Gold (Au) as principal constituent

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H01L2224/48644

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48644Gold (Au) as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency transmission line with finish plating on conductive...
- Patent number 11,984,423
- Issue date May 14, 2024
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier systems with control interface and bias circuit
- Patent number 11,451,199
- Issue date Sep 20, 2022
- Skyworks Solutions, Inc.
- David Steven Ripley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic component and method
- Patent number 11,380,612
- Issue date Jul 5, 2022
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, and motor device including the same
- Patent number 10,991,642
- Issue date Apr 27, 2021
- JOHNSON ELECTRIC INTERNATIONAL AG
- Chiping Sun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 10,944,046
- Issue date Mar 9, 2021
- Rohm Co., Ltd.
- Yuya Hasegawa
- G01 - MEASURING TESTING
Information Patent Grant
Radio frequency transmission line
- Patent number 10,937,759
- Issue date Mar 2, 2021
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including transistor with grading and semic...
- Patent number 10,771,024
- Issue date Sep 8, 2020
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,770,375
- Issue date Sep 8, 2020
- Renesas Electronics Corporation
- Jun Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,566,255
- Issue date Feb 18, 2020
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,535,812
- Issue date Jan 14, 2020
- Rohm Co., Ltd.
- Yuya Hasegawa
- G01 - MEASURING TESTING
Information Patent Grant
Mobile device with radio frequency transmission line
- Patent number 10,529,686
- Issue date Jan 7, 2020
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,510,731
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 10,224,470
- Issue date Mar 5, 2019
- Nichia Corporation
- Akinori Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,170,402
- Issue date Jan 1, 2019
- Renesas Electronics Corporation
- Yosuke Imazeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,157,893
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 10,134,648
- Issue date Nov 20, 2018
- Renesas Electronics Corporation
- Toshihiko Akiba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power amplifier modules with bonding pads and related systems, devi...
- Patent number 10,090,812
- Issue date Oct 2, 2018
- Skyworks Solutions, Inc.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component support and semiconductor device
- Patent number 10,068,821
- Issue date Sep 4, 2018
- Nichia Corporation
- Takeaki Shirase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive paste, and electrically conducive connectio...
- Patent number 10,046,418
- Issue date Aug 14, 2018
- Furukawa Electric Co., Ltd.
- Shunji Masumori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact pads with sidewall spacers and method of making contact pad...
- Patent number 10,049,994
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adding cap to copper passivation flow for electroless plating
- Patent number 10,026,706
- Issue date Jul 17, 2018
- Texas Instruments Incorporated
- Pragnesh R. Vaghela
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for high-speed signal line
- Patent number 9,972,595
- Issue date May 15, 2018
- Tanaka Denshi Kogyo K.K.
- Yuki Antoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED leadframe or LED substrate, semiconductor device, and method fo...
- Patent number 9,966,517
- Issue date May 8, 2018
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered conductive matrix material on wire bond
- Patent number 9,905,502
- Issue date Feb 27, 2018
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules with power amplifier and transmission line...
- Patent number 9,887,668
- Issue date Feb 6, 2018
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
LED leadframe or LED substrate, semiconductor device, and method fo...
- Patent number 9,887,331
- Issue date Feb 6, 2018
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency integrated circuit module
- Patent number 9,859,231
- Issue date Jan 2, 2018
- Skyworks Solutions, Inc.
- Weimin Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Power amplifier modules with harmonic termination circuit and relat...
- Patent number 9,847,755
- Issue date Dec 19, 2017
- Skyworks Solutions, Inc.
- Weimin Sun
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240021550
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240021551
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240006354
- Publication date Jan 4, 2024
- RENESAS ELECTRONICS CORPORATION
- Shota OKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POP STRUCTURE OF THREE-DIMENSIONAL FAN-OUT MEMORY AND PACKAGING MET...
- Publication number 20230352450
- Publication date Nov 2, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, AND MOTOR DEVICE INCLUDING THE SAME
- Publication number 20210210417
- Publication date Jul 8, 2021
- Johnson Electric International AG
- Chiping SUN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RADIO FREQUENCY TRANSMISSION LINE WITH FINISH PLATING ON CONDUCTIVE...
- Publication number 20210159209
- Publication date May 27, 2021
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200399118
- Publication date Dec 24, 2020
- DENSO CORPORATION
- Yutaka HAYAKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200091416
- Publication date Mar 19, 2020
- ROHM CO., LTD.
- Yuya Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190348332
- Publication date Nov 14, 2019
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190259687
- Publication date Aug 22, 2019
- RENESAS ELECTRONICS CORPORATION
- Jun SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, AND MOTOR DEVICE INCLUDING THE SAME
- Publication number 20190244880
- Publication date Aug 8, 2019
- Johnson Electric International AG
- Chiping SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190074431
- Publication date Mar 7, 2019
- ROHM CO., LTD.
- Yuya Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20190057913
- Publication date Feb 21, 2019
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING
- Publication number 20180308816
- Publication date Oct 25, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Pragnesh R. Vaghela
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20180047709
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER FOR RADIO FREQUENCY TRANSMISSION LINE
- Publication number 20170271303
- Publication date Sep 21, 2017
- SKYWORKS SOLUTIONS, INC.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY TRANSMISSION LINE
- Publication number 20170271301
- Publication date Sep 21, 2017
- SKYWORKS SOLUTIONS, INC.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOBILE DEVICE WITH RADIO FREQUENCY TRANSMISSION LINE
- Publication number 20170271302
- Publication date Sep 21, 2017
- SKYWORKS SOLUTIONS, INC.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...
- Publication number 20170257070
- Publication date Sep 7, 2017
- SKYWORKS SOLUTIONS, INC.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES WITH HARMONIC TERMINATION CIRCUIT AND RELA...
- Publication number 20160380594
- Publication date Dec 29, 2016
- SKYWORKS SOLUTIONS, INC.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND MET...
- Publication number 20160380602
- Publication date Dec 29, 2016
- SKYWORKS SOLUTIONS, INC.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY INTEGRATED CIRCUIT AND PACKAGING FOR SAME
- Publication number 20160190075
- Publication date Jun 30, 2016
- Analog Devices, Inc.
- Andrew Pye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING USING ELEVATED BUMPS FOR SECURING BONDS
- Publication number 20160064351
- Publication date Mar 3, 2016
- SKYWORKS SOLUTIONS, INC.
- Aldrin Quinones GARING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT HAVING A CORROSION-PROTECTED BONDING CONNECTIO...
- Publication number 20150137391
- Publication date May 21, 2015
- ROBERT BOSCH GmbH
- Fabian Bez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH LEAD OF VARYING THICKNESS
- Publication number 20140367838
- Publication date Dec 18, 2014
- Donald Charles Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Methods and Packaged Semiconductor Devices
- Publication number 20140367867
- Publication date Dec 18, 2014
- Wei-Hung Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140361299
- Publication date Dec 11, 2014
- Toshihiko Akiba
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20140353809
- Publication date Dec 4, 2014
- RENESAS ELECTRONICS CORPORATION
- Akito Shimizu
- H01 - BASIC ELECTRIC ELEMENTS

