Guiding structures outside the body

Industry

CPC
H01L2224/8114

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8114Guiding structures outside the body

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for forming chip packages and a chip package having a chipse...
- Patent number 12,087,734
- Issue date Sep 10, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 12,015,000
- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing a light-emitting device and a method for manuf...
- Patent number 11,916,041
- Issue date Feb 27, 2024
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,848,346
- Issue date Dec 19, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed RFID tag assembly using impulse heating
- Patent number 11,790,206
- Issue date Oct 17, 2023
- Impinj, Inc.
- Ronald Lee Koepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bump-on-trace interconnect
- Patent number 11,682,651
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for solder bridging elimination for bulk solder C2S intercon...
- Patent number 11,670,612
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip curved sidewall self-alignment features for substrate and...
- Patent number 11,658,099
- Issue date May 23, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection arrangement, component carrier and method of forming a c...
- Patent number 11,658,142
- Issue date May 23, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding interposer and integrated circuit chip, and ultrasound prob...
- Patent number 11,631,798
- Issue date Apr 18, 2023
- Samsung Electronics Co., Ltd.
- Kyung-moo Choi
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Chip transfer method, display device, chip and target substrate
- Patent number 11,616,043
- Issue date Mar 28, 2023
- BOE Technology Group Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated mechanical aids for high accuracy alignable-electrical c...
- Patent number 11,562,984
- Issue date Jan 24, 2023
- HRL Laboratories, LLC
- Peter Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package design and methodology to compensate for die-substrate C...
- Patent number 11,495,568
- Issue date Nov 8, 2022
- NVIDIA Corporation
- Jayprakash Chipalkatti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity coupling interconnect packaging systems and methods
- Patent number 11,398,465
- Issue date Jul 26, 2022
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages for semiconductor devices, packaged semiconductor devices,...
- Patent number 11,329,022
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die features for self-alignment during die bonding
- Patent number 11,302,653
- Issue date Apr 12, 2022
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip with magnetic interconnect alignment
- Patent number 11,296,050
- Issue date Apr 5, 2022
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed RFID tag assembly using impulse heating
- Patent number 11,288,564
- Issue date Mar 29, 2022
- Impinj, Inc.
- Ronald Lee Koepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,257,776
- Issue date Feb 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit (3DIC) structure
- Patent number 11,239,201
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 11,168,234
- Issue date Nov 9, 2021
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of fabricating semiconductor device and encapsulant
- Patent number 11,171,018
- Issue date Nov 9, 2021
- Samsung Electronics Co., Ltd.
- Takahiro Tokumiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a carrier with components, pigment for assemb...
- Patent number 11,127,890
- Issue date Sep 21, 2021
- OSRAM OLED GmbH
- Andreas Ploessl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Warpage-compensated bonded structure including a support chip and a...
- Patent number 11,114,406
- Issue date Sep 7, 2021
- SanDisk Technologies LLC
- Senaka Kanakamedala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 11,088,102
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device-bonded body, image pickup module, endoscope and method for m...
- Patent number 11,043,524
- Issue date Jun 22, 2021
- Olympus Corporation
- Takashi Nakayama
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...
- Publication number 20240153908
- Publication date May 9, 2024
- HKC Corporation Limited
- YANG PU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...
- Publication number 20230369182
- Publication date Nov 16, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE
- Publication number 20230230962
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRANGEMENT
- Publication number 20230005877
- Publication date Jan 5, 2023
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LIGHT-RECEIVING DEVICE AND LIGHT-RECEIVING...
- Publication number 20220384510
- Publication date Dec 1, 2022
- Sumitomo Electric Industries, Ltd.
- Masaki MIGITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-LED MOUNTING SUBSTRATE, MICRO-LED DISPLAY, AND METHOD OF MANU...
- Publication number 20220352118
- Publication date Nov 3, 2022
- Sharp Kabushiki Kaisha
- Yoshiyuki HARUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED BOARD, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTU...
- Publication number 20220328390
- Publication date Oct 13, 2022
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Akira FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Method, Semiconductor Assembly and Electron...
- Publication number 20220271002
- Publication date Aug 25, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20220262765
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Assembly Packaging Method, Semiconductor Assembly and...
- Publication number 20220230986
- Publication date Jul 21, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Assembly Packaging Method, Semiconductor Assembly and...
- Publication number 20220216176
- Publication date Jul 7, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Chip Packages and a Chip Package
- Publication number 20220181296
- Publication date Jun 9, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REPAIRING A LIGHT-EMITTING DEVICE AND A METHOD FOR MANUF...
- Publication number 20220181293
- Publication date Jun 9, 2022
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE
- Publication number 20220157785
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...
- Publication number 20210265247
- Publication date Aug 26, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210225921
- Publication date Jul 22, 2021
- Sony Semiconductor Solutions Corporation
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR COMPONENTS
- Publication number 20210159207
- Publication date May 27, 2021
- IMEC vzw
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IC PACKAGE DESIGN AND METHODOLOGY TO COMPENSATE FOR DIE-SUBSTRATE C...
- Publication number 20210151403
- Publication date May 20, 2021
- NVIDIA Corporation
- Jayprakash Chipalkatti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFER METHOD, DISPLAY DEVICE, CHIP AND TARGET SUBSTRATE
- Publication number 20210134755
- Publication date May 6, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE AND ENCAPSULANT
- Publication number 20210111040
- Publication date Apr 15, 2021
- Samsung Electronics Co., Ltd.
- Takahiro Tokumiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210082853
- Publication date Mar 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump-on-Trace Interconnect
- Publication number 20210074673
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection Arrangement, Component Carrier and Method of Forming a C...
- Publication number 20210074662
- Publication date Mar 11, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE DESIGN AND METHODOLOGY TO COMPENSATE FOR DIE-SUBSTRATE C...
- Publication number 20210066227
- Publication date Mar 4, 2021
- NVIDIA Corporation
- Jayprakash Chipalkatti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP WITH MAGNETIC INTERCONNECT ALIGNMENT
- Publication number 20210066240
- Publication date Mar 4, 2021
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Features for Self-Alignment During Die Bonding
- Publication number 20200373252
- Publication date Nov 26, 2020
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20200350271
- Publication date Nov 5, 2020
- Semiconductor Components Industries, LLC
- Thomas Fairfax LONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF LIGHT-EMITTING DIODE PACKAGE STRUCTURE
- Publication number 20200266181
- Publication date Aug 20, 2020
- Unimicron Technology Corp.
- Wei-Ti Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP-ON-TRACE INTERCONNECT
- Publication number 20200118966
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Guiding structures outside the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming chip packages and a chip package having a chipse...

Semiconductor product with interlocking metal-to-metal bonds and me...

Advanced device assembly structures and methods

Solderless interconnection structure and method of forming same

Method for repairing a light-emitting device and a method for manuf...

Semiconductor device and method of manufacturing the same

Method of direct bonding semiconductor components

High-speed RFID tag assembly using impulse heating

Bump-on-trace interconnect

Method for solder bridging elimination for bulk solder C2S intercon...

Flip chip curved sidewall self-alignment features for substrate and...

Connection arrangement, component carrier and method of forming a c...

Bonding interposer and integrated circuit chip, and ultrasound prob...

Chip transfer method, display device, chip and target substrate

Integrated mechanical aids for high accuracy alignable-electrical c...

IC package design and methodology to compensate for die-substrate C...

Proximity coupling interconnect packaging systems and methods

Packages for semiconductor devices, packaged semiconductor devices,...

Die features for self-alignment during die bonding

Chip with magnetic interconnect alignment

High-speed RFID tag assembly using impulse heating

Semiconductor package structure and method for manufacturing the same

3D integrated circuit (3DIC) structure

Enhanced adhesive materials and processes for 3D applications

Method of fabricating semiconductor device and encapsulant

Method for assembling a carrier with components, pigment for assemb...

Warpage-compensated bonded structure including a support chip and a...

Bonded structures for package and substrate

Solderless interconnection structure and method of forming same

Device-bonded body, image pickup module, endoscope and method for m...

Patents Applicationslast 30 patents

DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...

FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRANGEMENT

METHOD OF MANUFACTURING LIGHT-RECEIVING DEVICE AND LIGHT-RECEIVING...

MICRO-LED MOUNTING SUBSTRATE, MICRO-LED DISPLAY, AND METHOD OF MANU...

MULTI-LAYERED BOARD, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTU...

Semiconductor Packaging Method, Semiconductor Assembly and Electron...

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...

Semiconductor Assembly Packaging Method, Semiconductor Assembly and...

Semiconductor Assembly Packaging Method, Semiconductor Assembly and...

Method for Forming Chip Packages and a Chip Package

METHOD FOR REPAIRING A LIGHT-EMITTING DEVICE AND A METHOD FOR MANUF...

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

Advanced Device Assembly Structures And Methods

FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR BONDING SEMICONDUCTOR COMPONENTS

IC PACKAGE DESIGN AND METHODOLOGY TO COMPENSATE FOR DIE-SUBSTRATE C...

CHIP TRANSFER METHOD, DISPLAY DEVICE, CHIP AND TARGET SUBSTRATE

METHOD OF FABRICATING SEMICONDUCTOR DEVICE AND ENCAPSULANT

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Bump-on-Trace Interconnect

Connection Arrangement, Component Carrier and Method of Forming a C...

IC PACKAGE DESIGN AND METHODOLOGY TO COMPENSATE FOR DIE-SUBSTRATE C...

CHIP WITH MAGNETIC INTERCONNECT ALIGNMENT

Die Features for Self-Alignment During Die Bonding

BONDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

MANUFACTURING METHOD OF LIGHT-EMITTING DIODE PACKAGE STRUCTURE

BUMP-ON-TRACE INTERCONNECT