULE, MANUFACTURING METHOD THEREOF, AND COMMUNICATI...

CURRENT SENSOR ISOLATION

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A CLEANING COMPO...

INTEGRATED CIRCUIT PACKAGE SUBSTRATE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

LARGE CHANNEL INTERCONNECTS WITH THROUGH SILICON VIAS (TSVS) AND ME...

Packages and Methods of Forming Packages

Integrated Circuit Packages and Methods of Forming Same

System on Integrated Chips and Methods of Forming Same

Semiconductor Packages with Thermal-Electrical-Mechanical Chips and...

Chip on Package Structure and Method