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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/29188
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Patents Grants
last 30 patents
Information
Patent Grant
Light emitting diode and display apparatus having the same
Patent number
12,159,861
Issue date
Dec 3, 2024
SEOUL VIOSYS CO., LTD.
Seong Kyu Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded assembly containing different size opposing bonding pads and...
Patent number
12,125,814
Issue date
Oct 22, 2024
SanDisk Technologies LLC
Lin Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect techniques for electrically connecting source/drain re...
Patent number
12,107,085
Issue date
Oct 1, 2024
Intel Corporation
Aaron D. Lilak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Atomic layer deposition bonding layer for joining two semiconductor...
Patent number
12,094,849
Issue date
Sep 17, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Kuang-Wei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid pocket post and tailored via dielectric for 3D-integrated el...
Patent number
12,002,773
Issue date
Jun 4, 2024
Raytheon Company
Andrew Clarke
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for multi-color LED pixel unit with horizontal...
Patent number
11,967,589
Issue date
Apr 23, 2024
Jade Bird Display (Shanghai) Limited
Qunchao Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Storage layers for wafer bonding
Patent number
11,942,447
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
De-Yang Chiou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for wavelength conversion using layers of different photo...
Patent number
11,765,477
Issue date
Sep 19, 2023
Sony Group Corporation
Atsushi Toda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Glass-based bonding structures for power electronics
Patent number
11,749,632
Issue date
Sep 5, 2023
Toyota Motor Engineering & Manufacturing North America, Inc.
Shailesh N. Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect techniques for electrically connecting source/drain re...
Patent number
11,742,346
Issue date
Aug 29, 2023
Intel Corporation
Aaron D. Lilak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure
Patent number
11,562,935
Issue date
Jan 24, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Back side metallization
Patent number
11,488,922
Issue date
Nov 1, 2022
Advanced Micro Devices, Inc.
Thomas P. Dolbear
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Chemical bonding method and joined structure
Patent number
11,450,643
Issue date
Sep 20, 2022
Tohoku University
Takehito Shimatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor, image capturing system, and production method of imag...
Patent number
11,122,227
Issue date
Sep 14, 2021
Sony Corporation
Atsushi Toda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilevel semiconductor device and structure with waveguides
Patent number
11,063,071
Issue date
Jul 13, 2021
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor component, package structure and manufacturing method...
Patent number
11,043,482
Issue date
Jun 22, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package with offset 3D structure
Patent number
11,018,125
Issue date
May 25, 2021
Advanced Micro Devices, Inc.
Milind S. Bhagavat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Back side metallization
Patent number
10,957,669
Issue date
Mar 23, 2021
Advanced Micro Devices, Inc.
Thomas P. Dolbear
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a glass substrate core layer
Patent number
10,903,157
Issue date
Jan 26, 2021
SKC Co., Ltd
Sung Jin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for permanently bonding wafers
Patent number
10,825,793
Issue date
Nov 3, 2020
EV Group E. Thallner GmbH
Thomas Plach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protective film for semiconductors, semiconductor device, and compo...
Patent number
10,825,790
Issue date
Nov 3, 2020
Lintec Corporation
Naoya Okamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Physical quantity measurement device, method for manufacturing same...
Patent number
10,788,385
Issue date
Sep 29, 2020
Hitachi Automotive Systems, Ltd.
Takuya Aoyagi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with plated lead frame
Patent number
10,748,787
Issue date
Aug 18, 2020
Infineon Technologies AG
Carsten von Koblinski
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package with offset 3D structure
Patent number
10,714,462
Issue date
Jul 14, 2020
Advanced Micro Devices, Inc.
Milind S. Bhagavat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor, image capturing system, and production method of imag...
Patent number
10,681,292
Issue date
Jun 9, 2020
Sony Corporation
Atsushi Toda
G01 - MEASURING TESTING
Information
Patent Grant
3D microdisplay device and structure
Patent number
10,679,977
Issue date
Jun 9, 2020
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor component, package structure and manufacturing method...
Patent number
10,672,754
Issue date
Jun 2, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid state image sensor and manufacturing method thereof
Patent number
10,566,373
Issue date
Feb 18, 2020
Renesas Electronics Corporation
Yotaro Goto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of wafer bonding of dissimilar thickness die
Patent number
10,515,837
Issue date
Dec 24, 2019
Raytheon Company
Sean P. Kilcoyne
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Back side metallization
Patent number
10,431,562
Issue date
Oct 1, 2019
Advanced Micro Devices, Inc.
Thomas P. Dolbear
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING
Publication number
20250046744
Publication date
Feb 6, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...
Publication number
20240363578
Publication date
Oct 31, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuang-Wei CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH HORIZONTAL...
Publication number
20240258294
Publication date
Aug 1, 2024
Jade Bird Display (Shanghai) Limited
Qunchao XU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...
Publication number
20230412941
Publication date
Dec 21, 2023
SONY GROUP CORPORATION
Atsushi TODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Storage Layers For Wafer Bonding
Publication number
20230387065
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
De-Yang CHIOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT TECHNIQUES FOR ELECTRICALLY CONNECTING SOURCE/DRAIN RE...
Publication number
20230352481
Publication date
Nov 2, 2023
Intel Corporation
AARON D. LILAK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTIN...
Publication number
20230335696
Publication date
Oct 19, 2023
STANLEY ELECTRIC CO., LTD
Keima KONO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED ASSEMBLY CONTAINING DIFFERENT SIZE OPPOSING BONDING PADS AND...
Publication number
20230253353
Publication date
Aug 10, 2023
SANDISK TECHNOLOGIES LLC
Lin HOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLID COMPONENT COUPLED TO DIES IN MULTI-CHIP PACKAGE USING DIELECT...
Publication number
20230197664
Publication date
Jun 22, 2023
Intel Corporation
Xavier F. Brun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PIXEL DEVICE FOR LED DISPLAY AND LED DISPLAY APPARATUS HAVING THE SAME
Publication number
20230154895
Publication date
May 18, 2023
Seoul Viosys Co., Ltd.
Namgoo Cha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STORAGE LAYERS FOR WAFER BONDING
Publication number
20230062412
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
De-Yang CHIOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...
Publication number
20230026052
Publication date
Jan 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuang-Wei CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING
Publication number
20220336303
Publication date
Oct 20, 2022
Taiwan Semiconductor Manufacturing company Ltd.
HSIEN-WEI CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS-BASED BONDING STRUCTURES FOR POWER ELECTRONICS
Publication number
20220320031
Publication date
Oct 6, 2022
Toyota Motor Engineering & Manufacturing North America, Inc.
Shailesh N. Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHEMICAL BONDING METHOD AND JOINED STRUCTURE
Publication number
20220157770
Publication date
May 19, 2022
TOHOKU UNIVERSITY
Takehito SHIMATSU
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH HORIZONTAL...
Publication number
20210384182
Publication date
Dec 9, 2021
Jade Bird Display (Shanghai) Limited
Qunchao XU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...
Publication number
20210377471
Publication date
Dec 2, 2021
SONY GROUP CORPORATION
Atsushi TODA
G01 - MEASURING TESTING
Information
Patent Application
MULTILEVEL SEMICONDUCTOR DEVICE AND STRUCTURE WITH WAVEGUIDES
Publication number
20210210456
Publication date
Jul 8, 2021
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR COMPONENT, PACKAGE STRUCTURE AND MANUFACTURING METHOD...
Publication number
20200294984
Publication date
Sep 17, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...
Publication number
20200244904
Publication date
Jul 30, 2020
SONY CORPORATION
Atsushi Toda
G01 - MEASURING TESTING
Information
Patent Application
INTERCONNECT TECHNIQUES FOR ELECTRICALLY CONNECTING SOURCE/DRAIN RE...
Publication number
20200006329
Publication date
Jan 2, 2020
Intel Corporation
AARON D. LILAK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY FAN-OUT PACKAGING
Publication number
20190326257
Publication date
Oct 24, 2019
Rahul Agarwal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20190139842
Publication date
May 9, 2019
Taiwan Semiconductor Manufacturing company Ltd.
HSIEN-WEI CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Physical Quantity Measurement Device, Method for Manufacturing Same...
Publication number
20190128758
Publication date
May 2, 2019
Hitachi Automotive Systems, Ltd.
Takuya AOYAGI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR COMPONENT, PACKAGE STRUCTURE AND MANUFACTURING METHOD...
Publication number
20190096867
Publication date
Mar 28, 2019
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...
Publication number
20180367746
Publication date
Dec 20, 2018
SONY CORPORATION
Atsushi Toda
G01 - MEASURING TESTING
Information
Patent Application
SOLID STATE IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
Publication number
20180366508
Publication date
Dec 20, 2018
RENESAS ELECTRONICS CORPORATION
Yotaro GOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF WAFER BONDING OF DISSIMILAR THICKNESS DIE
Publication number
20180301365
Publication date
Oct 18, 2018
Raytheon Company
Sean P. Kilcoyne
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING BONDED BODY
Publication number
20180082972
Publication date
Mar 22, 2018
NAMICS CORPORATION
Raymond DIETZ
C03 - GLASS MINERAL OR SLAG WOOL
Information
Patent Application
Semiconductor Device with Plated Lead Frame
Publication number
20180061671
Publication date
Mar 1, 2018
INFINEON TECHNOLOGIES AG
Carsten von Koblinski
H01 - BASIC ELECTRIC ELEMENTS