Glasses

Industry

CPC
H01L2924/16588

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/16588Glasses

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip scale package and related methods
- Patent number 10,770,492
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Bingzhi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper-proof electronic packages with stressed glass component subs...
- Patent number 10,535,618
- Issue date Jan 14, 2020
- International Business Machines Corporation
- James A. Busby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper-proof electronic packages with stressed glass component subs...
- Patent number 10,535,619
- Issue date Jan 14, 2020
- International Business Machines Corporation
- James A. Busby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of glass-sealed package, and glass substrate
- Patent number 8,656,740
- Issue date Feb 25, 2014
- Seiko Instruments Inc.
- Yoshihisa Tange
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 7,652,360
- Issue date Jan 26, 2010
- Hitachi, Ltd.
- Mitsuo Usami
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device and method of manufacture the same
- Patent number 7,208,351
- Issue date Apr 24, 2007
- Hitachi, Ltd.
- Mitsuo Usami
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device and method of manufacture the same
- Patent number 6,930,401
- Issue date Aug 16, 2005
- Hitachi, Ltd.
- Mitsuo Usami
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device and method of manufacture the same
- Patent number 6,657,542
- Issue date Dec 2, 2003
- Hitachi, Ltd.
- Mitsuo Usami
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Leadless chip carrier apparatus providing for a transmission line e...
- Patent number 4,551,747
- Issue date Nov 5, 1985
- Mayo Foundation
- Barry K. Gilbert
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240321810
- Publication date Sep 26, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-CHIAO TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBS...
- Publication number 20180358311
- Publication date Dec 13, 2018
- International Business Machines Corporation
- James A. BUSBY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBS...
- Publication number 20180350757
- Publication date Dec 6, 2018
- International Business Machines Corporation
- James A. BUSBY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MANUFACTURING METHOD OF GLASS-SEALED PACKAGE, AND GLASS SUBSTRATE
- Publication number 20100215906
- Publication date Aug 26, 2010
- Yoshihisa Tange
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20070190699
- Publication date Aug 16, 2007
- Mitsuo Usami
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic device and method of manufacture the same
- Publication number 20050227416
- Publication date Oct 13, 2005
- Hitachi, Ltd.
- Mitsuo Usami
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic device and method of manufacture the same
- Publication number 20040061613
- Publication date Apr 1, 2004
- Hitachi, Ltd.
- Mitsuo Usami
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic device and method of manufacture the same
- Publication number 20020130402
- Publication date Sep 19, 2002
- Hitachi, Ltd.
- Mitsuo Usami
- G06 - COMPUTING CALCULATING COUNTING

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip scale package and related methods

Tamper-proof electronic packages with stressed glass component subs...

Tamper-proof electronic packages with stressed glass component subs...

Manufacturing method of glass-sealed package, and glass substrate

Electronic device and method of manufacturing the same

Electronic device and method of manufacture the same

Electronic device and method of manufacture the same

Electronic device and method of manufacture the same

Leadless chip carrier apparatus providing for a transmission line e...

Patents Applicationslast 30 patents

CHIP PACKAGE STRUCTURE

TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBS...

TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBS...

MANUFACTURING METHOD OF GLASS-SEALED PACKAGE, AND GLASS SUBSTRATE

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic device and method of manufacture the same

Electronic device and method of manufacture the same

Electronic device and method of manufacture the same