having a heterogeneous or anisotropic structure

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CPC
H01L23/4922

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4922having a heterogeneous or anisotropic structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Metal substrates with structures formed therein and methods of maki...
- Patent number 12,087,670
- Issue date Sep 10, 2024
- LUX SEMICONDUCTORS, INC.
- Chad B. Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element module
- Patent number 11,948,859
- Issue date Apr 2, 2024
- TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
- Takayuki Furuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing a module with solder body having elevated edge
- Patent number 11,942,335
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Achim Muecke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a can housing a semiconductor die w...
- Patent number 11,817,418
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Wei Lee Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core-shell particles for magnetic packaging
- Patent number 11,804,420
- Issue date Oct 31, 2023
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device including fiber-containing build-up layers
- Patent number 11,664,313
- Issue date May 30, 2023
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-side cooling semiconductor packages and related methods
- Patent number 11,646,249
- Issue date May 9, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,594,492
- Issue date Feb 28, 2023
- Kabushiki Kaisha Toshiba
- Hideto Furuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite assembly of three stacked joining partners
- Patent number 11,569,151
- Issue date Jan 31, 2023
- Robert Bosch GmbH
- Andreas Krutsch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing a module with solder body having elevated edge
- Patent number 11,538,694
- Issue date Dec 27, 2022
- Infineon Technologies AG
- Achim Muecke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component structure, power module and power module assembly structure
- Patent number 11,532,538
- Issue date Dec 20, 2022
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,328,995
- Issue date May 10, 2022
- Kabushiki Kaisha Toshiba
- Hideto Furuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing light emitting element mounting base member...
- Patent number 11,223,000
- Issue date Jan 11, 2022
- Nichia Corporation
- Yukitoshi Marutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protruding base member
- Patent number 11,201,143
- Issue date Dec 14, 2021
- Hitachi Astemo, Ltd.
- Takeshi Tokuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing the same
- Patent number 11,164,808
- Issue date Nov 2, 2021
- Vanguard International Semiconductor Corporation
- Yu-Chieh Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Microelectronic device including fiber-containing build-up layers
- Patent number 11,004,792
- Issue date May 11, 2021
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal plate and semiconductor device
- Patent number 10,896,867
- Issue date Jan 19, 2021
- Kabushiki Kaisha Toshiba
- Eitaro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component structure, power module and power module assembly structure
- Patent number 10,720,378
- Issue date Jul 21, 2020
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Packaging of a semiconductor device with phase-change material for...
- Patent number 10,685,900
- Issue date Jun 16, 2020
- Deere & Company
- Brij N. Singh
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method of manufacturing light emitting element mounting base member...
- Patent number 10,644,210
- Issue date May 5, 2020
- Nichia Corporation
- Yukitoshi Marutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 10,553,559
- Issue date Feb 4, 2020
- Mitsubishi Electric Corporation
- Noriyuki Besshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting apparatus using organic light-emitting diode and method of...
- Patent number 10,529,949
- Issue date Jan 7, 2020
- LG Display Co., Ltd.
- Taejoon Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor arrangement having a stack of connection plates
- Patent number 10,497,684
- Issue date Dec 3, 2019
- Infineon Technologies AG
- Matthias Wissen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a plurality of semiconductor modules co...
- Patent number 10,304,777
- Issue date May 28, 2019
- Toyota Jidosha Kabushiki Kaisha
- Takashi Ueta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,297,533
- Issue date May 21, 2019
- Fuji Electric Co., Ltd.
- Yoshihiro Kodaira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film semiconductor packages and display apparatus including...
- Patent number 10,134,667
- Issue date Nov 20, 2018
- Samsung Electronics Co., Ltd.
- Jung-woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile microdisplay module
- Patent number 10,001,683
- Issue date Jun 19, 2018
- Microsoft Technology Licensing, LLC
- Andriy Pletenetskyy
- G02 - OPTICS
Information Patent Grant
Substrate structure and display panel using same
- Patent number 9,681,545
- Issue date Jun 13, 2017
- Innolux Corporation
- Chia-Cheng Liu
- G02 - OPTICS
Information Patent Grant
Anisotropic electroconductive particles
- Patent number 9,607,727
- Issue date Mar 28, 2017
- Samsung Display Co., Ltd.
- Sein Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BUSBAR WITH DIELECTRIC COATING
- Publication number 20230326834
- Publication date Oct 12, 2023
- Microchip Technology Caldicot Limited
- Piers Tremlett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20230238307
- Publication date Jul 27, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20230187404
- Publication date Jun 15, 2023
- WUXI LEAPERS SEMICONDUCTOR CO., LTD.
- Xiaoguang LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEADER FOR SEMICONDUCTOR PACKAGE
- Publication number 20230154818
- Publication date May 18, 2023
- Shinko Electric Industries Co., Ltd.
- Katsuya NAKAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING A MODULE WITH SOLDER BODY HAVING ELEVATED EDGE
- Publication number 20230080004
- Publication date Mar 16, 2023
- INFINEON TECHNOLOGIES AG
- Achim MUECKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230032035
- Publication date Feb 2, 2023
- Mitsubishi Electric Corporation
- Hideyuki HATTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220238447
- Publication date Jul 28, 2022
- Kabushiki Kaisha Toshiba
- Hideto FURUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20220208653
- Publication date Jun 30, 2022
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THERMAL DISSIPATION, PACKAGED ELECTRONIC DEVICE AND MANUFACTUR...
- Publication number 20220199563
- Publication date Jun 23, 2022
- STMicroelectronics S.r.l.
- Cristiano Gianluca STELLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEMENT MODULE
- Publication number 20220102243
- Publication date Mar 31, 2022
- TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
- Takayuki FURUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE ASSEMBLY OF THREE STACKED JOINING PARTNERS
- Publication number 20210249335
- Publication date Aug 12, 2021
- ROBERT BOSCH GmbH
- Andreas Krutsch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING A MODULE WITH SOLDER BODY HAVING ELEVATED EDGE
- Publication number 20210166952
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Achim MUECKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising a Can Housing a Semiconductor Die w...
- Publication number 20210159204
- Publication date May 27, 2021
- INFINEON TECHNOLOGIES AG
- Wei Lee Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210013120
- Publication date Jan 14, 2021
- Vanguard International Semiconductor Corporation
- Yu-Chieh CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200303360
- Publication date Sep 24, 2020
- Hitachi Automotive Systems, Ltd.
- Takeshi TOKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND COMMUNICATIONS DEVICE
- Publication number 20200294892
- Publication date Sep 17, 2020
- Huawei Technologies Co., Ltd
- Kairong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT STRUCTURE, POWER MODULE AND POWER MODULE ASSEMBLY STRUCTURE
- Publication number 20200294893
- Publication date Sep 17, 2020
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Shouyu HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200286833
- Publication date Sep 10, 2020
- Kabushiki Kaisha Toshiba
- Hideto FURUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LIGHT EMITTING ELEMENT MOUNTING BASE MEMBER...
- Publication number 20200227607
- Publication date Jul 16, 2020
- Nichia Corporation.
- Yukitoshi MARUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING OF A SEMICONDUCTOR DEVICE WITH PHASE-CHANGE MATERIAL FOR...
- Publication number 20200126890
- Publication date Apr 23, 2020
- Deere & Company
- Brij N. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL PLATE AND SEMICONDUCTOR DEVICE
- Publication number 20200091043
- Publication date Mar 19, 2020
- Kabushiki Kaisha Toshiba
- Eitaro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE-SHELL PARTICLES FOR MAGNETIC PACKAGING
- Publication number 20200006203
- Publication date Jan 2, 2020
- Intel Corporation
- Brandon MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT STRUCTURE, POWER MODULE AND POWER MODULE ASSEMBLY STRUCTURE
- Publication number 20190067167
- Publication date Feb 28, 2019
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Shouyu HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Arrangement Having a Stack of Connection Plates
- Publication number 20180308827
- Publication date Oct 25, 2018
- INFINEON TECHNOLOGIES AG
- Matthias Wissen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20180197838
- Publication date Jul 12, 2018
- MITSUBISHI ELECTRIC CORPORATION
- Noriyuki BESSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180130748
- Publication date May 10, 2018
- Toyota Jidosha Kabushiki Kaisha
- Takashi UETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180122723
- Publication date May 3, 2018
- Fuji Electric Co., Ltd.
- Yoshihiro KODAIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuitized substrate with P-aramid dielectric layers and method of...
- Publication number 20090258161
- Publication date Oct 15, 2009
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered circuitized substrate with p-aramid dielectric layers...
- Publication number 20090173426
- Publication date Jul 9, 2009
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALUMINUM-SILICON CARBIDE COMPOSITE BODY AND METHOD FOR PROCESSING T...
- Publication number 20090075056
- Publication date Mar 19, 2009
- Denki Kagaku Kogyo Kabushiki Kaisha
- Goh Iwamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

having a heterogeneous or anisotropic structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal substrates with structures formed therein and methods of maki...

Element module

Manufacturing a module with solder body having elevated edge

Semiconductor device comprising a can housing a semiconductor die w...

Core-shell particles for magnetic packaging

Microelectronic device including fiber-containing build-up layers

Dual-side cooling semiconductor packages and related methods

Semiconductor device

Composite assembly of three stacked joining partners

Manufacturing a module with solder body having elevated edge

Component structure, power module and power module assembly structure

Semiconductor device

Method of manufacturing light emitting element mounting base member...

Semiconductor device with a protruding base member

Semiconductor devices and methods of manufacturing the same

Method for electrically contacting a component by galvanic connecti...

Microelectronic device including fiber-containing build-up layers

Terminal plate and semiconductor device

Component structure, power module and power module assembly structure

Packaging of a semiconductor device with phase-change material for...

Method of manufacturing light emitting element mounting base member...

Power semiconductor device

Lighting apparatus using organic light-emitting diode and method of...

Power semiconductor arrangement having a stack of connection plates

Semiconductor device having a plurality of semiconductor modules co...

Semiconductor device

Chip-on-film semiconductor packages and display apparatus including...

Low-profile microdisplay module

Substrate structure and display panel using same

Anisotropic electroconductive particles

Patents Applicationslast 30 patents

BUSBAR WITH DIELECTRIC COATING

DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS

POWER SEMICONDUCTOR MODULE

HEADER FOR SEMICONDUCTOR PACKAGE

MANUFACTURING A MODULE WITH SOLDER BODY HAVING ELEVATED EDGE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS

HIGH THERMAL DISSIPATION, PACKAGED ELECTRONIC DEVICE AND MANUFACTUR...

ELEMENT MODULE

COMPOSITE ASSEMBLY OF THREE STACKED JOINING PARTNERS

MANUFACTURING A MODULE WITH SOLDER BODY HAVING ELEVATED EDGE

Semiconductor Device Comprising a Can Housing a Semiconductor Die w...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND COMMUNICATIONS DEVICE

COMPONENT STRUCTURE, POWER MODULE AND POWER MODULE ASSEMBLY STRUCTURE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING LIGHT EMITTING ELEMENT MOUNTING BASE MEMBER...

PACKAGING OF A SEMICONDUCTOR DEVICE WITH PHASE-CHANGE MATERIAL FOR...

TERMINAL PLATE AND SEMICONDUCTOR DEVICE

CORE-SHELL PARTICLES FOR MAGNETIC PACKAGING

COMPONENT STRUCTURE, POWER MODULE AND POWER MODULE ASSEMBLY STRUCTURE

Power Semiconductor Arrangement Having a Stack of Connection Plates

POWER SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Circuitized substrate with P-aramid dielectric layers and method of...

Multilayered circuitized substrate with p-aramid dielectric layers...

ALUMINUM-SILICON CARBIDE COMPOSITE BODY AND METHOD FOR PROCESSING T...