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Semiconductor Package Assembly
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Publication number 20240145529
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Publication date May 2, 2024
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KYOCERA AVX Components Corporation
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Laurent Desclos
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE STRUCTURE
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Publication number 20240136312
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Publication date Apr 25, 2024
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UNITED MICROELECTRONICS CORP.
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Purakh Raj Verma
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H01 - BASIC ELECTRIC ELEMENTS
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MULTILAYER CAPACITOR ELECTRODE
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Publication number 20240128312
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Publication date Apr 18, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Hsiang-Ku Shen
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240088118
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Publication date Mar 14, 2024
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Samsung Electronics Co., Ltd.
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Manho LEE
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H01 - BASIC ELECTRIC ELEMENTS
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TRENCH CAPACITOR
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Publication number 20240063251
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Publication date Feb 22, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Tao-Cheng LIU
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H01 - BASIC ELECTRIC ELEMENTS
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NON-VOLATILE MEMORY DEVICE
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Publication number 20240055469
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Publication date Feb 15, 2024
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Samsung Electronics Co., Ltd.
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Chang-Bum KIM
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240038830
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Publication date Feb 1, 2024
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Samsung Electronics Co., Ltd.
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Jong-min Lee
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICES
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Publication number 20240021664
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Publication date Jan 18, 2024
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Samsung Electronics Co., Ltd.
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Junrak CHOI
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240014252
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Publication date Jan 11, 2024
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Samsung Electronics Co., Ltd.
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Hong Sik CHAE
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR MEMORY DEVICE
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Publication number 20230413525
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Publication date Dec 21, 2023
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Samsung Electronics Co., Ltd.
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Hyeran Lee
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H01 - BASIC ELECTRIC ELEMENTS
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MULTI-LATERAL RECESSED MIM STRUCTURE
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Publication number 20230343817
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Publication date Oct 26, 2023
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Alexander Kalnitsky
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H01 - BASIC ELECTRIC ELEMENTS