having an external coating

Industry

CPC
H01L2224/85355

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85355having an external coating

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having controller with graphite sheet
- Patent number 11,791,234
- Issue date Oct 17, 2023
- Kioxia Corporation
- Ryo Kamoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joints on nickel surface finishes without gold plating
- Patent number 11,676,926
- Issue date Jun 13, 2023
- Schlumberger Technology Corporation
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-interface IC card module
- Patent number 11,222,861
- Issue date Jan 11, 2022
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual-interface IC card module
- Patent number 10,461,057
- Issue date Oct 29, 2019
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Anchoring structure of fine pitch bva
- Patent number 10,332,854
- Issue date Jun 25, 2019
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin NiB or CoB capping layer for non-noble metallic bonding landin...
- Patent number 10,066,303
- Issue date Sep 4, 2018
- Imec VZW
- Eric Beyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,972,598
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Yuki Yagyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered conductive matrix material on wire bond
- Patent number 9,905,502
- Issue date Feb 27, 2018
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly and process with sintering material on metal bumps
- Patent number 9,443,822
- Issue date Sep 13, 2016
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20220102239
- Publication date Mar 31, 2022
- KIOXIA Corporation
- Ryo KAMODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING
- Publication number 20220059489
- Publication date Feb 24, 2022
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-INTERFACE IC CARD MODULE
- Publication number 20190355693
- Publication date Nov 21, 2019
- NXP B.V.
- CHRISTIAN ZENZ
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180082977
- Publication date Mar 22, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuki YAGYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANCHORING STRUCTURE OF FINE PITCH BVA
- Publication number 20170117243
- Publication date Apr 27, 2017
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-INTERFACE IC CARD MODULE
- Publication number 20170092612
- Publication date Mar 30, 2017
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS
- Publication number 20150357304
- Publication date Dec 10, 2015
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS
- Publication number 20120313239
- Publication date Dec 13, 2012
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS

having an external coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having controller with graphite sheet

Solder joints on nickel surface finishes without gold plating

Dual-interface IC card module

Dual-interface IC card module

Anchoring structure of fine pitch bva

Thin NiB or CoB capping layer for non-noble metallic bonding landin...

Method of manufacturing semiconductor device

Sintered conductive matrix material on wire bond

Flip chip assembly and process with sintering material on metal bumps

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING

DUAL-INTERFACE IC CARD MODULE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ANCHORING STRUCTURE OF FINE PITCH BVA

DUAL-INTERFACE IC CARD MODULE

FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS

FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS