having a heterogeneous or anisotropic structure

Industry

CPC
H01L23/3733

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3733having a heterogeneous or anisotropic structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Thermal interface materials
- Patent number 12,130,095
- Issue date Oct 29, 2024
- Henkel AG & Co. KGaA
- Yong Joon Lee
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermally conductive articles including entangled or aligned fibers...
- Patent number 12,115,737
- Issue date Oct 15, 2024
- 3M Innovative Properties Company
- Jacob P. Podkaminer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid thermal interface material (TIM) with reduced 3D thermal res...
- Patent number 12,087,658
- Issue date Sep 10, 2024
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame member with a porous material between a semiconductor module...
- Patent number 12,068,217
- Issue date Aug 20, 2024
- Mitsubishi Electric Corporation
- Takashi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface interconnect structure for efficient heat dissipation of...
- Patent number 12,068,220
- Issue date Aug 20, 2024
- Dalian University of Technology
- Mingliang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shrouded powder patch
- Patent number 12,050,061
- Issue date Jul 30, 2024
- Aavid Thermalloy, LLC
- Sukhvinder S. Kang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated heat spreader with enhanced vapor chamber for multichip...
- Patent number 12,046,536
- Issue date Jul 23, 2024
- Intel Corporation
- Je-Young Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive heat radiation film, method of manufacturing the same, a...
- Patent number 12,027,441
- Issue date Jul 2, 2024
- Fujitsu Limited
- Shinichi Hirose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material, an integrated circuit formed therewith,...
- Patent number 12,027,442
- Issue date Jul 2, 2024
- ARIECA INC.
- Jeffrey Gelorme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper/ceramic assembly, insulated circuit board, method for produc...
- Patent number 12,002,732
- Issue date Jun 4, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,967,570
- Issue date Apr 23, 2024
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation sheet, manufacturing method of heat dissipation sh...
- Patent number 11,967,539
- Issue date Apr 23, 2024
- Fujitsu Limited
- Shinichi Hirose
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heat sink for an electronic component
- Patent number 11,948,856
- Issue date Apr 2, 2024
- Siemens Aktiengesellschaft
- Daniel Reznik
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device with thermal release layer and method for fabr...
- Patent number 11,948,857
- Issue date Apr 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Jar-Ming Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device having anisotropic thermally conductive sec...
- Patent number 11,933,555
- Issue date Mar 19, 2024
- Intel Corporation
- Feras Eid
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Composite substrate and method of producing the composite substrate...
- Patent number 11,929,294
- Issue date Mar 12, 2024
- Nichia Corporation
- Masatsugu Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 11,929,303
- Issue date Mar 12, 2024
- Dexerials Corporation
- Yusuke Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus for discharging heat
- Patent number 11,923,264
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Yongha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 11,916,023
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink with carbon-nanostructure-based fibres
- Patent number 11,906,254
- Issue date Feb 20, 2024
- Robert Bosch GmbH
- Christine Arenz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
First-level integration of second-level thermal interface material...
- Patent number 11,881,438
- Issue date Jan 23, 2024
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface structures for integrated circuit packages
- Patent number 11,869,824
- Issue date Jan 9, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film package and display apparatus including the same
- Patent number 11,842,945
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation sheet, heat dissipation member, and semiconductor...
- Patent number 11,834,603
- Issue date Dec 5, 2023
- Mitsubishi Chemical Corporation
- Toshiyuki Sawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conduction sheet and heat dissipating device including ther...
- Patent number 11,810,834
- Issue date Nov 7, 2023
- Resonac Corporation
- Mika Kobune
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Carrier, assembly comprising a substrate and a carrier, and method...
- Patent number 11,810,845
- Issue date Nov 7, 2023
- OSRAM OLED GmbH
- Jörg Erich Sorg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure comprising heat dissipation member
- Patent number 11,804,417
- Issue date Oct 31, 2023
- TECAT TECHNOLOGIES (SUZHOU) LIMITED
- Choon Leong Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and packaging method of digital circuit
- Patent number 11,791,232
- Issue date Oct 17, 2023
- THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
- Bo Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber structure
- Patent number 11,765,861
- Issue date Sep 19, 2023
- Asia Vital Components Co., Ltd.
- Hsiu-Wei Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus and methods for processing exfoliated graphite materials
