heatsink to have chip

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CPC
H01L2023/4043

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2023/4043heatsink to have chip

Industries

Patents Grantslast 30 patents

Information Patent Grant
Heat sink
- Patent number 11,982,500
- Issue date May 14, 2024
- Delta Electronics, Inc.
- Chao-Wen Lu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor module and vehicle
- Patent number 11,664,296
- Issue date May 30, 2023
- Fuji Electric Co., Ltd.
- Kensuke Matsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric machine with a heat transfer device for transferring heat...
- Patent number 11,349,375
- Issue date May 31, 2022
- SPAL Automotive S.R.L.
- Pietro De Filippis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structure and heat dissipation method
- Patent number 11,229,114
- Issue date Jan 18, 2022
- NEC Platforms, Ltd.
- Jun Eto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for dynamic compensation of heatsink-...
- Patent number 11,158,564
- Issue date Oct 26, 2021
- Juniper Networks, Inc.
- Alexander I. Yatskov
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Adjustable heat sink fin spacing
- Patent number 11,035,625
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Paul F. Bodenweber
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Adjustable heat sink fin spacing
- Patent number 10,948,247
- Issue date Mar 16, 2021
- International Business Machines Corporation
- Paul F. Bodenweber
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Apparatus, system, and method for dynamic compensation of heatsink-...
- Patent number 10,943,848
- Issue date Mar 9, 2021
- Juniper Networks, Inc.
- Alexander I. Yatskov
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Microelectronic components having integrated heat dissipation posts...
- Patent number 10,861,764
- Issue date Dec 8, 2020
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cable connector assembly for an integrated circuit assembly
- Patent number 10,811,800
- Issue date Oct 20, 2020
- TE Connectivity Corporation
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device apparatus with multiple thermally conductive path...
- Patent number 10,720,377
- Issue date Jul 21, 2020
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device
- Patent number 10,674,640
- Issue date Jun 2, 2020
- Delta Electronics, Inc.
- Chao-Li Kao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Adjustable heat sink fin spacing
- Patent number 10,584,924
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Paul F. Bodenweber
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 10,504,817
- Issue date Dec 10, 2019
- Mitsubishi Electric Corporation
- Kazuya Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,290,560
- Issue date May 14, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Naoto Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,285,279
- Issue date May 7, 2019
- Fuji Electric Co., Ltd.
- Yusuke Sekino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components having integrated heat dissipation posts...
- Patent number 10,269,678
- Issue date Apr 23, 2019
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and a chip stack package having the same
- Patent number 10,211,123
- Issue date Feb 19, 2019
- Samsung Electronics Co., Ltd.
- Jong-Pil Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature control device, semiconductor device including the same...
- Patent number 10,032,687
- Issue date Jul 24, 2018
- SK hynix Inc.
- Young Geun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly
- Patent number 9,877,408
- Issue date Jan 23, 2018
- DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
- Chad-Yao Tan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic assembly with one or more heat sinks
- Patent number 9,860,987
- Issue date Jan 2, 2018
- Deere & Company
- Brij N. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit (3DIC) having a thermally enha...
- Patent number 9,721,868
- Issue date Aug 1, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fastening systems for power modules
- Patent number 9,497,876
- Issue date Nov 15, 2016
- BRUSA Elektronik AG
- Martin Berkmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level package
- Patent number 9,269,645
- Issue date Feb 23, 2016
- United Microelectronics Corp.
- Chu-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method for manufacturing the same
- Patent number 9,161,479
- Issue date Oct 13, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Bum Sik Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Multi-die integrated circuit structure with heat sink
- Patent number 9,082,633
- Issue date Jul 14, 2015
- Xilinx, Inc.
- Douglas M. Grant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structures having liquid cooler integrated wi...
- Patent number 8,772,927
- Issue date Jul 8, 2014
- International Business Machines Corporation
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structures having liquid coolers integrated w...
- Patent number 8,115,303
- Issue date Feb 14, 2012
- International Business Machines Corporation
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lidless semiconductor cooling
- Patent number 7,759,790
- Issue date Jul 20, 2010
- Oracle America, Inc.
- Chien Ouyang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,656,026
