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H01L2224/81139

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81139Guiding structures on the body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillars as stops for precise chip-to-chip separation
- Patent number 12,142,590
- Issue date Nov 12, 2024
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device interconnection systems and methods
- Patent number 11,916,039
- Issue date Feb 27, 2024
- Teledyne FLIR Commercial Systems, Inc.
- Richard E. Bornfreund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillars as stops for precise chip-to-chip separation
- Patent number 11,842,973
- Issue date Dec 12, 2023
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Aligned core balls for interconnect joint stability
- Patent number 11,735,551
- Issue date Aug 22, 2023
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip transfer method, display device, chip and target substrate
- Patent number 11,616,043
- Issue date Mar 28, 2023
- BOE Technology Group Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillars as stops for precise chip-to-chip separation
- Patent number 11,574,885
- Issue date Feb 7, 2023
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,569,190
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic-assisted solder transfer
- Patent number 11,541,472
- Issue date Jan 3, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 11,488,882
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit (3DIC) with support structures
- Patent number 11,424,194
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 10,923,447
- Issue date Feb 16, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 10,867,957
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,867,952
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with underfill control features, and associat...
- Patent number 10,784,224
- Issue date Sep 22, 2020
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 10,741,467
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,720,402
- Issue date Jul 21, 2020
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 10,692,832
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit (3DIC) with support structures
- Patent number 10,510,684
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 10,490,474
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder in cavity interconnection structures
- Patent number 10,468,367
- Issue date Nov 5, 2019
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with underfill control features, and associat...
- Patent number 10,424,553
- Issue date Sep 24, 2019
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with temperature sensor traces
- Patent number 10,260,961
- Issue date Apr 16, 2019
- Intel Corporation
- Shelby Ferguson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 10,115,650
- Issue date Oct 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming dummy pillars between se...
- Patent number 10,096,540
- Issue date Oct 9, 2018
- STATS ChipPAC Pte. Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer having a pattern of sites for mounting chiplets
- Patent number 10,090,236
- Issue date Oct 2, 2018
- Advanced Micro Devices, Inc.
- Nuwan S. Jayasena
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 10,024,907
- Issue date Jul 17, 2018
- TOSHIBA MEMORY CORPORATION
- Shinya Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized solder pads for microelectronic components
- Patent number 10,014,274
- Issue date Jul 3, 2018
- International Business Machines Corporation
- Tymon Barwicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,008,467
- Issue date Jun 26, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package alignment frame for local reflow
- Patent number 9,991,223
- Issue date Jun 5, 2018
- Intel Corporation
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240312940
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wei TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
- Publication number 20240162179
- Publication date May 16, 2024
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...
- Publication number 20240153908
- Publication date May 9, 2024
- HKC Corporation Limited
- YANG PU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
- Publication number 20230187401
- Publication date Jun 15, 2023
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING
- Publication number 20230058638
- Publication date Feb 23, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECTION SYSTEMS AND METHODS
- Publication number 20220115354
- Publication date Apr 14, 2022
- FLIR Commercial Systems, Inc.
- Richard E. BORNFREUND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC-ASSISTED SOLDER TRANSFER
- Publication number 20210229203
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
- Publication number 20210167030
- Publication date Jun 3, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFER METHOD, DISPLAY DEVICE, CHIP AND TARGET SUBSTRATE
- Publication number 20210134755
- Publication date May 6, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210091031
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNED CORE BALLS FOR INTERCONNECT JOINT STABILITY
- Publication number 20200312803
- Publication date Oct 1, 2020
- Intel Corporation
- Jimin YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200286846
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
- Publication number 20200176409
- Publication date Jun 4, 2020
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Die-on-Interposer Assembly with Dam Structure and Method of Manufac...
- Publication number 20200035578
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...
- Publication number 20190371755
- Publication date Dec 5, 2019
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANGLED DIE SEMICONDUCTOR DEVICE
- Publication number 20180342483
- Publication date Nov 29, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20180308817
- Publication date Oct 25, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER IN CAVITY INTERCONNECTION STRUCTURES
- Publication number 20180151529
- Publication date May 31, 2018
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...
- Publication number 20180122762
- Publication date May 3, 2018
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ALIGNMENT FRAME FOR LOCAL REFLOW
- Publication number 20170179067
- Publication date Jun 22, 2017
- Intel Corporation
- RUSSELL S. AOKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170148760
- Publication date May 25, 2017
- SONY CORPORATION
- MAKOTO MURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED SOLDER PADS FOR MICROELECTRONIC COMPONENTS
- Publication number 20170141072
- Publication date May 18, 2017
- International Business Machines Corporation
- Tymon Barwicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE HAVING...
- Publication number 20160336287
- Publication date Nov 17, 2016
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE DEVICE ASSEMBLY
- Publication number 20140376200
- Publication date Dec 25, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BUMPS AND DISPLAY DEVICE MODULE INCORPORA...
- Publication number 20140361429
- Publication date Dec 11, 2014
- Renesas SP Drivers Inc.
- Hisao Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140357025
- Publication date Dec 4, 2014
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20140246783
- Publication date Sep 4, 2014
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER IN CAVITY INTERCONNECTION TECHNOLOGY
- Publication number 20140240943
- Publication date Aug 28, 2014
- Chuan Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP STACK WITH ELECTRICALLY INSULATING WALLS
- Publication number 20140206143
- Publication date Jul 24, 2014
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20140206145
- Publication date Jul 24, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS

Guiding structures on the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device assembly with die support structures

Pillars as stops for precise chip-to-chip separation

Semiconductor device interconnection systems and methods

Pillars as stops for precise chip-to-chip separation

Aligned core balls for interconnect joint stability

Chip transfer method, display device, chip and target substrate

Pillars as stops for precise chip-to-chip separation

Semiconductor structure and manufacturing method thereof

Ultrasonic-assisted solder transfer

Die-on-interposer assembly with dam structure and method of manufac...

Three dimensional integrated circuit (3DIC) with support structures

Semiconductor device assembly with die support structures

Mechanisms for forming hybrid bonding structures with elongated bumps

Semiconductor structure and manufacturing method thereof

Semiconductor devices with underfill control features, and associat...

Die-on-interposer assembly with dam structure and method of manufac...

Semiconductor device and method of manufacturing the same

Manufacturing method of semiconductor structure

Three dimensional integrated circuit (3DIC) with support structures

Die-on-interposer assembly with dam structure and method of manufac...

Solder in cavity interconnection structures

Semiconductor devices with underfill control features, and associat...

Integrated circuit packages with temperature sensor traces

Die-on-interposer assembly with dam structure and method of manufac...

Semiconductor device and method of forming dummy pillars between se...

Interposer having a pattern of sites for mounting chiplets

Semiconductor device and manufacturing method of semiconductor device

Optimized solder pads for microelectronic components

Semiconductor structure and manufacturing method thereof

Semiconductor package alignment frame for local reflow

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION

DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...

PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION

SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING

SEMICONDUCTOR DEVICE INTERCONNECTION SYSTEMS AND METHODS

ULTRASONIC-ASSISTED SOLDER TRANSFER

SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES

CHIP TRANSFER METHOD, DISPLAY DEVICE, CHIP AND TARGET SUBSTRATE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

ALIGNED CORE BALLS FOR INTERCONNECT JOINT STABILITY

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION

Die-on-Interposer Assembly with Dam Structure and Method of Manufac...

SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...

ANGLED DIE SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

SOLDER IN CAVITY INTERCONNECTION STRUCTURES

SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...

SEMICONDUCTOR PACKAGE ALIGNMENT FRAME FOR LOCAL REFLOW

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

OPTIMIZED SOLDER PADS FOR MICROELECTRONIC COMPONENTS

SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE HAVING...

RELIABLE DEVICE ASSEMBLY

SEMICONDUCTOR DEVICE WITH BUMPS AND DISPLAY DEVICE MODULE INCORPORA...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

SOLDER IN CAVITY INTERCONNECTION TECHNOLOGY

CHIP STACK WITH ELECTRICALLY INSULATING WALLS

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...