- Patent number 11,742,257
- Issue date Aug 29, 2023
- 0908905 B.C. Ltd.
- John Kenna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS
- Publication number 20240347386
- Publication date Oct 17, 2024
- Honeywell International Inc.
- James L. Tucker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS
- Publication number 20240347497
- Publication date Oct 17, 2024
- International Business Machines Corporation
- SHIDONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURES
- Publication number 20240321682
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jonggyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...
- Publication number 20240312865
- Publication date Sep 19, 2024
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION METHOD FOR ALUMINUM-DIAMOND COMPOSITE
- Publication number 20240226997
- Publication date Jul 11, 2024
- DENKA COMPANY LIMITED
- Hiroaki OTA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COMPOSITE SUBSTRATE AND METHOD OF PRODUCING THE COMPOSITE SUBSTRATE...
- Publication number 20240222209
- Publication date Jul 4, 2024
- Nichia Corporation.
- Masatsugu ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240215420
- Publication date Jun 27, 2024
- SAMSUNG DISPLAY CO., LTD.
- JUNGHOON SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
- Publication number 20240203754
- Publication date Jun 20, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
- Publication number 20240162166
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOFT THERMAL CONDUCTIVE MEMBER
- Publication number 20240150637
- Publication date May 9, 2024
- NOK Corporation
- Shunichi TSUNAJIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTERFACE INTERCONNECT STRUCTURE FOR EFFICIENT HEAT DISSIPATION OF...
- Publication number 20240145336
- Publication date May 2, 2024
- DALIAN UNIVERSITY OF TECHNOLOGY
- Mingliang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE RESIN SHEET
- Publication number 20240141222
- Publication date May 2, 2024
- Sekisui Chemical Co., Ltd
- Yuuki HOSHIYAMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Device and Method of Forming Graphene-Coated Core Emb...
- Publication number 20240096736
- Publication date Mar 21, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF
- Publication number 20240067855
- Publication date Feb 29, 2024
- COOLER MATERIALS TECHNOLOGY INC.
- Po-Wen CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE HEAT RADIATION FILM, METHOD OF MANUFACTURING THE SAME, A...
- Publication number 20240047299
- Publication date Feb 8, 2024
- FUJITSU LIMITED
- Shinichi Hirose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RADIATION STRUCTURE AND ELECTRONIC APPARATUS
- Publication number 20240038710
- Publication date Feb 1, 2024
- LENOVO (SINGAPORE) PTE. LTD.
- Junki Hashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Comprising a Component and a Coupled Cooling Body
- Publication number 20240038621
- Publication date Feb 1, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Jörg Strogies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RADIATION COMPONENT AND ELECTRONIC APPARATUS
- Publication number 20240038622
- Publication date Feb 1, 2024
- LENOVO (SINGAPORE) PTE. LTD.
- Ryota Watanabe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240021491
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Methods for Processing Exfoliated Graphite Materials
- Publication number 20240021495
- Publication date Jan 18, 2024
- 0908905 B.C. Ltd.
- John Kenna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL CONDUCTION SHEET HOLDER AND METHOD OF MANUFACTURING HEAT DI...
- Publication number 20240017955
- Publication date Jan 18, 2024
- RESONAC CORPORATION
- Mika KOBUNE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT RADIATING STRUCTURE AND ELECTRONIC APPARATUS
- Publication number 20240014098
- Publication date Jan 11, 2024
- LENOVO (SINGAPORE) PTE. LTD.
- Ryota Watanabe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor structure and manufacturing method thereof
- Publication number 20240014082
- Publication date Jan 11, 2024
- UNITED MICROELECTRONICS CORP.
- Yi-Feng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING HEAT DISSIPA...
- Publication number 20240014048
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus with a Porous Body for Receiving a Heat Quantity and Meth...
- Publication number 20240006264
- Publication date Jan 4, 2024
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Thomas LISEC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR FORMING THE SAME
- Publication number 20230420334
- Publication date Dec 28, 2023
- Infineon Technologies Austria AG
- Timo Bohnenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS
- Publication number 20230361071
- Publication date Nov 9, 2023
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SHEET AND MANUFACTURING METHOD THEREOF, AND LAMINATE AND...
- Publication number 20230357089
- Publication date Nov 9, 2023
- Denka Company Limited
- Yoshitaka MINAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT COOLING TYPE POWER MODULE
- Publication number 20230360996
- Publication date Nov 9, 2023
- Hyundai Motor Company
- Suk Hyun LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS MESH STRUCTURES FOR THE THERMAL MANAGEMENT OF INTEGRATED CIR...
- Publication number 20230317549
- Publication date Oct 5, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS

having a heterogeneous or anisotropic structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermal interface materials

Thermally conductive articles including entangled or aligned fibers...

Hybrid thermal interface material (TIM) with reduced 3D thermal res...

Frame member with a porous material between a semiconductor module...

Interface interconnect structure for efficient heat dissipation of...

Shrouded powder patch

Integrated heat spreader with enhanced vapor chamber for multichip...

Conductive heat radiation film, method of manufacturing the same, a...

Thermal interface material, an integrated circuit formed therewith,...

Copper/ceramic assembly, insulated circuit board, method for produc...

Semiconductor package having improved thermal interface between sem...

Heat dissipation sheet, manufacturing method of heat dissipation sh...

Heat sink for an electronic component

Semiconductor device with thermal release layer and method for fabr...

Heat dissipation device having anisotropic thermally conductive sec...

Composite substrate and method of producing the composite substrate...

Semiconductor device and method of producing the same

Semiconductor apparatus for discharging heat

Thermal interface material having different thicknesses in packages

Heat sink with carbon-nanostructure-based fibres

First-level integration of second-level thermal interface material...

Thermal interface structures for integrated circuit packages

Chip on film package and display apparatus including the same

Heat dissipation sheet, heat dissipation member, and semiconductor...

Thermal conduction sheet and heat dissipating device including ther...

Carrier, assembly comprising a substrate and a carrier, and method...

Semiconductor structure comprising heat dissipation member

Packaging structure and packaging method of digital circuit

Vapor chamber structure

Apparatus and methods for processing exfoliated graphite materials

Patents Applicationslast 30 patents

BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS

THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS

HEAT DISSIPATION STRUCTURES

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...

PRODUCTION METHOD FOR ALUMINUM-DIAMOND COMPOSITE

COMPOSITE SUBSTRATE AND METHOD OF PRODUCING THE COMPOSITE SUBSTRATE...

ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES

SOFT THERMAL CONDUCTIVE MEMBER

INTERFACE INTERCONNECT STRUCTURE FOR EFFICIENT HEAT DISSIPATION OF...

THERMALLY CONDUCTIVE RESIN SHEET

Semiconductor Device and Method of Forming Graphene-Coated Core Emb...

LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF

CONDUCTIVE HEAT RADIATION FILM, METHOD OF MANUFACTURING THE SAME, A...

HEAT RADIATION STRUCTURE AND ELECTRONIC APPARATUS

Device Comprising a Component and a Coupled Cooling Body

HEAT RADIATION COMPONENT AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Apparatus and Methods for Processing Exfoliated Graphite Materials

THERMAL CONDUCTION SHEET HOLDER AND METHOD OF MANUFACTURING HEAT DI...

HEAT RADIATING STRUCTURE AND ELECTRONIC APPARATUS

Semiconductor structure and manufacturing method thereof

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING HEAT DISSIPA...

Apparatus with a Porous Body for Receiving a Heat Quantity and Meth...

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR FORMING THE SAME

ELECTRONICS ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS

COMPOSITE SHEET AND MANUFACTURING METHOD THEREOF, AND LAMINATE AND...

DIRECT COOLING TYPE POWER MODULE

POROUS MESH STRUCTURES FOR THE THERMAL MANAGEMENT OF INTEGRATED CIR...