Gold [Au] as principal constituent

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H01L2224/13344

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13344Gold [Au] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,930,609
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element and electronic device comprising the same
- Patent number 10,825,787
- Issue date Nov 3, 2020
- Innolux Corporation
- Wei-Cheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,692,829
- Issue date Jun 23, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,607,956
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with barrier layer
- Patent number 10,593,621
- Issue date Mar 17, 2020
- Shinko Electric Industries Co., Ltd.
- Keigo Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, film adhesive, adhesive sheet, ad...
- Patent number 10,428,253
- Issue date Oct 1, 2019
- Hitachi Chemical Company, Ltd.
- Tomonori Minegishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing metal powder
- Patent number 10,130,995
- Issue date Nov 20, 2018
- Alpha Assembly Solutions Inc.
- Nirmalya Kumar Chaki
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,090,231
- Issue date Oct 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,966,322
- Issue date May 8, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hisao Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming pillar bumps on semiconductor wafers
- Patent number 9,831,201
- Issue date Nov 28, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,793,198
- Issue date Oct 17, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component built-in board and method of manufacturing the same, and...
- Patent number 9,591,767
- Issue date Mar 7, 2017
- Fujikura Ltd.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-mounted structure, IC card and COF package
- Patent number 9,516,749
- Issue date Dec 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshiyuki Wada
- G02 - OPTICS
Information Patent Grant
Semiconductor package having a cap unit with concave portion and me...
- Patent number 9,299,627
- Issue date Mar 29, 2016
- Kabushiki Kaisha Toshiba
- Toshihiko Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making bumpless flipchip interco...
- Patent number 9,240,331
- Issue date Jan 19, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of mounting part of semiconductor light emitti...
- Patent number 8,609,444
- Issue date Dec 17, 2013
- Toyoda Gosei Co., Ltd.
- Satoshi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder and electrically conductive adhesive based interconnection f...
- Patent number 8,592,299
- Issue date Nov 26, 2013
- Endicott Interconnect Technologies, Inc.
- Voya R. Markovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,563,397
- Issue date Oct 22, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Akihiro Chida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal structure and manufacturing method thereof, and electronic...
- Patent number 8,345,435
- Issue date Jan 1, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Toshiji Hamatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulated semiconductor chip with external contact pads and manu...
- Patent number 8,338,231
- Issue date Dec 25, 2012
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal nanoink and process for producing the metal nanoink, and die...
- Patent number 8,328,928
- Issue date Dec 11, 2012
- Shinkawa Ltd.
- Toru Maeda
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 7,871,917
- Issue date Jan 18, 2011
- Fujitsu Semiconductor Limited
- Joji Fujimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding
- Patent number 7,789,287
- Issue date Sep 7, 2010
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,629,687
- Issue date Dec 8, 2009
- Panasonic Corporation
- Yukihiro Kozaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure using conductive adhesives, and a manufacturing me...
- Patent number 7,157,800
- Issue date Jan 2, 2007
- Ricoh Company, Ltd.
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, mounting circuit board, method of producing t...
- Patent number 6,909,180
- Issue date Jun 21, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A SOLDER BUMP STRUCTURE
- Publication number 20200152590
- Publication date May 14, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A SOLDER BUMP STRUCTURE
- Publication number 20200058612
- Publication date Feb 20, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
FORMATION OF CONDUCTIVE CIRCUIT
- Publication number 20140374005
- Publication date Dec 25, 2014
- Shin-Etsu Chemical Co., Ltd.
- Yoshitaka Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...
- Publication number 20140328032
- Publication date Nov 6, 2014
- INFINEON TECHNOLOGIES AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20140268574
- Publication date Sep 18, 2014
- FUJIKURA LTD.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140210066
- Publication date Jul 31, 2014
- KABUSHIKI KAISHA TOSHIBA
- Toshihiko Nagano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Bumpless Flipchip Interco...
- Publication number 20140175661
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140061920
- Publication date Mar 6, 2014
- PANASONIC CORPORATION
- Hiroshige HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...
- Publication number 20130001280
- Publication date Jan 3, 2013
- SHINKAWA LTD.
- Toru MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20120319289
- Publication date Dec 20, 2012
- Shinko Electric Industries Co., Ltd.
- Kenichi MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated Semiconductor Chip with External Contact Pads and Manu...
- Publication number 20110233754
- Publication date Sep 29, 2011
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...
- Publication number 20110114708
- Publication date May 19, 2011
- SHINKAWAL LTD
- Toru Maeda
- B22 - CASTING POWDER METALLURGY
Information Patent Application
TERMINAL STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20110032684
- Publication date Feb 10, 2011
- Semiconductor Energy Laboratory Co., Ltd.
- Toshiji HAMATANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of mounting part of semiconductor light emitti...
- Publication number 20100219444
- Publication date Sep 2, 2010
- Toyoda Gosei Co., Ltd.
- Satoshi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100171221
- Publication date Jul 8, 2010
- Akihiro CHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20090246474
- Publication date Oct 1, 2009
- Panasonic Corporation
- Daisuke Sakurai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF BONDING
- Publication number 20090230172
- Publication date Sep 17, 2009
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical display package and the method thereof
- Publication number 20070241435
- Publication date Oct 18, 2007
- Wintek Corporation
- Chih-Yuan Wang
- G02 - OPTICS
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20070197016
- Publication date Aug 23, 2007
- FUJITSU LIMITED
- Joji Fujimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20070108627
- Publication date May 17, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro KOZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit substrate for packaging semiconductor device, method for pr...
- Publication number 20050163982
- Publication date Jul 28, 2005
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonded structure using conductive adhesives, and a manufacturing me...
- Publication number 20050062168
- Publication date Mar 24, 2005
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, mounting circuit board, method of producing t...
- Publication number 20030049425
- Publication date Mar 13, 2003
- Masahiro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method form producing micro bump
- Publication number 20020076912
- Publication date Jun 20, 2002
- Shinichi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Gold [Au] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming a solder bump structure

