having an external coating

Industry

CPC
H01L2224/81355

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81355having an external coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,996,381
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joints on nickel surface finishes without gold plating
- Patent number 11,676,926
- Issue date Jun 13, 2023
- Schlumberger Technology Corporation
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,557,561
- Issue date Jan 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 10,937,757
- Issue date Mar 2, 2021
- Semigear, Inc.
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 10,854,570
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,840,212
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,483,230
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with solder ball revealed through layer
- Patent number 10,134,699
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a hybridized device including microelectronic c...
- Patent number 10,002,842
- Issue date Jun 19, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,905,529
- Issue date Feb 27, 2018
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,691,676
- Issue date Jun 27, 2017
- SOCIONEXT INC.
- Takeshi Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate, semiconductor package and method of manufacturin...
- Patent number 9,640,503
- Issue date May 2, 2017
- Siliconware Precision Industries Co., Ltd.
- Ming-Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding semiconductor devices on sustrate and bonding st...
- Patent number 9,613,925
- Issue date Apr 4, 2017
- Tsinghua University
- Jian Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and methods of forming solder bump and flip chip using...
- Patent number 9,462,736
- Issue date Oct 4, 2016
- Electronics and Telecommunications Research Institute
- Yong Sung Eom
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming semiconductor die assemblies
- Patent number 9,224,715
- Issue date Dec 29, 2015
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, method of manufacturing semiconductor appa...
- Patent number 9,105,625
- Issue date Aug 11, 2015
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies and structures
- Patent number 8,970,034
- Issue date Mar 3, 2015
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and methods of forming solder bump and flip chip using...
- Patent number 8,420,722
- Issue date Apr 16, 2013
- Electronics and Telecommunications Research Institute
- Yong Sung Eom
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure and method for manufacturing same
- Patent number 8,258,637
- Issue date Sep 4, 2012
- Hitachi, Ltd.
- Eiji Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection and method of manufacturing the same
- Patent number 8,079,141
- Issue date Dec 20, 2011
- Sumitomo Bakelite Co., Ltd.
- Toru Meura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module and assembling process thereof
- Patent number 7,581,960
- Issue date Sep 1, 2009
- Primax Electronics Ltd.
- Chun-Tsai Ho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Process for fabricating chip package structure
- Patent number 7,482,200
- Issue date Jan 27, 2009
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an electronic device connected to a printed ci...
- Patent number 7,340,826
- Issue date Mar 11, 2008
- Infineon Technologies AG
- Harry Hedler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package structure
- Patent number 7,262,510
- Issue date Aug 28, 2007
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of solder balls having resin member as reinforcement
- Patent number 6,897,142
- Issue date May 24, 2005
- Fujitsu Limited
- Joji Fujimori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Configuration having an electronic device electrically connected to...
- Patent number 6,852,931
- Issue date Feb 8, 2005
- Infineon Technologies AG
- Harry Hedler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 6,822,336
- Issue date Nov 23, 2004
- NEC Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting bumped electronic components
- Patent number 6,209,196
- Issue date Apr 3, 2001
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a projecting electrode
- Patent number 5,869,904
- Issue date Feb 9, 1999
- NEC Corporation
- Kazutaka Shoji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240274567
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20230111006
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING
- Publication number 20220059489
- Publication date Feb 24, 2022
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20210082858
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package Components Through Plating
- Publication number 20200020662
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20190035759
- Publication date Jan 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package Components Through Plating
- Publication number 20170294402
- Publication date Oct 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Solder Ball Revealed Through Layer
- Publication number 20170125367
- Publication date May 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160260680
- Publication date Sep 8, 2016
- RENESAS ELECTRONICS CORPORATION
- Kenji SAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD AND BONDING STRUCTURE FORMED USING THE SAME
- Publication number 20160172326
- Publication date Jun 16, 2016
- TSINGHUA UNIVERSITY
- Jian CAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURIN...
- Publication number 20160155716
- Publication date Jun 2, 2016
- Siliconware Precision Industries Co., Ltd.
- Ming-Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
- Publication number 20140317915
- Publication date Oct 30, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B82 - NANO-TECHNOLOGY
Information Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
- Publication number 20140317918
- Publication date Oct 30, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B82 - NANO-TECHNOLOGY
Information Patent Application
CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS
- Publication number 20140075747
- Publication date Mar 20, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140027920
- Publication date Jan 30, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Takeshi Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES, STRUCTURES, AND METHODS OF FABRICATION
- Publication number 20130299965
- Publication date Nov 14, 2013
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
- Publication number 20130200135
- Publication date Aug 8, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD FOR ENHANCING RELIABILITY OF WELDING SPOT OF CHIP, PRINTED C...
- Publication number 20130128485
- Publication date May 23, 2013
- HUAWEI DEVICE CO., LTD.
- David Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPA...
- Publication number 20130043585
- Publication date Feb 21, 2013
- SONY CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP MOUNTING AND MET...
- Publication number 20110309481
- Publication date Dec 22, 2011
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC PARTICLE ATTACHMENT MATERIAL
- Publication number 20110278351
- Publication date Nov 17, 2011
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20110139856
- Publication date Jun 16, 2011
- Hitachi, Ltd.
- Eiji SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROVIDING SOLDER CONNECTION, ELECTRONIC EQUIPMENT AND ME...
- Publication number 20100313416
- Publication date Dec 16, 2010
- SUMITOMO BAKELITE CO., LTD.
- Toru Meura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
- Publication number 20100006625
- Publication date Jan 14, 2010
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD
- Publication number 20090321121
- Publication date Dec 31, 2009
- Murata Manufacturing Co., Ltd.
- Hiromichi KAWAKAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE AND ASSEMBLING PROCESS THEREOF
- Publication number 20080050943
- Publication date Feb 28, 2008
- Primax Electronics Ltd.
- Chun-Tsai Ho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD
- Publication number 20070256859
- Publication date Nov 8, 2007
- Murata Manufacturing Co., Ltd.
- Hiromichi KAWAKAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR FABRICATING CHIP PACKAGE STRUCTURE
- Publication number 20070259481
- Publication date Nov 8, 2007
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Chung
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CHIP PACKAGE STRUCTURE AND PROCESS FOR FABRICATING THE SAME
- Publication number 20060024863
- Publication date Feb 2, 2006
- Chih-Ming Chung
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Configuration having an electronic device electrically connected to...
- Publication number 20050150685
- Publication date Jul 14, 2005
- Infineon Technologies AG
- Harry Hedler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

having an external coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure and method of fabricating the same

Solder joints on nickel surface finishes without gold plating

Package structure and method of fabricating the same

Device packaging facility and method, and device processing apparat...

Integrated fan-out package and method of fabricating the same

Bonding package components through plating

Bonding package components through plating

Packages with solder ball revealed through layer

Method of producing a hybridized device including microelectronic c...

Method for manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Package substrate, semiconductor package and method of manufacturin...

Method for bonding semiconductor devices on sustrate and bonding st...

Composition and methods of forming solder bump and flip chip using...

Methods of forming semiconductor die assemblies

Semiconductor apparatus, method of manufacturing semiconductor appa...

Semiconductor assemblies and structures

Composition and methods of forming solder bump and flip chip using...

Bonding structure and method for manufacturing same

Electrical connection and method of manufacturing the same

Camera module and assembling process thereof

Process for fabricating chip package structure

Method for producing an electronic device connected to a printed ci...

Chip package structure

Formation of solder balls having resin member as reinforcement

Configuration having an electronic device electrically connected to...

Semiconductor device

Method of mounting bumped electronic components

Semiconductor device having a projecting electrode

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Bonding Package Components Through Plating

INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME

Bonding Package Components Through Plating

Packages with Solder Ball Revealed Through Layer

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

BONDING METHOD AND BONDING STRUCTURE FORMED USING THE SAME

PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURIN...

COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...

COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...

CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR ASSEMBLIES, STRUCTURES, AND METHODS OF FABRICATION

COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...

METHOD FOR ENHANCING RELIABILITY OF WELDING SPOT OF CHIP, PRINTED C...

SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPA...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP MOUNTING AND MET...

MAGNETIC PARTICLE ATTACHMENT MATERIAL

BONDING STRUCTURE AND METHOD FOR MANUFACTURING SAME

METHOD FOR PROVIDING SOLDER CONNECTION, ELECTRONIC EQUIPMENT AND ME...

COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...

CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD

CAMERA MODULE AND ASSEMBLING PROCESS THEREOF

CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD

PROCESS FOR FABRICATING CHIP PACKAGE STRUCTURE

CHIP PACKAGE STRUCTURE AND PROCESS FOR FABRICATING THE SAME

Configuration having an electronic device electrically connected to...