Guiding structures both on and outside the body

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H01L2224/80141

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80141Guiding structures both on and outside the body

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Patents Grantslast 30 patents

Information Patent Grant
Method for wafer-level semiconductor die attachment
- Patent number 10,217,718
- Issue date Feb 26, 2019
- Denselight Semiconductors Pte Ltd
- Yee Loy Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of semiconductor structures and corresponding manufacturing m...
- Patent number 9,093,456
- Issue date Jul 28, 2015
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of semiconductor structures and corresponding manufacturing m...
- Patent number 8,907,481
- Issue date Dec 9, 2014
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated structure capable of detecting a tempe...
- Patent number 8,890,276
- Issue date Nov 18, 2014
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor chip having TSV (through silicon via) and stacked ass...
- Patent number 7,838,967
- Issue date Nov 23, 2010
- Powertech Technology Inc.
- Ming-Yao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and associated fabrication method
- Patent number 5,753,536
- Issue date May 19, 1998
- Matsushita Electric Industrial Co., Ltd.
- Tatsuo Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHODS FOR MULTI-SCALE ALIGNMENT AND FASTENING
- Publication number 20140090234
- Publication date Apr 3, 2014
- University of Massachusetts
- David Kazmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED STRUCTURE CAPABLE OF DETECTING A TEMPE...
- Publication number 20140015088
- Publication date Jan 16, 2014
- Laurent-Luc Chapelon
- G01 - MEASURING TESTING
Information Patent Application
STACK OF SEMICONDUCTOR STRUCTURES AND CORRESPONDING MANUFACTURING M...
- Publication number 20130292823
- Publication date Nov 7, 2013
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING TSV (THROUGH SILICON VIA) AND STACKED ASS...
- Publication number 20090267194
- Publication date Oct 29, 2009
- Powertech Technology Inc.
- Ming-Yao CHEN
- H01 - BASIC ELECTRIC ELEMENTS