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H01L2224/13688

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13688Glasses

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Patents Grantslast 30 patents

Information Patent Grant
Method of making a conductive pillar bump with non-metal sidewall p...
- Patent number 9,287,171
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball for semiconductor packaging and electronic member using...
- Patent number 9,024,442
- Issue date May 5, 2015
- Nippon Steel & Sumikin Materials Co., Ltd.
- Shinichi Terashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper pillar bump with non-metal sidewall protection structure and...
- Patent number 8,823,167
- Issue date Sep 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu pillar bump with non-metal sidewall protection structure
- Patent number 8,441,124
- Issue date May 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method for manufacturing same
- Patent number 8,258,637
- Issue date Sep 4, 2012
- Hitachi, Ltd.
- Eiji Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING A CONDUCTIVE PILLAR BUMP WITH NON-METAL SIDEWALL P...
- Publication number 20140335687
- Publication date Nov 13, 2014
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE INTERCONNECT INCLUDING AN INORGANIC COLLAR
- Publication number 20140124877
- Publication date May 8, 2014
- QUALCOMM Incorporated
- Yangyang Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COPPER PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE AND...
- Publication number 20120280388
- Publication date Nov 8, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL FOR SEMICONDUCTOR PACKAGING AND ELECTRONIC MEMBER USING...
- Publication number 20120223430
- Publication date Sep 6, 2012
- Nippon Steel Materials Co., Ltd.
- Shinichi Terashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CU PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE
- Publication number 20110266667
- Publication date Nov 3, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20110139856
- Publication date Jun 16, 2011
- Hitachi, Ltd.
- Eiji SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS