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having an external coating
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H01L2224/80375
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80375
having an external coating
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last 30 patents
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Patent Grant
Multi-metal contact structure
Patent number
11,894,326
Issue date
Feb 6, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-metal contact structure in microelectronic component
Patent number
11,088,099
Issue date
Aug 10, 2021
INVENSAS BONDING TECHNOLOGIES, INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME
Publication number
20220415784
Publication date
Dec 29, 2022
Changxin Memory Technologies, Inc.
Ling-Yi CHUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-METAL CONTACT STRUCTURE
Publication number
20210335737
Publication date
Oct 28, 2021
INVENSAS BONDING TECHNOLOGIES, INC.
Rajesh KATKAR
H01 - BASIC ELECTRIC ELEMENTS