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H01L2224/83139

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83139Guiding structures on the body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,119,337
- Issue date Oct 15, 2024
- Kioxia Corporation
- Junichi Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,658,169
- Issue date May 23, 2023
- Kioxia Corporation
- Junichi Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module comprising two substrates and method of manufacturing...
- Patent number 11,574,889
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Ottmar Geitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-pillar assisted semiconductor bonding
- Patent number 10,319,693
- Issue date Jun 11, 2019
- Skorpios Technologies, Inc.
- Damien Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module and electronic apparatus to lower risk of breakage of...
- Patent number 10,236,312
- Issue date Mar 19, 2019
- Sony Corporation
- Yusuke Mada
- G02 - OPTICS
Information Patent Grant
Film, method for its production, and method for producing semicondu...
- Patent number 10,141,204
- Issue date Nov 27, 2018
- AGC Inc.
- Seigo Kotera
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Bonding method for connecting two wafers
- Patent number 10,134,707
- Issue date Nov 20, 2018
- Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung E.V.
- Kai Zoschke
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor packages
- Patent number 9,917,071
- Issue date Mar 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Ying-Ta Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Opto-electronic apparatus and manufacturing method thereof
- Patent number 9,831,228
- Issue date Nov 28, 2017
- Ultra Display Technology Corp.
- Yung-Yu Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge coupling alignment using embedded features
- Patent number 9,583,684
- Issue date Feb 28, 2017
- Intel Corporation
- Brian H. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale package for high power devices
- Patent number 9,559,068
- Issue date Jan 31, 2017
- Infineon Technologies Americas Corp.
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module package and method of manufacturing the same
- Patent number 9,524,929
- Issue date Dec 20, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,401,319
- Issue date Jul 26, 2016
- Mitsubishi Electric Corporation
- Takuya Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bumps and display device module incorpora...
- Patent number 9,385,096
- Issue date Jul 5, 2016
- SYNAPTICS DISPLAY DEVICES GK
- Hisao Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Drive chip and display apparatus
- Patent number 9,318,454
- Issue date Apr 19, 2016
- Sharp Kabushiki Kaisha
- Takashi Matsui
- G02 - OPTICS
Information Patent Grant
Method of joining semiconductor substrate
- Patent number 9,312,227
- Issue date Apr 12, 2016
- Hyundai Motor Company
- Ilseon Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed wafer packages
- Patent number 9,287,237
- Issue date Mar 15, 2016
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure, alignment structure, and alignment...
- Patent number 9,230,918
- Issue date Jan 5, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Ying Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge coupling alignment using embedded features
- Patent number 9,209,369
- Issue date Dec 8, 2015
- Intel Corporation
- Brian H. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 9,187,312
- Issue date Nov 17, 2015
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 9,174,836
- Issue date Nov 3, 2015
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed wafer packages
- Patent number 8,975,105
- Issue date Mar 10, 2015
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having internal shunt and solder stop dimples
- Patent number 8,928,115
- Issue date Jan 6, 2015
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for high power devices
- Patent number 8,836,112
- Issue date Sep 16, 2014
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grown carbon nanotube die attach structures, articles, devices, and...
- Patent number 8,753,924
- Issue date Jun 17, 2014
- Texas Instruments Incorporated
- James Cooper Wainerdi
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 8,736,045
- Issue date May 27, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fastening device
- Patent number 8,669,662
- Issue date Mar 11, 2014
- Micronas GmbH
- Christoph Wilbertz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device assembly utilizing a DBC substrate
- Patent number 8,604,611
- Issue date Dec 10, 2013
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for high power devices
- Patent number 8,569,883
- Issue date Oct 29, 2013
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with chip mounted on a substrate
- Patent number 8,410,595
- Issue date Apr 2, 2013
- Qimonda AG
- Steffen Kroehnert
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bonding Structure
- Publication number 20240312955
- Publication date Sep 19, 2024
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230282633
- Publication date Sep 7, 2023
- KIOXIA Corporation
- Junichi SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING ELEMENT ALIGNMENT
- Publication number 20230268457
- Publication date Aug 24, 2023
- Lumileds LLC
- Michael DECKERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210296299
- Publication date Sep 23, 2021
- KIOXIA Corporation
- Junichi SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180277518
- Publication date Sep 27, 2018
- RENESAS ELECTRONICS CORPORATION
- Tetsuya IIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM, METHOD FOR ITS PRODUCTION, AND METHOD FOR PRODUCING SEMICONDU...
- Publication number 20170323805
- Publication date Nov 9, 2017
- Asahi Glass Company, Limited
- Seigo KOTERA
- B32 - LAYERED PRODUCTS
Information Patent Application
OPTO-ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20170170160
- Publication date Jun 15, 2017
- ULTRA DISPLAY TECHNOLOGY CORP.
- Yung-Yu YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE, ALIGNMENT STRUCTURE, AND ALIGNMENT...
- Publication number 20160005694
- Publication date Jan 7, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Ying CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF JOINING SEMICONDUCTOR SUBSTRATE
- Publication number 20150187704
- Publication date Jul 2, 2015
- Hyundai Motor Company
- Ilseon Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BUMPS AND DISPLAY DEVICE MODULE INCORPORA...
- Publication number 20140361429
- Publication date Dec 11, 2014
- Renesas SP Drivers Inc.
- Hisao Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power module comprising two substrates and method of manufacturing...
- Publication number 20140353818
- Publication date Dec 4, 2014
- Ottmar GEITNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140346643
- Publication date Nov 27, 2014
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140193948
- Publication date Jul 10, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EDGE COUPLING ALIGNMENT USING EMBEDDED FEATURES
- Publication number 20140175477
- Publication date Jun 26, 2014
- Brian H. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140124899
- Publication date May 8, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Package for High Power Devices
- Publication number 20140048923
- Publication date Feb 20, 2014
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140042616
- Publication date Feb 13, 2014
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130307130
- Publication date Nov 21, 2013
- MITSUBISHI ELECTRIC CORPORATION
- Takuya Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROWN CARBON NANOTUBE DIE ATTACH STRUCTURES, ARTICLES, DEVICES, AND...
- Publication number 20130234313
- Publication date Sep 12, 2013
- TEXAS INSTRUMENTS INCORPORATED
- James Cooper Wainerdi
- B82 - NANO-TECHNOLOGY
Information Patent Application
Semiconductor Package Having Internal Shunt and Solder Stop Dimples
- Publication number 20130147016
- Publication date Jun 13, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Assembly Utilizing a DBC Substrate
- Publication number 20130140684
- Publication date Jun 6, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FASTENING DEVICE
- Publication number 20130140702
- Publication date Jun 6, 2013
- Micronas GmbH
- Christoph WILBERTZ
- G01 - MEASURING TESTING
Information Patent Application
HERMETICALLY SEALED WAFER PACKAGES
- Publication number 20120319261
- Publication date Dec 20, 2012
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package for High Power Devices
- Publication number 20120001316
- Publication date Jan 5, 2012
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Scale Package for High Power Devices
- Publication number 20110316086
- Publication date Dec 29, 2011
- International Rectifier Corporation
- Henning M. Hauenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CHIP AND SUBSTRATE PROVIDING INSULATION PROTECTION BETWE...
- Publication number 20110103034
- Publication date May 5, 2011
- Yao-Sheng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTICHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110089575
- Publication date Apr 21, 2011
- Samsung Electronics Co., Ltd.
- In LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20090215230
- Publication date Aug 27, 2009
- RENESAS TECHNOLOGY CORP.
- Akira MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20090153765
- Publication date Jun 18, 2009
- Sharp Kabushiki Kaisha
- Kenichi Yamashita
- G02 - OPTICS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20090096111
- Publication date Apr 16, 2009
- Elpida Memory, Inc.
- Reiko Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS

Guiding structures on the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing a semiconductor device

Semiconductor device

Power module comprising two substrates and method of manufacturing...

Micro-pillar assisted semiconductor bonding

Camera module and electronic apparatus to lower risk of breakage of...

Film, method for its production, and method for producing semicondu...

Bonding method for connecting two wafers

Semiconductor packages

Opto-electronic apparatus and manufacturing method thereof

Edge coupling alignment using embedded features

Wafer scale package for high power devices

Semiconductor module package and method of manufacturing the same

Semiconductor device

Semiconductor device with bumps and display device module incorpora...

Drive chip and display apparatus

Method of joining semiconductor substrate

Hermetically sealed wafer packages

Semiconductor package structure, alignment structure, and alignment...

Edge coupling alignment using embedded features

Integrated bondline spacers for wafer level packaged circuit devices

Integrated bondline spacers for wafer level packaged circuit devices

Hermetically sealed wafer packages

Semiconductor package having internal shunt and solder stop dimples

Semiconductor package for high power devices

Grown carbon nanotube die attach structures, articles, devices, and...

Integrated bondline spacers for wafer level packaged circuit devices

Fastening device

Semiconductor device assembly utilizing a DBC substrate

Package for high power devices

Semiconductor device with chip mounted on a substrate

Patents Applicationslast 30 patents

Bonding Structure

SEMICONDUCTOR DEVICE

LIGHTING ELEMENT ALIGNMENT

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FILM, METHOD FOR ITS PRODUCTION, AND METHOD FOR PRODUCING SEMICONDU...

OPTO-ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE, ALIGNMENT STRUCTURE, AND ALIGNMENT...

METHOD OF JOINING SEMICONDUCTOR SUBSTRATE

SEMICONDUCTOR DEVICE WITH BUMPS AND DISPLAY DEVICE MODULE INCORPORA...

Power module comprising two substrates and method of manufacturing...

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

EDGE COUPLING ALIGNMENT USING EMBEDDED FEATURES

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

Semiconductor Package for High Power Devices

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

GROWN CARBON NANOTUBE DIE ATTACH STRUCTURES, ARTICLES, DEVICES, AND...

Semiconductor Package Having Internal Shunt and Solder Stop Dimples

Semiconductor Device Assembly Utilizing a DBC Substrate

FASTENING DEVICE

HERMETICALLY SEALED WAFER PACKAGES

Package for High Power Devices

Wafer Scale Package for High Power Devices

ELECTRONIC CHIP AND SUBSTRATE PROVIDING INSULATION PROTECTION BETWE...

MULTICHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

WIRING SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME

Semiconductor device and method of manufacturing the same