Gluing

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CPC
B81C2203/032

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/032Gluing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for bonding wafers, and a wafer
- Patent number 12,202,725
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Konsta Hannula
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a plurality of sensor devices, and sensor device
- Patent number 12,195,330
- Issue date Jan 14, 2025
- Robert Bosch GmbH
- Daniel Haug
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package and method of producing the sensor package
- Patent number 12,180,066
- Issue date Dec 31, 2024
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing fine structures in the volume of a substrate c...
- Patent number 12,172,157
- Issue date Dec 24, 2024
- Schott AG
- Andreas Ortner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enclosed cavity structures
- Patent number 12,162,747
- Issue date Dec 10, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Laser-assisted material phase-change and expulsion micro-machining...
- Patent number 12,077,432
- Issue date Sep 3, 2024
- Massachusetts Institute of Technology
- Prashant Patil
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated device with electrical contacts between st...
- Patent number 12,024,422
- Issue date Jul 2, 2024
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,981,559
- Issue date May 14, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfabrication of omni-view peripheral scanning system
- Patent number 11,926,523
- Issue date Mar 12, 2024
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Youmin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,897,760
- Issue date Feb 13, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing module and manufacturing method thereof
- Patent number 11,894,473
- Issue date Feb 6, 2024
- Ruei Chi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,884,537
- Issue date Jan 30, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing damper structures on a micromechanical wafer
- Patent number 11,873,216
- Issue date Jan 16, 2024
- Robert Bosch GmbH
- Michael Stumber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro mechanical system and manufacturing method thereof
- Patent number 11,851,321
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with built-in vibration isolation, thermal st...
- Patent number 11,834,328
- Issue date Dec 5, 2023
- Invensense, Inc.
- Hamid Eslampour
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,834,330
- Issue date Dec 5, 2023
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical membrane transducer with active damper
- Patent number 11,807,519
- Issue date Nov 7, 2023
- STMicroelectronics S.r.l.
- Domenico Giusti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with particle filter and method of manufacture
- Patent number 11,787,689
- Issue date Oct 17, 2023
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate assembly and method of bonding substrates
- Patent number 11,752,499
- Issue date Sep 12, 2023
- Taiwan Green Point Enterprises Co., Ltd.
- Sung-Yi Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Emitter package for a photoacoustic sensor
- Patent number 11,609,180
- Issue date Mar 21, 2023
- Infineon Technologies AG
- Siyuan Qi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged die and assembling method
- Patent number 11,597,647
- Issue date Mar 7, 2023
- TDK Corporation
- Andreas Barbul
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing fine structures in the volume of a substrate c...
- Patent number 11,534,754
- Issue date Dec 27, 2022
- Schott AG
- Andreas Ortner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microfluidic cartridge for processing and detecting nucleic acids
- Patent number 11,485,968
- Issue date Nov 1, 2022
- NeuMoDx Molecular, Inc.
- Michael T. Kusner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device, liquid ejecting head, liquid ejecting apparatus, manuf...
- Patent number 11,390,079
- Issue date Jul 19, 2022
- Seiko Epson Corporation
- Daisuke Yamada
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die stack arrangement comprising a die-attach-film tape and method...
- Patent number 11,342,298
- Issue date May 24, 2022
- Infineon Technologies AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor systems and methods for providing sensor systems
- Patent number 11,289,444
- Issue date Mar 29, 2022
- General Electric Company
- David Richard Esler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fence structure to prevent stiction in a MEMS motion sensor
- Patent number 11,261,083
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Three-dimensional micro devices and method for their production
- Patent number 11,208,321
- Issue date Dec 28, 2021
- Leibniz-Institut fuer Festkoerper-und Werkstoffforschung Dresden e.V.
- Daniil Karnaushenko
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate assembly and method of bonding substrates
- Patent number 11,167,284
- Issue date Nov 9, 2021
- Taiwan Green Point Enterprises Co., Ltd.
- Sung-Yi Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for making three dimensional structures using photolithograp...
- Patent number 11,143,959
- Issue date Oct 12, 2021
- Mercene Labs AB
- Carl Fredrik Carlborg
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING FINE STRUCTURES IN THE VOLUME OF A SUBSTRATE C...
- Publication number 20250050329
- Publication date Feb 13, 2025
- SCHOTT AG
- Andreas Ortner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT
- Publication number 20240425364
- Publication date Dec 26, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240083742
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICO...
- Publication number 20240087941
- Publication date Mar 14, 2024
- Dow Toray Co., Ltd.
- Nohno TODA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL MEMBRANE TRANSDUCER WITH ACTIVE DAMPER
- Publication number 20240034618
- Publication date Feb 1, 2024
- STMicroelectronics S.r.l.
- Domenico GIUSTI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
A MICROFLUIDIC SENSOR
- Publication number 20230404777
- Publication date Dec 21, 2023
- CAMBRIDGE ENTERPRISE LIMITED
- Sohini KAR-NARAYAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATION STRUCTURE, SUBSTRATE, AND ENCAPSULATION METHOD
- Publication number 20230365400
- Publication date Nov 16, 2023
- Huawei Technologies Co., Ltd
- Guoqiang WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS with cover drive and method of operating the same
- Publication number 20230322546
- Publication date Oct 12, 2023
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Sergiu LANGA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ATOMIC-SMOOTH DEVICE WITH MICROSTRUCTURE, AND METHOD FOR PREPARING...
- Publication number 20230271825
- Publication date Aug 31, 2023
- RESEARCH INSTITUTE OF TSINGHUA UNIVERSITY IN SHENZHEN
- Quanshui ZHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME
- Publication number 20230163103
- Publication date May 25, 2023
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND APPARATUS FOR ELECTRONIC DEVICE PACKAGING
- Publication number 20230126914
- Publication date Apr 27, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jane Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSING MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20230076715
- Publication date Mar 9, 2023
- CHIP POSITION SYSTEM CO., LTD.
- RUEI CHI CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROFABRICATION OF OMNI-VIEW PERIPHERAL SCANNING SYSTEM
- Publication number 20230072948
- Publication date Mar 9, 2023
- Beijing Voyager Technology Co., Ltd.
- Youmin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING AN INTEGRATED SYSTEM INCLUDING A CAPACITIV...
- Publication number 20230061430
- Publication date Mar 2, 2023
- STMicroelectronics S.r.l.
- Paolo FERRARI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE
- Publication number 20230016038
- Publication date Jan 19, 2023
- Rohm Co., Ltd.
- Toru HIGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING FINE STRUCTURES IN THE VOLUME OF A SUBSTRATE C...
- Publication number 20220401953
- Publication date Dec 22, 2022
- SCHOTT AG
- Andreas Ortner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR BONDING WAFERS, AND A WAFER
- Publication number 20220289567
- Publication date Sep 15, 2022
- Murata Manufacturing Co., Ltd.
- Konsta HANNULA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20220274827
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A PLURALITY OF SENSOR DEVICES, AND SENSOR DEVICE
- Publication number 20220041436
- Publication date Feb 10, 2022
- ROBERT BOSCH GmbH
- Daniel Haug
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE ASSEMBLY AND METHOD OF BONDING SUBSTRATES
- Publication number 20220040691
- Publication date Feb 10, 2022
- TAIWAN GREEN POINT ENTERPRISES CO., LTD.
- Sung-Yi YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING DAMPER STRUCTURES ON A MICROMECHANICAL WAFER
- Publication number 20220024757
- Publication date Jan 27, 2022
- ROBERT BOSCH GmbH
- Michael Stumber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Package With Built-In Vibration Isolation, Thermal St...
- Publication number 20210403318
- Publication date Dec 30, 2021
- InvenSense, Inc.
- Hamid Eslampour
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL MEMBRANE TRANSDUCER WITH ACTIVE DAMPER
- Publication number 20210395075
- Publication date Dec 23, 2021
- STMicroelectronics S.r.l.
- Domenico GIUSTI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCLOSED CAVITY STRUCTURES
- Publication number 20210246018
- Publication date Aug 12, 2021
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCLOSED CAVITY STRUCTURES
- Publication number 20210246017
- Publication date Aug 12, 2021
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor Package and Method of Producing the Sensor Package
- Publication number 20210229981
- Publication date Jul 29, 2021
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NANO-PATTERNED SURFACES FOR MICROFLUIDIC DEVICES AND METHODS FOR MA...
- Publication number 20210213448
- Publication date Jul 15, 2021
- Corning Incorporated
- Donald Erwin Allen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCLOSED CAVITY STRUCTURES
- Publication number 20210198100
- Publication date Jul 1, 2021
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Emitter Package for a Photoacoustic Sensor
- Publication number 20210172862
- Publication date Jun 10, 2021
- INFINEON TECHNOLOGIES AG
- Siyuan Qi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSORS AND METHOD FOR FORMING A MEMS PRESSURE SENSOR
- Publication number 20210148776
- Publication date May 20, 2021
- INFINEON TECHNOLOGIES AG
- Markus ECKINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for bonding wafers, and a wafer

Method for producing a plurality of sensor devices, and sensor device

Sensor package and method of producing the sensor package

Method for producing fine structures in the volume of a substrate c...

Enclosed cavity structures

Laser-assisted material phase-change and expulsion micro-machining...

Semiconductor integrated device with electrical contacts between st...

Enclosed cavity structures

Microfabrication of omni-view peripheral scanning system

Enclosed cavity structures

Sensing module and manufacturing method thereof

Enclosed cavity structures

Method for producing damper structures on a micromechanical wafer

Micro-electro mechanical system and manufacturing method thereof

Semiconductor package with built-in vibration isolation, thermal st...

Enclosed cavity structures

Microelectromechanical membrane transducer with active damper

MEMS device with particle filter and method of manufacture

Substrate assembly and method of bonding substrates

Emitter package for a photoacoustic sensor

Packaged die and assembling method

Method for producing fine structures in the volume of a substrate c...

Microfluidic cartridge for processing and detecting nucleic acids

MEMS device, liquid ejecting head, liquid ejecting apparatus, manuf...

Die stack arrangement comprising a die-attach-film tape and method...

Sensor systems and methods for providing sensor systems

Fence structure to prevent stiction in a MEMS motion sensor

Three-dimensional micro devices and method for their production

Substrate assembly and method of bonding substrates

Method for making three dimensional structures using photolithograp...

Patents Applicationslast 30 patents

METHOD FOR PRODUCING FINE STRUCTURES IN THE VOLUME OF A SUBSTRATE C...

DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT

MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

INTEGRATED DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICO...

MICROELECTROMECHANICAL MEMBRANE TRANSDUCER WITH ACTIVE DAMPER

A MICROFLUIDIC SENSOR

ENCAPSULATION STRUCTURE, SUBSTRATE, AND ENCAPSULATION METHOD

MEMS with cover drive and method of operating the same

ATOMIC-SMOOTH DEVICE WITH MICROSTRUCTURE, AND METHOD FOR PREPARING...

STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME

METHODS AND APPARATUS FOR ELECTRONIC DEVICE PACKAGING

SENSING MODULE AND MANUFACTURING METHOD THEREOF

MICROFABRICATION OF OMNI-VIEW PERIPHERAL SCANNING SYSTEM

METHOD FOR MANUFACTURING AN INTEGRATED SYSTEM INCLUDING A CAPACITIV...

MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE

METHOD FOR PRODUCING FINE STRUCTURES IN THE VOLUME OF A SUBSTRATE C...

METHOD FOR BONDING WAFERS, AND A WAFER

MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

METHOD FOR PRODUCING A PLURALITY OF SENSOR DEVICES, AND SENSOR DEVICE

SUBSTRATE ASSEMBLY AND METHOD OF BONDING SUBSTRATES

METHOD FOR PRODUCING DAMPER STRUCTURES ON A MICROMECHANICAL WAFER

Semiconductor Package With Built-In Vibration Isolation, Thermal St...

MICROELECTROMECHANICAL MEMBRANE TRANSDUCER WITH ACTIVE DAMPER

ENCLOSED CAVITY STRUCTURES

ENCLOSED CAVITY STRUCTURES

Sensor Package and Method of Producing the Sensor Package

NANO-PATTERNED SURFACES FOR MICROFLUIDIC DEVICES AND METHODS FOR MA...

ENCLOSED CAVITY STRUCTURES

Emitter Package for a Photoacoustic Sensor

PRESSURE SENSORS AND METHOD FOR FORMING A MEMS PRESSURE SENSOR