having an external coating

Industry

CPC
H01L2224/80355

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80355having an external coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Heterogeneous bonding structure and method forming same
- Patent number 11,894,241
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous bonding structure and method forming same
- Patent number 11,854,835
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded LED arrays including optical elements configured to t...
- Patent number 11,715,730
- Issue date Aug 1, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joints on nickel surface finishes without gold plating
- Patent number 11,676,926
- Issue date Jun 13, 2023
- Schlumberger Technology Corporation
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded LED structure contacts and substrate contacts
- Patent number 11,329,034
- Issue date May 10, 2022
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding semiconductor chips to a landing wafer
- Patent number 10,797,016
- Issue date Oct 6, 2020
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded LED arrays and applications
- Patent number 10,629,577
- Issue date Apr 21, 2020
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-plated substrate for die attachment
- Patent number 9,893,027
- Issue date Feb 13, 2018
- NXP USA, INC.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and related manufacturing method
- Patent number 9,343,435
- Issue date May 17, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fucheng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME
- Publication number 20240096647
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Bonding Structure and Method Forming Same
- Publication number 20220384210
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufactuning Co., Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...
- Publication number 20220077104
- Publication date Mar 10, 2022
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING
- Publication number 20220059489
- Publication date Feb 24, 2022
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT
- Publication number 20180012855
- Publication date Jan 11, 2018
- NXP USA, Inc.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT
- Publication number 20170294393
- Publication date Oct 12, 2017
- FREESCALE SEMICONDUCTOR, INC.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND RELATED MANUFACTURING METHOD
- Publication number 20150187736
- Publication date Jul 2, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fucheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS

having an external coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heterogeneous bonding structure and method forming same

Heterogeneous bonding structure and method forming same

Direct-bonded LED arrays including optical elements configured to t...

Solder joints on nickel surface finishes without gold plating

Direct-bonded LED structure contacts and substrate contacts

Method for bonding semiconductor chips to a landing wafer

Direct-bonded LED arrays and applications

Pre-plated substrate for die attachment

Semiconductor device and related manufacturing method

Patents Applicationslast 30 patents

HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME

Heterogeneous Bonding Structure and Method Forming Same

METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...

SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING

PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT

PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT

SEMICONDUCTOR DEVICE AND RELATED MANUFACTURING METHOD