Hardening the adhesive by curing

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H01L2224/81855

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81855Hardening the adhesive by curing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 11,658,154
- Issue date May 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding interposer and integrated circuit chip, and ultrasound prob...
- Patent number 11,631,798
- Issue date Apr 18, 2023
- Samsung Electronics Co., Ltd.
- Kyung-moo Choi
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 10,727,206
- Issue date Jul 28, 2020
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid bonding materials comprising ball grid arrays and metal inve...
- Patent number 10,403,594
- Issue date Sep 3, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, semiconductor device containing cured product...
- Patent number 10,294,395
- Issue date May 21, 2019
- Toray Industries, Inc.
- Kazuyuki Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 10,128,217
- Issue date Nov 13, 2018
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for making electronic device with cover layer with openings...
- Patent number 9,681,543
- Issue date Jun 13, 2017
- Harris Corporation
- Louis Joseph Rendek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 9,627,367
- Issue date Apr 18, 2017
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit connecting material and semiconductor device manufacturing...
- Patent number 9,202,755
- Issue date Dec 1, 2015
- Dexerials Corporation
- Hironobu Moriyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic device comprising at least a chip enclosed in a package...
- Patent number 9,159,652
- Issue date Oct 13, 2015
- STMicroelectronics S.r.l.
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element unit and reinforcing adhesive agent
- Patent number 8,686,299
- Issue date Apr 1, 2014
- Panasonic Corporation
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package with reinforced positive alignment features
- Patent number 8,659,161
- Issue date Feb 25, 2014
- Oracle International Corporation
- Ashok V. Krishnamoorthy
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Airgap micro-spring interconnect with bonded underfill seal
- Patent number 8,399,296
- Issue date Mar 19, 2013
- Palo Alto Research Center Incorporated
- Christopher L. Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airgap micro-spring interconnect with bonded underfill seal
- Patent number 8,039,938
- Issue date Oct 18, 2011
- Palo Alto Research Center Incorporated
- Christopher L. Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill and encapsulation of semiconductor assemblies with materi...
- Patent number 7,547,978
- Issue date Jun 16, 2009
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices at least partially covered by a composite coa...
- Patent number 7,282,806
- Issue date Oct 16, 2007
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using flip-chip mounting technique
- Patent number 7,227,267
- Issue date Jun 5, 2007
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yeong Gyu Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structure using conductive adhesives, and a manufacturing me...
- Patent number 7,157,800
- Issue date Jan 2, 2007
- Ricoh Company, Ltd.
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Use of nitrides for flip-chip encapsulation
- Patent number 6,972,249
- Issue date Dec 6, 2005
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device in which a plurality of electronic components...
- Patent number 6,940,175
- Issue date Sep 6, 2005
- Sharp Kabushiki Kaisha
- Yoshihide Iwazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Use of nitrides for flip-chip encapsulation
- Patent number 6,528,894
- Issue date Mar 4, 2003
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming electrically conductive polymer interconnects on...
- Patent number 6,138,348
- Issue date Oct 31, 2000
- Polymer Flip Chip Corporation
- Frank W. Kulesza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of nitrides for flip-chip encapsulation
- Patent number 5,956,605
- Issue date Sep 21, 1999
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming electrically conductive polymer interconnects on...
- Patent number 5,918,364
- Issue date Jul 6, 1999
- Polymer Flip Chip Corporation
- Frank W. Kulesza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming electrically conductive polymer interconnects on...
- Patent number 5,879,761
- Issue date Mar 9, 1999
- Polymer Flip Chip Corporation
- Frank W. Kulesza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding electronic components
- Patent number 5,817,542
- Issue date Oct 6, 1998
- Matsushita Electric Industrial Co., Ltd.
- Shoji Sakemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming electrically conductive polymer interconnects on...
- Patent number 5,611,140
- Issue date Mar 18, 1997
- Epoxy Technology, Inc.
- Frank W. Kulesza
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE CONTAINING CURED PRODUCT...
- Publication number 20170362472
- Publication date Dec 21, 2017
- TORAY INDUSTRIES, INC.
- Kazuyuki Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC DEVICE COMPRISING AT LEAST A CHIP ENCLOSED IN A PACKAGE...
- Publication number 20140239502
- Publication date Aug 28, 2014
- STMicroelectronics S.r.l.
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH REINFORCED POSITIVE ALIGNMENT FEATURES
- Publication number 20120326322
- Publication date Dec 27, 2012
- Oracle International Corporation
- Ashok V. Krishnamoorthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHIP SCALE PACKAGE CONNECTION SCHEME
- Publication number 20120211884
- Publication date Aug 23, 2012
- Frank Stepniak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT
- Publication number 20120111617
- Publication date May 10, 2012
- PANASONIC CORPORATION
- Koji Motomura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
AIRGAP MICRO-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL
- Publication number 20120088330
- Publication date Apr 12, 2012
- PALO ALTO RESEARCH CENTER INCORPORATED
- Christopher L. Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAP MICRO-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL
- Publication number 20100295164
- Publication date Nov 25, 2010
- Palo Alto Research Center Incorporated
- Christopher L. Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Die Attachment
- Publication number 20080169574
- Publication date Jul 17, 2008
- Nokia Corporation
- Petri Molkkari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of underfilling and encapsulating semiconductor assemblies...
- Publication number 20070020814
- Publication date Jan 25, 2007
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices at least partially covered by a composite coa...
- Publication number 20070001321
- Publication date Jan 4, 2007
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package using flip-chip mounting technique
- Publication number 20060076692
- Publication date Apr 13, 2006
- Samsung Electro-Mechanics CO., LTD.
- Yeong Gyu Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Underfill and encapsulation of semicondcutor assemblies with materi...
- Publication number 20050277231
- Publication date Dec 15, 2005
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded structure using conductive adhesives, and a manufacturing me...
- Publication number 20050062168
- Publication date Mar 24, 2005
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Use of nitrides for flip-chip encapsulation
- Publication number 20030137062
- Publication date Jul 24, 2003
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020190392
- Publication date Dec 19, 2002
- YOSHIHIDE IWAZAKI
- H01 - BASIC ELECTRIC ELEMENTS

