having insulated holes or insulated via connections through the metal core

Industry

CPC
H05K3/445

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/445having insulated holes or insulated via connections through the metal core

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method for double-sided wiring circuit board and doub...
- Patent number 12,114,438
- Issue date Oct 8, 2024
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board
- Patent number 12,035,484
- Issue date Jul 9, 2024
- Nitto Denko Corporation
- Kenya Takimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming interconnect circuits
- Patent number 11,979,976
- Issue date May 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Through-hole electrode substrate
- Patent number 11,362,028
- Issue date Jun 14, 2022
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, imaging unit and imaging device
- Patent number 11,343,907
- Issue date May 24, 2022
- Nikon Corporation
- Ryoichi Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer laminate and method for producing multilayer printed wir...
- Patent number 11,285,700
- Issue date Mar 29, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer board and manufacturing method of the same
- Patent number 10,939,562
- Issue date Mar 2, 2021
- Taiyo Yuden Co., Ltd.
- Yuichi Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,790,221
- Issue date Sep 29, 2020
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermediate printed board for making multiple printed circuit boar...
- Patent number 10,785,876
- Issue date Sep 22, 2020
- Taiyo Yuden Co., Ltd.
- Yuichi Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board
- Patent number 10,765,011
- Issue date Sep 1, 2020
- Dai Nippon Printing Co., Ltd.
- Shigeki Chujo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and camera module
- Patent number 10,674,601
- Issue date Jun 2, 2020
- Taiyo Yuden Co., Ltd.
- Yuichi Sugiyama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,600,728
- Issue date Mar 24, 2020
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, and manufacturing method
- Patent number 10,593,606
- Issue date Mar 17, 2020
- Sony Corporation
- Kousuke Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,580,727
- Issue date Mar 3, 2020
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board
- Patent number 10,477,702
- Issue date Nov 12, 2019
- Dai Nippon Printing Co., Ltd.
- Shigeki Chujo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Assembly and lighting device comprising the assembly
- Patent number 10,433,418
- Issue date Oct 1, 2019
- SIGNIFY HOLDING B.V.
- Durandus Kornelius Dijken
- F21 - LIGHTING
Information Patent Grant
Substrate, imaging unit and imaging device
- Patent number 10,412,824
- Issue date Sep 10, 2019
- Nikon Corporation
- Ryoichi Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder alloy free electronic (safe) rigid-flexible/stretchable circ...
- Patent number 10,285,270
- Issue date May 7, 2019
- Joseph Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate and semiconductor device using thr...
- Patent number 10,256,176
- Issue date Apr 9, 2019
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module substrate
- Patent number 10,204,733
- Issue date Feb 12, 2019
- Taiyo Yuden Co., Ltd.
- Yuichi Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Landless via concept
- Patent number 10,182,494
- Issue date Jan 15, 2019
- Flex Ltd.
- Henrik Jacobbson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,014,244
- Issue date Jul 3, 2018
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a metal core substrate having improved edge in...
- Patent number 9,942,995
- Issue date Apr 10, 2018
- Furukawa Electric Co., Ltd.
- Tomotsugu Shiratori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection substrate
- Patent number 9,814,131
- Issue date Nov 7, 2017
- Fujikura Ltd.
- Yusuke Uemichi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Insulating film, printed circuit board using the same, and method o...
- Patent number 9,775,253
- Issue date Sep 26, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dong Hun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate, imaging unit and imaging device
- Patent number 9,743,510
- Issue date Aug 22, 2017
- Nikon Corporation
- Ryoichi Suganuma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wiring board and manufacturing method thereof
- Patent number 9,693,466
- Issue date Jun 27, 2017
- Yazaki Corporation
- Akira Harao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer wiring board
- Patent number 9,659,849
- Issue date May 23, 2017
- Dai Nippon Printing Co., Ltd.
- Shigeki Chujo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded coins for HDI or SEQ laminations
- Patent number 9,661,738
- Issue date May 23, 2017
- Flextronics AP, LLC
- Henrik Jacobsson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Circuit Methods And Devices
- Publication number 20240276632
- Publication date Aug 15, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240276650
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR DOUBLE-SIDED WIRING CIRCUIT BOARD AND DOUB...
- Publication number 20230008736
- Publication date Jan 12, 2023
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20220408563
- Publication date Dec 22, 2022
- Kuan-Yu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20220246512
- Publication date Aug 4, 2022
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20220201871
- Publication date Jun 23, 2022
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20200357733
- Publication date Nov 12, 2020
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER BOARD AND MANUFACTURING METHOD OF THE SAME
- Publication number 20200315032
- Publication date Oct 1, 2020
- Taiyo Yuden Co., Ltd.
- Yuichi SUGIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20200152564
- Publication date May 14, 2020
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20190394886
- Publication date Dec 26, 2019
- DAI NIPPON PRINTING CO., LTD.
- Shigeki CHUJO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE, IMAGING UNIT AND IMAGING DEVICE
- Publication number 20190350076
- Publication date Nov 14, 2019
- Nikon Corporation
- Ryoichi SUGANUMA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONI...
- Publication number 20190254164
- Publication date Aug 15, 2019
- Fujitsu Limited
- Toshiki Iwai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20190172780
- Publication date Jun 6, 2019
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY AND LIGHTING DEVICE COMPRISING THE ASSEMBLY
- Publication number 20180352650
- Publication date Dec 6, 2018
- PHILIPS LIGHTING HOLDING B.V.
- Durandus Kornelius DIJKEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND CAMERA MODULE
- Publication number 20180310401
- Publication date Oct 25, 2018
- Taiyo Yuden Co., Ltd.
- Yuichi SUGIYAMA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20180277471
- Publication date Sep 27, 2018
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board and Method Manufacturing the Same
- Publication number 20180146550
- Publication date May 24, 2018
- Markus MAIER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, AND MANUFACTURING METHOD
- Publication number 20180145004
- Publication date May 24, 2018
- SONY CORPORATION
- Kousuke SEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE, IMAGING UNIT AND IMAGING DEVICE
- Publication number 20170374735
- Publication date Dec 28, 2017
- Nikon Corporation
- Ryoichi SUGANUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160007451
- Publication date Jan 7, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THE...
- Publication number 20150181690
- Publication date Jun 25, 2015
- Hyundai Motor Company
- Mun Jong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF...
- Publication number 20150118391
- Publication date Apr 30, 2015
- Rogers Corporation
- Brett W. Kilhenny
- F21 - LIGHTING
Information Patent Application
INTERCONNECTION SUBSTRATE
- Publication number 20150107888
- Publication date Apr 23, 2015
- FUJIKURA LTD.
- Yusuke UEMICHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL CORE SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND CORE PLATE...
- Publication number 20150083472
- Publication date Mar 26, 2015
- FURUKAWA ELECTRIC CO., LTD.
- Tomotsugu SHIRATORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
- Publication number 20150076107
- Publication date Mar 19, 2015
- DAI NIPPON PRINTING CO., LTD.
- Shigeki CHUJO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing Wiring Substrate
- Publication number 20150041053
- Publication date Feb 12, 2015
- Shinko Electric Industries Co., LTD.
- Takayuki Kiwanami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE HAVING CAVITY
- Publication number 20150010694
- Publication date Jan 8, 2015
- Taiyo Yuden Co., Ltd.
- Masashi MIYAZAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20140174794
- Publication date Jun 26, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Joon Seok KANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL CORE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140174798
- Publication date Jun 26, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.,
- Jae Hoon CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

having insulated holes or insulated via connections through the metal core

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method for double-sided wiring circuit board and doub...

Through-hole electrode substrate

Wiring circuit board

Methods of forming interconnect circuits

Through-hole electrode substrate

Substrate, imaging unit and imaging device

Multilayer laminate and method for producing multilayer printed wir...

Multilayer board and manufacturing method of the same

Through-hole electrode substrate

Intermediate printed board for making multiple printed circuit boar...

Multilayer wiring board

Printed wiring board and camera module

Through-hole electrode substrate

Wiring board, and manufacturing method

Through-hole electrode substrate

Multilayer wiring board

Assembly and lighting device comprising the assembly

Substrate, imaging unit and imaging device

Solder alloy free electronic (safe) rigid-flexible/stretchable circ...

Through-hole electrode substrate and semiconductor device using thr...

Module substrate

Landless via concept

Through-hole electrode substrate

Method for producing a metal core substrate having improved edge in...

Interconnection substrate

Insulating film, printed circuit board using the same, and method o...

Substrate, imaging unit and imaging device

Wiring board and manufacturing method thereof

Method for manufacturing multilayer wiring board

Embedded coins for HDI or SEQ laminations

Patents Applicationslast 30 patents

THROUGH-HOLE ELECTRODE SUBSTRATE

Interconnect Circuit Methods And Devices

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD FOR DOUBLE-SIDED WIRING CIRCUIT BOARD AND DOUB...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

THROUGH-HOLE ELECTRODE SUBSTRATE

WIRING CIRCUIT BOARD

THROUGH-HOLE ELECTRODE SUBSTRATE

MULTILAYER BOARD AND MANUFACTURING METHOD OF THE SAME

THROUGH-HOLE ELECTRODE SUBSTRATE

MULTILAYER WIRING BOARD

SUBSTRATE, IMAGING UNIT AND IMAGING DEVICE

CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONI...

THROUGH-HOLE ELECTRODE SUBSTRATE

ASSEMBLY AND LIGHTING DEVICE COMPRISING THE ASSEMBLY

PRINTED WIRING BOARD AND CAMERA MODULE

THROUGH-HOLE ELECTRODE SUBSTRATE

Printed Circuit Board and Method Manufacturing the Same

WIRING BOARD, AND MANUFACTURING METHOD

SUBSTRATE, IMAGING UNIT AND IMAGING DEVICE

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

HEAT DISSIPATION PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THE...

THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF...

INTERCONNECTION SUBSTRATE

METAL CORE SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND CORE PLATE...

METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

Method of Manufacturing Wiring Substrate

METHOD OF MANUFACTURING SUBSTRATE HAVING CAVITY

HEAT RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF

METAL CORE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME