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H01L2224/29388

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a resin that seals a rewiring
- Patent number 11,894,325
- Issue date Feb 6, 2024
- Rohm Co., Ltd.
- Manato Kurata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film, semiconductor apparatus using the same, and semicond...
- Patent number 11,355,413
- Issue date Jun 7, 2022
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Alignment method, method for connecting electronic component, metho...
- Patent number 11,049,842
- Issue date Jun 29, 2021
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
- Patent number 10,734,297
- Issue date Aug 4, 2020
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curing a heat-curable material in an embedded curing zone
- Patent number 10,717,236
- Issue date Jul 21, 2020
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen van den Brand
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 10,651,161
- Issue date May 12, 2020
- Kabushiki Kaisha Toshiba
- Masahiro Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device connected by anisotropic conductive film
- Patent number 10,504,866
- Issue date Dec 10, 2019
- Kudko Chemical Co., Ltd.
- Young Woo Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device
- Patent number 10,504,749
- Issue date Dec 10, 2019
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for integrated circuits packaging with increas...
- Patent number 10,381,326
- Issue date Aug 13, 2019
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 10,373,926
- Issue date Aug 6, 2019
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor die attach system and method
- Patent number 10,297,564
- Issue date May 21, 2019
- Infineon Technologies AG
- Joachim Mahler
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Connection body, method for manufacturing a connection body, connec...
- Patent number 10,175,544
- Issue date Jan 8, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- G02 - OPTICS
Information Patent Grant
Adhesive film for semiconductor chip with through electrode
- Patent number 10,131,826
- Issue date Nov 20, 2018
- Sekisui Chemical Co., Ltd.
- Mai Nagata
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Adhesive and light-emitting device
- Patent number 9,994,743
- Issue date Jun 12, 2018
- DEXERIALS CORPORATION
- Masaharu Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 9,960,139
- Issue date May 1, 2018
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
UV-curable anisotropic conductive adhesive
- Patent number 9,777,197
- Issue date Oct 3, 2017
- Sunray Scientific, LLC
- S. Kumar Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, resin sheet, and production method for semicondu...
- Patent number 9,738,763
- Issue date Aug 22, 2017
- Toray Industries, Inc.
- Yoichi Shimba
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Connection body
- Patent number 9,673,168
- Issue date Jun 6, 2017
- Dexerials Corporation
- Kenichi Saruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film adhesive, dicing tape with film adhesive, method of manufactur...
- Patent number 9,484,240
- Issue date Nov 1, 2016
- Nitto Denko Corporation
- Yuki Sugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive die attach film for large die semiconductor packages and...
- Patent number 9,449,938
- Issue date Sep 20, 2016
- Henkel IP & Holding GmbH
- Pukun Zhu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bridging arrangement and method for manufacturing a bridging arrang...
- Patent number 9,230,830
- Issue date Jan 5, 2016
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production method for polyamide acid particles, production method f...
- Patent number 9,228,118
- Issue date Jan 5, 2016
- Sekisui Chemical Co., Ltd.
- Satoshi Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Connection device, method for manufacturing connection structure, m...
- Patent number 9,196,599
- Issue date Nov 24, 2015
- Dexerials Corporation
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-encapsulating adhesive, semiconductor-encapsulating f...
- Patent number 9,123,734
- Issue date Sep 1, 2015
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit component and method of making the same
- Patent number 9,019,714
- Issue date Apr 28, 2015
- Hitachi Chemical Company, Ltd.
- Kazuya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bridging arrangement and method for manufacturing a bridging arrang...
- Patent number 8,951,445
- Issue date Feb 10, 2015
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition for semiconductors, adhesive film prepared usi...
- Patent number 8,946,343
- Issue date Feb 3, 2015
- Cheil Industries, Inc.
- Baek Soung Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electrical component having an electrical connection arrangement an...
- Patent number 8,923,005
- Issue date Dec 30, 2014
- Micro Systems Engineering GmbH
- Rainer Dohle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer backside coating process with pulsed UV light source
- Patent number 8,791,033
- Issue date Jul 29, 2014
- Henkel IP & Holding GmbH
- Jeffrey Gasa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive adhesive composition, photosensitive adhesive film,...
- Patent number 8,759,989
- Issue date Jun 24, 2014
- Toray Industries, Inc.
- Kazuyuki Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
- Publication number 20240203754
- Publication date Jun 20, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTIN...
- Publication number 20230335696
- Publication date Oct 19, 2023
- STANLEY ELECTRIC CO., LTD
- Keima KONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESTER COMPOUND AND RESIN COMPOSITION
- Publication number 20230242705
- Publication date Aug 3, 2023
- AJINOMOTO CO., INC.
- Ichiro OGURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Joining and Insulating Power Electronic Semiconductor Components
- Publication number 20230215838
- Publication date Jul 6, 2023
- SIEMENS AKTIENGESELLSCHAFT
- Bernd Müller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210407937
- Publication date Dec 30, 2021
- Rohm Co., Ltd.
- Manato KURATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Attach System and Method
- Publication number 20190109112
- Publication date Apr 11, 2019
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...
- Publication number 20180218994
- Publication date Aug 2, 2018
- DEXERIALS CORPORATION
- Kouichi SATO
- B32 - LAYERED PRODUCTS
Information Patent Application
Engineered Residue Solder Paste Technology
- Publication number 20170135227
- Publication date May 11, 2017
- ALPHA METALS, INC.
- Hosur Venkatagiriyappa Ramakrishna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION BODY
- Publication number 20160351531
- Publication date Dec 1, 2016
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION BODY, METHOD FOR MANUFACTURING A CONNECTION BODY, CONNEC...
- Publication number 20160327826
- Publication date Nov 10, 2016
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- G02 - OPTICS
Information Patent Application
CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND...
- Publication number 20160148894
- Publication date May 26, 2016
- Henkel IP & Holding GmbH
- Pukun Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING FUNCTION AND HEAT DISSIP...
- Publication number 20140328023
- Publication date Nov 6, 2014
- Samsung Electronics Co., Ltd.
- IN-HO CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...
- Publication number 20140302643
- Publication date Oct 9, 2014
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM ADHESIVE, DICING TAPE WITH FILM ADHESIVE, METHOD OF MANUFACTUR...
- Publication number 20140231983
- Publication date Aug 21, 2014
- Yuki SUGO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING F...
- Publication number 20140206148
- Publication date Jul 24, 2014
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140106160
- Publication date Apr 17, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHANG-CHIN WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DICING FILM WITH PROTECTING FILM
- Publication number 20140106106
- Publication date Apr 17, 2014
- Nitto Denko Corporation
- Yuichiro Shishido
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM
- Publication number 20140084468
- Publication date Mar 27, 2014
- Young Woo PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRODUCTION METHOD FOR POLYAMIDE ACID PARTICLES, PRODUCTION METHOD F...
- Publication number 20130289156
- Publication date Oct 31, 2013
- Satoshi Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive Composition And Adhesive Film Comprising The Same
- Publication number 20130165603
- Publication date Jun 27, 2013
- Kyoung Tae WI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONTROLLING DENSITY OF PARTICLES WITHIN UNDERFILL SURROUNDING SOLDE...
- Publication number 20130161822
- Publication date Jun 27, 2013
- International Business Machines Corporation
- Stephane S. Barbeau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20130157415
- Publication date Jun 20, 2013
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME
- Publication number 20130120948
- Publication date May 16, 2013
- HITACHI CHEMICAL CO., Ltd.
- Kazuya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE FILM,...
- Publication number 20130105998
- Publication date May 2, 2013
- TORAY INDUSTRIES, INC.
- Kazuyuki Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHODS OF FABRICATING ELECTRONICS ASSEMBLIES
- Publication number 20130109136
- Publication date May 2, 2013
- Nordson Corporation
- David K. Foote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BACKSIDE COATING PROCESS WITH PULSED UV LIGHT SOURCE
- Publication number 20130099396
- Publication date Apr 25, 2013
- Henkel Corporation
- Jeffrey Gasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION FOR SEMICONDUCTORS, ADHESIVE FILM PREPARED USI...
- Publication number 20130041088
- Publication date Feb 14, 2013
- Baek Soung PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BRIDGING ARRANGEMENT AND METHOD FOR MANUFACTURING A BRIDGING ARRANG...
- Publication number 20120261819
- Publication date Oct 18, 2012
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING FILM WITH PROTECTING FILM
- Publication number 20120231236
- Publication date Sep 13, 2012
- Yuichiro SHISHIDO
- B32 - LAYERED PRODUCTS
Information Patent Application
Electrical Component Having an Electrical Connection Arrangement an...
- Publication number 20120212918
- Publication date Aug 23, 2012
- MICRO SYSTEMS ENGINEERING GMBH
- Rainer Dohle
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having a resin that seals a rewiring

Adhesive film, semiconductor apparatus using the same, and semicond...

Alignment method, method for connecting electronic component, metho...

Ag underlayer-attached metallic member, Ag underlayer-attached insu...

Curing a heat-curable material in an embedded curing zone

Semiconductor device

Semiconductor device connected by anisotropic conductive film

Semiconductor device

Structure and method for integrated circuits packaging with increas...

Anisotropic conductive film, method for producing anisotropic condu...

Semiconductor die attach system and method

Connection body, method for manufacturing a connection body, connec...

Adhesive film for semiconductor chip with through electrode

Adhesive and light-emitting device

Anisotropic conductive film, method for producing anisotropic condu...

UV-curable anisotropic conductive adhesive

Resin composition, resin sheet, and production method for semicondu...

Connection body

Film adhesive, dicing tape with film adhesive, method of manufactur...

Conductive die attach film for large die semiconductor packages and...

Bridging arrangement and method for manufacturing a bridging arrang...

Production method for polyamide acid particles, production method f...

Connection device, method for manufacturing connection structure, m...

Semiconductor-encapsulating adhesive, semiconductor-encapsulating f...

Circuit component and method of making the same

Bridging arrangement and method for manufacturing a bridging arrang...

Adhesive composition for semiconductors, adhesive film prepared usi...

Electrical component having an electrical connection arrangement an...

Wafer backside coating process with pulsed UV light source

Photosensitive adhesive composition, photosensitive adhesive film,...

Patents Applicationslast 30 patents

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTIN...

ESTER COMPOUND AND RESIN COMPOSITION

Joining and Insulating Power Electronic Semiconductor Components

SEMICONDUCTOR DEVICE

Semiconductor Die Attach System and Method

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...

Engineered Residue Solder Paste Technology

CONNECTION BODY

CONNECTION BODY, METHOD FOR MANUFACTURING A CONNECTION BODY, CONNEC...

CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND...

SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING FUNCTION AND HEAT DISSIP...

CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...

FILM ADHESIVE, DICING TAPE WITH FILM ADHESIVE, METHOD OF MANUFACTUR...

SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING F...

ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME

DICING FILM WITH PROTECTING FILM

SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM

PRODUCTION METHOD FOR POLYAMIDE ACID PARTICLES, PRODUCTION METHOD F...

Adhesive Composition And Adhesive Film Comprising The Same

CONTROLLING DENSITY OF PARTICLES WITHIN UNDERFILL SURROUNDING SOLDE...

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME

PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE FILM,...

METHODS OF FABRICATING ELECTRONICS ASSEMBLIES

WAFER BACKSIDE COATING PROCESS WITH PULSED UV LIGHT SOURCE

ADHESIVE COMPOSITION FOR SEMICONDUCTORS, ADHESIVE FILM PREPARED USI...

BRIDGING ARRANGEMENT AND METHOD FOR MANUFACTURING A BRIDGING ARRANG...

DICING FILM WITH PROTECTING FILM

Electrical Component Having an Electrical Connection Arrangement an...