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H01L28/90

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor

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H01L28/90having vertical extensions

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices
- Patent number 12,211,891
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Cheol Ju Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having supporter pattern
- Patent number 12,211,892
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Seung Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,211,893
- Issue date Jan 28, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kui Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench pattern for trench capacitor yield improvement
- Patent number 12,205,982
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,199,140
- Issue date Jan 14, 2025
- SK Hynix Inc.
- Jae Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density metal insulator metal capacitor
- Patent number 12,191,347
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Kai Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum circuit with trench capacitor
- Patent number 12,185,644
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Li-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,170,274
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated structure and manufacturing method the...
- Patent number 12,148,691
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form a fin structure on deep trenches for a semiconductor...
- Patent number 12,125,873
- Issue date Oct 22, 2024
- HeFeChip Corporation Limited
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,120,863
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kang You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,051,689
- Issue date Jul 30, 2024
- SK Hynix Inc.
- Sang Yun Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with single side capacitor
- Patent number 12,021,114
- Issue date Jun 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Yu-Min Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 12,009,387
- Issue date Jun 11, 2024
- Samsung Electronics, Co. Ltd.
- Jun-goo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising vertically-alternating tiers of insulative...
- Patent number 12,004,354
- Issue date Jun 4, 2024
- Micron Technology, Inc.
- Durai Vishak Nirmal Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line passive device structure
- Patent number 11,990,401
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 11,978,765
- Issue date May 7, 2024
- Samsung Electronics, Co. Ltd.
- Jun-goo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,973,106
- Issue date Apr 30, 2024
- SK Hynix Inc.
- Jae Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit comprising a three-dimensional capacitor
- Patent number 11,955,480
- Issue date Apr 9, 2024
- STMicroelectronics (Tours) SAS
- Mohamed Boufnichel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor structure with hybrid filling layer
- Patent number 11,955,568
- Issue date Apr 9, 2024
- Murata Manufacturing Co., Ltd.
- Larry Buffle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,943,909
- Issue date Mar 26, 2024
- United Microelectronics Corp.
- Feng-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor array structure and method for forming the same
- Patent number 11,925,012
- Issue date Mar 5, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chaojun Sheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming diodes
- Patent number 11,916,129
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of SRAM device
- Patent number 11,917,804
- Issue date Feb 27, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer power, converter with devices having reduced lateral cur...
- Patent number 11,908,844
- Issue date Feb 20, 2024
- pSemi Corporation
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor structure having alignment mar...
- Patent number 11,901,305
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Kuo-Hung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including lower electrodes including inner pr...
- Patent number 11,901,291
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Cheoljin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,901,401
- Issue date Feb 13, 2024
- Murata Manufacturing Co., Ltd.
- Koichi Nishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor assembly for high capacitance density
- Patent number 11,894,366
- Issue date Feb 6, 2024
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having supporter pattern
- Patent number 11,881,502
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Seung Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED STRUCTURE
- Publication number 20250029918
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20240429270
- Publication date Dec 26, 2024
- International Business Machines Corporation
- HUIMEI ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A LOW RESISTIVITY TRENCH CAPACITOR
- Publication number 20240429271
- Publication date Dec 26, 2024
- SK keyfoundry Inc.
- Youngryeol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR COMPONENT
- Publication number 20240413056
- Publication date Dec 12, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240405062
- Publication date Dec 5, 2024
- PICO SEMICONDUCTOR INC.
- Yong Kuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH FISHBONE CAPACITOR STRUCTURES
- Publication number 20240404943
- Publication date Dec 5, 2024
- Intel Corporation
- Denzil Frost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Amplifier System in a Package
- Publication number 20240395645
- Publication date Nov 28, 2024
- 3D GLASS SOLUTIONS, INC
- Jeb H. Flemming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...
- Publication number 20240395739
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240389348
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Jungmin PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...
- Publication number 20240387618
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387497
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20240379737
- Publication date Nov 14, 2024
- ROHM CO., LTD.
- Ryosuke ISHIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379646
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO BOSCH DEEP ETCH
- Publication number 20240379373
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsing Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR STRUCTURE AND PREPARATION METHOD TH...
- Publication number 20240379736
- Publication date Nov 14, 2024
- CANSEMI TECHNOLOGY INC.
- Xiang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE PASSIVE DEVICE STRUCTURE
- Publication number 20240379531
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCESS TRANSISTORS IN A DUAL GATE LINE CONFIGURATION AND METHODS FO...
- Publication number 20240373623
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Yen CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...
- Publication number 20240363604
- Publication date Oct 31, 2024
- pSemi Corporation
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE HAVING A CONTAINER-SHAPED ELECTRODE
- Publication number 20240332348
- Publication date Oct 3, 2024
- NANYA TECHNOLOGY CORPORATION
- YAO-HSIUNG KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE HAVING A CONTAINER-SHAPED ELECTRODE AND METHOD FOR FA...
- Publication number 20240332349
- Publication date Oct 3, 2024
- NANYA TECHNOLOGY CORPORATION
- YAO-HSIUNG KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR-CAPACITOR COMPONENT FOR HIGH-VOLTAGE APPLICATIONS AND METH...
- Publication number 20240321782
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Sébastien IOCHEM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240304661
- Publication date Sep 12, 2024
- Samsung Electronics Co., Ltd.
- Gina Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Vertically-Alternating Tiers Of Insulative...
- Publication number 20240298451
- Publication date Sep 5, 2024
- Micron Technology, Inc.
- Durai Vishak Nirmal Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20240292600
- Publication date Aug 29, 2024
- IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
- Min Tae RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICE COMPRISING A MONOLITHIC DIAMOND REGION COMPRISING...
- Publication number 20240274654
- Publication date Aug 15, 2024
- Murata Manufacturing Co., Ltd.
- Larry BUFFLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240258366
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Changsoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DEVICE
- Publication number 20240258367
- Publication date Aug 1, 2024
- Fuji Electric Co., Ltd.
- Kazuo ENOMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING LOWER ELECTRODES INCLUDING INNER PR...
- Publication number 20240234315
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Cheoljin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240234485
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Jun-goo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240234489
- Publication date Jul 11, 2024
- SK HYNIX INC.
- Jae Hee SONG
- H01 - BASIC ELECTRIC ELEMENTS

having vertical extensions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices

Semiconductor device having supporter pattern

Semiconductor structure and manufacturing method thereof

Trench pattern for trench capacitor yield improvement

Semiconductor device and method for manufacturing the same

High density metal insulator metal capacitor

Quantum circuit with trench capacitor

Semiconductor packages and methods of forming same

Three-dimensional integrated structure and manufacturing method the...

Method to form a fin structure on deep trenches for a semiconductor...

Semiconductor structure and manufacturing method thereof

Semiconductor device and method for fabricating the same

Semiconductor structure with single side capacitor

Integrated circuit device and method of manufacturing the same

Memory arrays comprising vertically-alternating tiers of insulative...

Back-end-of-line passive device structure

Integrated circuit device and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Integrated circuit comprising a three-dimensional capacitor

Trench capacitor structure with hybrid filling layer

Semiconductor memory device

Capacitor array structure and method for forming the same

Methods of forming diodes

Manufacturing method of SRAM device

Multilayer power, converter with devices having reduced lateral cur...

Method for fabricating semiconductor structure having alignment mar...

Semiconductor devices including lower electrodes including inner pr...

Semiconductor device

Trench capacitor assembly for high capacitance density

Semiconductor device having supporter pattern

Patents Applicationslast 30 patents

METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED STRUCTURE

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

SEMICONDUCTOR DEVICE HAVING A LOW RESISTIVITY TRENCH CAPACITOR

CAPACITOR COMPONENT

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICES WITH FISHBONE CAPACITOR STRUCTURES

Power Amplifier System in a Package

CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...

SEMICONDUCTOR DEVICES

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CAPACITOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

HIGH ASPECT RATIO BOSCH DEEP ETCH

METAL-INSULATOR-METAL CAPACITOR STRUCTURE AND PREPARATION METHOD TH...

BACK-END-OF-LINE PASSIVE DEVICE STRUCTURE

ACCESS TRANSISTORS IN A DUAL GATE LINE CONFIGURATION AND METHODS FO...

MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...

MEMORY DEVICE HAVING A CONTAINER-SHAPED ELECTRODE

MEMORY DEVICE HAVING A CONTAINER-SHAPED ELECTRODE AND METHOD FOR FA...

RESISTOR-CAPACITOR COMPONENT FOR HIGH-VOLTAGE APPLICATIONS AND METH...

INTEGRATED CIRCUIT DEVICE

Memory Arrays Comprising Vertically-Alternating Tiers Of Insulative...

MEMORY DEVICE

ELECTRICAL DEVICE COMPRISING A MONOLITHIC DIAMOND REGION COMPRISING...

CAPACITOR AND ELECTRONIC DEVICE INCLUDING THE SAME

CAPACITOR DEVICE

SEMICONDUCTOR DEVICES INCLUDING LOWER ELECTRODES INCLUDING INNER PR...

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME