Gold [Au] as principal constituent

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H01L2224/80444

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80444Gold [Au] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device and method of manufacturing electronic device
- Patent number 12,211,811
- Issue date Jan 28, 2025
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,075,155
- Issue date Jul 27, 2021
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosonically bonded connection for flip chip packages
- Patent number 10,741,415
- Issue date Aug 11, 2020
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic level bonding for electronics packaging
- Patent number 8,754,512
- Issue date Jun 17, 2014
- Delphi Technologies, Inc.
- Ralph S. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible micro-system and fabrication method thereof
- Patent number 8,481,364
- Issue date Jul 9, 2013
- National Chiao Tung University
- Tzu-Yuan Chao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240332247
- Publication date Oct 3, 2024
- Nichia Corporation.
- Hiroaki KAGEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING
- Publication number 20240222298
- Publication date Jul 4, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D System and Wafer Reconstitution with Mid-layer Interposer
- Publication number 20240105699
- Publication date Mar 28, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20230154877
- Publication date May 18, 2023
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200051902
- Publication date Feb 13, 2020
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LEVEL BONDING FOR ELECTRONICS PACKAGING
- Publication number 20140151864
- Publication date Jun 5, 2014
- Delphi Technologies, Inc.
- Ralph S. TAYLOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME
- Publication number 20140145328
- Publication date May 29, 2014
- Georgia Tech Research Corporation
- Rao Tummala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE MICRO-SYSTEM AND FABRICATION METHOD THEREOF
- Publication number 20130234314
- Publication date Sep 12, 2013
- NATIONAL CHIAO TUNG UNIVERSITY
- TZU-YUAN CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE MICRO-SYSTEM AND FABRICATION METHOD THEREOF
- Publication number 20120032320
- Publication date Feb 9, 2012
- National Chiao Tung University
- TZU-YUAN CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS

Gold [Au] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device and method of manufacturing electronic device

Package structure and manufacturing method thereof

Thermosonically bonded connection for flip chip packages

Atomic level bonding for electronics packaging

Electronic component mounting structure

Flexible micro-system and fabrication method thereof

Patents Applicationslast 30 patents

LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING SAME

TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING

3D System and Wafer Reconstitution with Mid-layer Interposer

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ATOMIC LEVEL BONDING FOR ELECTRONICS PACKAGING

INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME

FLEXIBLE MICRO-SYSTEM AND FABRICATION METHOD THEREOF

FLEXIBLE MICRO-SYSTEM AND FABRICATION METHOD THEREOF

ELECTRONIC COMPONENT MOUNTING STRUCTURE