Electronic element and electronic device comprising the same

Method of forming a solder bump structure

Engineered polymer-based electronic materials

Method of forming a solder bump structure

Semiconductor device with barrier layer

Photosensitive resin composition, film adhesive, adhesive sheet, ad...

Conductive connecting member and manufacturing method of same

Method for producing metal ball, joining material, and metal ball

Method for manufacturing metal powder

Conductive connections, structures with such connections, and metho...

Semiconductor device

Methods for forming pillar bumps on semiconductor wafers

Conductive connections, structures with such connections, and metho...

Electrode connection structure and electrode connection method

Component built-in board and method of manufacturing the same, and...

Electronic component-mounted structure, IC card and COF package

Semiconductor package having a cap unit with concave portion and me...

Semiconductor device and method of making bumpless flipchip interco...

Manufacturing method of mounting part of semiconductor light emitti...

Solder and electrically conductive adhesive based interconnection f...

Semiconductor device and manufacturing method thereof

Terminal structure and manufacturing method thereof, and electronic...

Encapsulated semiconductor chip with external contact pads and manu...

Metal nanoink and process for producing the metal nanoink, and die...

Semiconductor device and manufacturing method for the same

Method of bonding

Semiconductor device and method for manufacturing the same

Bonded structure using conductive adhesives, and a manufacturing me...

Semiconductor device, mounting circuit board, method of producing t...

Patents Applicationslast 30 patents

METHOD OF FORMING A SOLDER BUMP STRUCTURE

METHOD OF FORMING A SOLDER BUMP STRUCTURE

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

FORMATION OF CONDUCTIVE CIRCUIT

CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...

COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Method of Making Bumpless Flipchip Interco...

SEMICONDUCTOR DEVICE

METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

SEMICONDUCTOR PACKAGE

Encapsulated Semiconductor Chip with External Contact Pads and Manu...

METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...

TERMINAL STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

Manufacturing method of mounting part of semiconductor light emitti...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING...

METHOD OF BONDING

Optical display package and the method thereof

Semiconductor device and manufacturing method for the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Circuit substrate for packaging semiconductor device, method for pr...

Bonded structure using conductive adhesives, and a manufacturing me...

Semiconductor device, mounting circuit board, method of producing t...

Method form producing micro bump