Gold (Au) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power amplifier modules including semiconductor resistor and tantal...

Radio frequency transmission line with finish plating on conductive...

Power amplifier systems with control interface and bias circuit

Semiconductor device, electronic component and method

Integrated circuit, and motor device including the same

Semiconductor device

Radio frequency transmission line

Semiconductor integrated circuit device

Power amplifier modules including transistor with grading and semic...

Semiconductor device

Method of manufacturing semiconductor device

Semiconductor device

Mobile device with radio frequency transmission line

Package-on-package (PoP) structure including stud bulbs

Light emitting device

Semiconductor device

Package-on-package (PoP) structure including stud bulbs

Manufacturing method of semiconductor device

Power amplifier modules with bonding pads and related systems, devi...

Semiconductor component support and semiconductor device

Electrically conductive paste, and electrically conducive connectio...

Contact pads with sidewall spacers and method of making contact pad...

Adding cap to copper passivation flow for electroless plating

Bonding wire for high-speed signal line

LED leadframe or LED substrate, semiconductor device, and method fo...

Sintered conductive matrix material on wire bond

Power amplifier modules with power amplifier and transmission line...

LED leadframe or LED substrate, semiconductor device, and method fo...

Radio frequency integrated circuit module

Power amplifier modules with harmonic termination circuit and relat...

Patents Applicationslast 30 patents

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

POP STRUCTURE OF THREE-DIMENSIONAL FAN-OUT MEMORY AND PACKAGING MET...

INTEGRATED CIRCUIT, AND MOTOR DEVICE INCLUDING THE SAME

RADIO FREQUENCY TRANSMISSION LINE WITH FINISH PLATING ON CONDUCTIVE...

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT, AND MOTOR DEVICE INCLUDING THE SAME

Package-On-Package (PoP) Structure Including Stud Bulbs

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING

Package-On-Package (PoP) Structure Including Stud Bulbs

DIFFUSION BARRIER LAYER FOR RADIO FREQUENCY TRANSMISSION LINE

RADIO FREQUENCY TRANSMISSION LINE

MOBILE DEVICE WITH RADIO FREQUENCY TRANSMISSION LINE

POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...

POWER AMPLIFIER MODULES WITH HARMONIC TERMINATION CIRCUIT AND RELA...

POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND MET...

HIGH FREQUENCY INTEGRATED CIRCUIT AND PACKAGING FOR SAME

WIRE BONDING USING ELEVATED BUMPS FOR SECURING BONDS

ELECTRONIC COMPONENT HAVING A CORROSION-PROTECTED BONDING CONNECTIO...

LEADFRAME WITH LEAD OF VARYING THICKNESS

Packaging Methods and Packaged Semiconductor Devices

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE