having integrally laminated metal sheets or special power cores

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CPC
H05K3/4641

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4641having integrally laminated metal sheets or special power cores

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Ceramic substrate manufacturing method
- Patent number 12,108,540
- Issue date Oct 1, 2024
- AMOSENSE CO., LTD.
- Kyung Whan Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with heat dissipation structure and method for manufa...
- Patent number 11,979,977
- Issue date May 7, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method for mitigating the swiss cheese effec...
- Patent number 11,412,610
- Issue date Aug 9, 2022
- Juniper Networks, Inc.
- Boris Reynov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer laminate and method for producing multilayer printed wir...
- Patent number 11,285,700
- Issue date Mar 29, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multl-phase layered busbar for conducting electric energy wherein t...
- Patent number 11,070,036
- Issue date Jul 20, 2021
- ABB Schweiz AG
- Rudi Velthuis
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multi-phase busbar for conducting electric energy and method of man...
- Patent number 10,790,643
- Issue date Sep 29, 2020
- ABB Schweiz AG
- Rudi Velthuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate
- Patent number 10,021,791
- Issue date Jul 10, 2018
- Taiyo Yuden Co., Ltd.
- Yuichi Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure with chips embedded therein and manufacturi...
- Patent number 9,860,990
- Issue date Jan 2, 2018
- BOARDTEK ELECTRONICS CORPORATION
- Chien-Cheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a circuitized substrate
- Patent number 9,756,724
- Issue date Sep 5, 2017
- i3 ELECTRONICS, INC.
- Rabindra N. Das
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reinforced metal core board and electric connection box having the...
- Patent number 9,426,879
- Issue date Aug 23, 2016
- Yazaki Corporation
- Manabu Ooishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 9,313,903
- Issue date Apr 12, 2016
- Mitsubishi Electric Corporation
- Sohei Samejima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric materials, methods of forming subassemblies therefrom, a...
- Patent number 9,265,160
- Issue date Feb 16, 2016
- Rogers Corporation
- Sankar Paul
- B32 - LAYERED PRODUCTS
Information Patent Grant
Direct current capacitor module
- Patent number 9,236,189
- Issue date Jan 12, 2016
- Samhwa Capacitor Co., Ltd.
- Young Joo Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board having multilayer core substrate
- Patent number 9,226,397
- Issue date Dec 29, 2015
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with built-in capacitor
- Patent number 9,226,399
- Issue date Dec 29, 2015
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board for electric components and circuit board system
- Patent number 9,185,803
- Issue date Nov 10, 2015
- Continental Automotive GmbH
- Roland Brey
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Wiring board having an engineered metallization layer
- Patent number 9,173,290
- Issue date Oct 27, 2015
- Lockheed Martin Corporation
- William S. McKinley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded capacitive stack
- Patent number 9,161,447
- Issue date Oct 13, 2015
- Sanmina-SCI Corporation
- George Dudnikov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bumpless build-up layer and laminated core hybrid structures and me...
- Patent number 8,809,124
- Issue date Aug 19, 2014
- Intel Corporation
- Mathew J. Manusharow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded capacitive stack
- Patent number 8,713,769
- Issue date May 6, 2014
- Sanmina-SCI Corporation
- George Dudnikov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, method of manufacturing the same, and resistance ele...
- Patent number 8,642,894
- Issue date Feb 4, 2014
- Fujitsu Limited
- Tomoyuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric materials, methods of forming subassemblies therefrom, a...
- Patent number 8,632,874
- Issue date Jan 21, 2014
- Rogers Corporation
- Sankar Paul
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,592,688
- Issue date Nov 26, 2013
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Parts made of electrostructural composite material
- Patent number 8,581,103
- Issue date Nov 12, 2013
- European Aeronautic Defence and Space Company – EADS France
- Jesus Aspas Puertolas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,569,880
- Issue date Oct 29, 2013
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bumpless build-up layer and laminated core hybrid structures and me...
- Patent number 8,508,037
- Issue date Aug 13, 2013
- Intel Corporation
- Mathew J. Manusharow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrate utilizing three smooth-sided conductive layer...
- Patent number 8,502,082
- Issue date Aug 6, 2013
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded metal and ceramic plates for thermal management of optical a...
- Patent number 8,299,604
- Issue date Oct 30, 2012
- Cooligy Inc.
- Madhav Datta
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method of producing a wired circuit board
- Patent number 8,266,794
- Issue date Sep 18, 2012
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE
Information Patent Grant
Printed circuit board with improved via design
- Patent number 8,258,411
- Issue date Sep 4, 2012
- PPG Industries Ohio, Inc.
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD WITH HEAT DISSIPATION STRUCTURE AND METHOD FOR MANUFA...
- Publication number 20230112890
- Publication date Apr 13, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- HSIAO-TING HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20160037624
- Publication date Feb 4, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kyung-Chul Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIELECTRIC MATERIALS, METHODS OF FORMING SUBASSEMBLIES THEREFROM, A...
- Publication number 20140090767
- Publication date Apr 3, 2014
- Sankar Paul
- B32 - LAYERED PRODUCTS
Information Patent Application
DIRECT CURRENT CAPACITOR MODULE
- Publication number 20140085772
- Publication date Mar 27, 2014
- SAMHWA CAPACITOR CO., LTD.
- Young Joo OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD FOR ELECTRIC COMPONENTS AND CIRCUIT BOARD SYSTEM
- Publication number 20140085827
- Publication date Mar 27, 2014
- Continental Automative GmbH
- Roland Brey
- B60 - VEHICLES IN GENERAL
Information Patent Application
BUMPLESS BUILD-UP LAYER AND LAMINATED CORE HYBRID STRUCTURES AND ME...
- Publication number 20130344662
- Publication date Dec 26, 2013
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20130299218
- Publication date Nov 14, 2013
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Printed Wiring Board
- Publication number 20130248234
- Publication date Sep 26, 2013
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CORE BOARD AND ELECTRIC CONNECTION BOX HAVING THE SAME
- Publication number 20130206444
- Publication date Aug 15, 2013
- YAZAKI CORPORATION
- Manabu Ooishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
WIRING BOARD HAVING AN ENGINEERED METALLIZATION LAYER
- Publication number 20130048346
- Publication date Feb 28, 2013
- William S. MCKINLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSPIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120273116
- Publication date Nov 1, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Ho SOHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING MULTILAYERED PRINTED CIRCUIT BOARD
- Publication number 20120174393
- Publication date Jul 12, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Nobuyuki Ikeguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMPLESS BUILD-UP LAYER AND LAMINATED CORE HYBRID STRUCTURES AND ME...
- Publication number 20120139116
- Publication date Jun 7, 2012
- Mathew J. Manusharow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES
- Publication number 20120097431
- Publication date Apr 26, 2012
- Stablcor Technology, Inc.
- Kalu K. Vasoya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUITIZED SUBSTRATE WITH CONDUCTIVE PASTE, ELECTRICAL ASSEMBLY IN...
- Publication number 20120017437
- Publication date Jan 26, 2012
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED WIRING BOARD
- Publication number 20110290408
- Publication date Dec 1, 2011
- Mitsubishi Electric Corporation
- Sohei Samejima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER CORE FOR USE IN CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME
- Publication number 20110284273
- Publication date Nov 24, 2011
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING METAL BASE LAMINATE
- Publication number 20110274877
- Publication date Nov 10, 2011
- Li-Chih Yu
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20110220396
- Publication date Sep 15, 2011
- Fujitsu Limited
- Tomoyuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING CIRCUITIZED SUBSTRATES HAVING PHOTO-IMAGEABLE DIE...
- Publication number 20110173809
- Publication date Jul 21, 2011
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF M...
- Publication number 20110164391
- Publication date Jul 7, 2011
- Yee Na SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTIMIZING PCB POWER AND GROUND CONNECTIONS FOR LEAD FREE SOLDER PR...
- Publication number 20110154659
- Publication date Jun 30, 2011
- ORACLE AMERICA, INC.
- James David Britton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATING SUBSTRATE
- Publication number 20110088928
- Publication date Apr 21, 2011
- Chang Hyun LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY
- Publication number 20110088936
- Publication date Apr 21, 2011
- Ulrich Schaaf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110075374
- Publication date Mar 31, 2011
- Jung Eun KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN CAPACITOR
- Publication number 20110061921
- Publication date Mar 17, 2011
- IBIDEN CO., LTD.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered wiring substrate and manufacturing method thereof
- Publication number 20110042130
- Publication date Feb 24, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Chang Hyun Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PARTS MADE OF ELECTROSTRUCTURAL COMPOSITE MATERIAL
- Publication number 20110011627
- Publication date Jan 20, 2011
- Jesus Aspas Puertolas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS...
- Publication number 20100328868
- Publication date Dec 30, 2010
- Endicott Interconnect Technologies, Inc.
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR THE PRODUCING AN ELECTRONIC SUBASSEMBLY, AS WELL AS ELEC...
- Publication number 20100328913
- Publication date Dec 30, 2010
- Andreas Kugler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

having integrally laminated metal sheets or special power cores

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ceramic substrate manufacturing method

Circuit board with heat dissipation structure and method for manufa...

Apparatus, system, and method for mitigating the swiss cheese effec...

Multilayer laminate and method for producing multilayer printed wir...

Multl-phase layered busbar for conducting electric energy wherein t...

Multi-phase busbar for conducting electric energy and method of man...

Multilayer wiring substrate

Circuit board structure with chips embedded therein and manufacturi...

Method of making a circuitized substrate

Reinforced metal core board and electric connection box having the...

Method of manufacturing printed wiring board

Dielectric materials, methods of forming subassemblies therefrom, a...

Direct current capacitor module

Multilayer printed wiring board having multilayer core substrate

Wiring board with built-in capacitor

Circuit board for electric components and circuit board system

Wiring board having an engineered metallization layer

Embedded capacitive stack

Bumpless build-up layer and laminated core hybrid structures and me...

Embedded capacitive stack

Circuit board, method of manufacturing the same, and resistance ele...

Dielectric materials, methods of forming subassemblies therefrom, a...

Multilayer printed wiring board

Parts made of electrostructural composite material

Multilayer printed wiring board

Bumpless build-up layer and laminated core hybrid structures and me...

Circuitized substrate utilizing three smooth-sided conductive layer...

Bonded metal and ceramic plates for thermal management of optical a...

Method of producing a wired circuit board

Printed circuit board with improved via design

Patents Applicationslast 30 patents

CIRCUIT BOARD WITH HEAT DISSIPATION STRUCTURE AND METHOD FOR MANUFA...

FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

DIELECTRIC MATERIALS, METHODS OF FORMING SUBASSEMBLIES THEREFROM, A...

DIRECT CURRENT CAPACITOR MODULE

CIRCUIT BOARD FOR ELECTRIC COMPONENTS AND CIRCUIT BOARD SYSTEM

BUMPLESS BUILD-UP LAYER AND LAMINATED CORE HYBRID STRUCTURES AND ME...

MULTILAYER PRINTED WIRING BOARD

Multilayer Printed Wiring Board

METAL CORE BOARD AND ELECTRIC CONNECTION BOX HAVING THE SAME

WIRING BOARD HAVING AN ENGINEERED METALLIZATION LAYER

HEAT DISSPIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

METHOD OF FABRICATING MULTILAYERED PRINTED CIRCUIT BOARD

BUMPLESS BUILD-UP LAYER AND LAMINATED CORE HYBRID STRUCTURES AND ME...

LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES

CIRCUITIZED SUBSTRATE WITH CONDUCTIVE PASTE, ELECTRICAL ASSEMBLY IN...

METHOD OF MANUFACTURING PRINTED WIRING BOARD

POWER CORE FOR USE IN CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME

METHOD FOR MANUFACTURING METAL BASE LAMINATE

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

METHOD FOR MAKING CIRCUITIZED SUBSTRATES HAVING PHOTO-IMAGEABLE DIE...

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF M...

OPTIMIZING PCB POWER AND GROUND CONNECTIONS FOR LEAD FREE SOLDER PR...

HEAT DISSIPATING SUBSTRATE

METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY

RIGID-FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD WITH BUILT-IN CAPACITOR

Multilayered wiring substrate and manufacturing method thereof

PARTS MADE OF ELECTROSTRUCTURAL COMPOSITE MATERIAL

CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS...

METHOD FOR THE PRODUCING AN ELECTRONIC SUBASSEMBLY, AS WELL AS ELEC...