Hardening the adhesive by curing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Memory devices with controllers under memory packages and associate...

Bonding interposer and integrated circuit chip, and ultrasound prob...

Memory devices with controllers under memory packages and associate...

Hybrid bonding materials comprising ball grid arrays and metal inve...

Adhesive composition, semiconductor device containing cured product...

Memory devices with controllers under memory packages and associate...

Method for making electronic device with cover layer with openings...

Memory devices with controllers under memory packages and associate...

Circuit connecting material and semiconductor device manufacturing...

Electronic device comprising at least a chip enclosed in a package...

Electronic element unit and reinforcing adhesive agent

Chip package with reinforced positive alignment features

Airgap micro-spring interconnect with bonded underfill seal

Airgap micro-spring interconnect with bonded underfill seal

Underfill and encapsulation of semiconductor assemblies with materi...

Semiconductor devices at least partially covered by a composite coa...

Semiconductor package using flip-chip mounting technique

Bonded structure using conductive adhesives, and a manufacturing me...

Use of nitrides for flip-chip encapsulation

Semiconductor device in which a plurality of electronic components...

Use of nitrides for flip-chip encapsulation

Method of forming electrically conductive polymer interconnects on...

Use of nitrides for flip-chip encapsulation

Method of forming electrically conductive polymer interconnects on...

Method for forming electrically conductive polymer interconnects on...

Method for bonding electronic components

Method of forming electrically conductive polymer interconnects on...

Patents Applicationslast 30 patents

ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE CONTAINING CURED PRODUCT...

ELECTRONIC DEVICE COMPRISING AT LEAST A CHIP ENCLOSED IN A PACKAGE...

CHIP PACKAGE WITH REINFORCED POSITIVE ALIGNMENT FEATURES

WAFER CHIP SCALE PACKAGE CONNECTION SCHEME

ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT

AIRGAP MICRO-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL

AIRGAP MICRO-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL

Direct Die Attachment

Methods of underfilling and encapsulating semiconductor assemblies...

Semiconductor devices at least partially covered by a composite coa...

Semiconductor package using flip-chip mounting technique

Underfill and encapsulation of semicondcutor assemblies with materi...

Bonded structure using conductive adhesives, and a manufacturing me...

Use of nitrides for flip-chip encapsulation

Semiconductor device and manufacturing method thereof