- Issue date Feb 2, 2010
- Seiko Epson Corporation
- Yoshiharu Ogata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION FASTENER STRUCTURE
- Publication number 20240347419
- Publication date Oct 17, 2024
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH THERMAL DISSIPATING PACKAGE
- Publication number 20240153845
- Publication date May 9, 2024
- GUANGZHOU NEOGENE THERMAL MANAGEMENT TECHNOLOGY CO., LTD.
- JEN-SHYAN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...
- Publication number 20240120255
- Publication date Apr 11, 2024
- Hitachi Energy Switzerland AG
- Dominik TRUESSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE AND POWER MODULE
- Publication number 20230060729
- Publication date Mar 2, 2023
- Delta Electronics, Inc.
- Chia-Chi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD, ELECTRONIC DEVICE, AND MANUFACTURING METHOD
- Publication number 20220375821
- Publication date Nov 24, 2022
- Huawei Technologies Co., Ltd
- Zhaokuan LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK
- Publication number 20220214120
- Publication date Jul 7, 2022
- Delta Electronics, Inc.
- CHAO-WEN LU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR MODULE AND VEHICLE
- Publication number 20210313249
- Publication date Oct 7, 2021
- Fuji Electric Co., Ltd.
- Kensuke MATSUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC DEVICE
- Publication number 20200196480
- Publication date Jun 18, 2020
- Delta Electronics, Inc.
- Chao-Li KAO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTRONIC DEVICE APPARATUS WITH MULTIPLE THERMALLY CONDUCTIVE PATH...
- Publication number 20200152546
- Publication date May 14, 2020
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC MACHINE
- Publication number 20200076278
- Publication date Mar 5, 2020
- SPAL AUTOMOTIVE S.r.l.
- Pietro De Filippis
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
HEAT SINK
- Publication number 20190383566
- Publication date Dec 19, 2019
- Delta Electronics, Inc.
- Chao-Wen LU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Positioning assembly for computer radiator
- Publication number 20190244876
- Publication date Aug 8, 2019
- SHU-HUI WANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING DEVICE
- Publication number 20190101123
- Publication date Apr 4, 2019
- AISIN SEIKI KABUSHIKI KAISHA
- Naoki MATSUMURA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190074238
- Publication date Mar 7, 2019
- Mitsubishi Electric Corporation
- Kazuya OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...
- Publication number 20180294169
- Publication date Oct 11, 2018
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE CONTROL DEVICE, SEMICONDUCTOR DEVICE INCLUDING THE SAME...
- Publication number 20180114737
- Publication date Apr 26, 2018
- SK HYNIX INC.
- Young Geun CHOI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170301604
- Publication date Oct 19, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT
- Naoto UEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE UNIT AND ELECTRONIC DEVICE
- Publication number 20140340847
- Publication date Nov 20, 2014
- Fujitsu Limited
- Yoshihisa IWAKIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal mgmt. device for high-heat flux electronics
- Publication number 20140293542
- Publication date Oct 2, 2014
- Jan Vetrovec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Heat Sinks For Distributing A Thermal Load
- Publication number 20130153187
- Publication date Jun 20, 2013
- International Business Machines Corporation
- Zachary B. Durham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE INTEGRATED CIRCUIT STRUCTURE WITH HEAT SINK
- Publication number 20130093074
- Publication date Apr 18, 2013
- Xilinx, Inc.
- Douglas M. Grant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DUMMY PATTERN AND DESIGN METHOD THEREOF
- Publication number 20120306106
- Publication date Dec 6, 2012
- Elpida Memory, Inc.
- Yorio Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Structures Having Liquid Cooler Integrated wi...
- Publication number 20120049341
- Publication date Mar 1, 2012
- International Business Machines Corporation
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING DEVICE
- Publication number 20100059209
- Publication date Mar 11, 2010
- Alex HORNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Structures Having Liquid Coolers Integrated w...
- Publication number 20090283902
- Publication date Nov 19, 2009
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COOLING STRUCTURE
- Publication number 20090178788
- Publication date Jul 16, 2009
- DENSO CORPORATION
- Mitsunori KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090020867
- Publication date Jan 22, 2009
- SEIKO EPSON CORPORATION
- Yoshiharu OGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE DEVICE, METHOD OF MANUFACTURING THE SAME, FLAT...
- Publication number 20090008771
- Publication date Jan 8, 2009
- Matsushita Electric Industrial Co., Ltd.
- Michiharu Torii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lidless semiconductor cooling
- Publication number 20080197483
- Publication date Aug 21, 2008
- SUN MICROSYSTEMS, INC.
- Chien Ouyang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated heat sink
- Publication number 20070290330
- Publication date Dec 20, 2007
- Microsoft Corporation
- Jeffrey Reents
- H01 - BASIC ELECTRIC ELEMENTS

heatsink to have chip

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat sink

Semiconductor module and vehicle

Electric machine with a heat transfer device for transferring heat...

Heat dissipation structure and heat dissipation method

Apparatus, system, and method for dynamic compensation of heatsink-...

Adjustable heat sink fin spacing

Adjustable heat sink fin spacing

Apparatus, system, and method for dynamic compensation of heatsink-...

Microelectronic components having integrated heat dissipation posts...

Cable connector assembly for an integrated circuit assembly

Electronic device apparatus with multiple thermally conductive path...

Integrated electronic device

Adjustable heat sink fin spacing

Semiconductor device

Semiconductor device

Semiconductor device and method for manufacturing the same

Microelectronic components having integrated heat dissipation posts...

Semiconductor memory device and a chip stack package having the same

Temperature control device, semiconductor device including the same...

Package assembly

Electronic assembly with one or more heat sinks

Three dimensional integrated circuit (3DIC) having a thermally enha...

Fastening systems for power modules

Fan-out wafer level package

Power module package and method for manufacturing the same

Multi-die integrated circuit structure with heat sink

Semiconductor package structures having liquid cooler integrated wi...

Semiconductor package structures having liquid coolers integrated w...

Lidless semiconductor cooling

Semiconductor device

Patents Applicationslast 30 patents

HEAT DISSIPATION FASTENER STRUCTURE

INTEGRATED CIRCUIT DEVICE WITH THERMAL DISSIPATING PACKAGE

POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...

POWER DEVICE AND POWER MODULE

BOARD, ELECTRONIC DEVICE, AND MANUFACTURING METHOD

HEAT SINK

SEMICONDUCTOR MODULE AND VEHICLE

INTEGRATED ELECTRONIC DEVICE

ELECTRONIC DEVICE APPARATUS WITH MULTIPLE THERMALLY CONDUCTIVE PATH...

ELECTRIC MACHINE

HEAT SINK

Positioning assembly for computer radiator

COOLING DEVICE

SEMICONDUCTOR DEVICE

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...

TEMPERATURE CONTROL DEVICE, SEMICONDUCTOR DEVICE INCLUDING THE SAME...

SEMICONDUCTOR DEVICE

SUBSTRATE UNIT AND ELECTRONIC DEVICE

Thermal mgmt. device for high-heat flux electronics

Dual Heat Sinks For Distributing A Thermal Load

MULTI-DIE INTEGRATED CIRCUIT STRUCTURE WITH HEAT SINK

SEMICONDUCTOR DEVICE HAVING DUMMY PATTERN AND DESIGN METHOD THEREOF

Semiconductor Package Structures Having Liquid Cooler Integrated wi...

HEAT DISSIPATING DEVICE

Semiconductor Package Structures Having Liquid Coolers Integrated w...

SEMICONDUCTOR COOLING STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE DEVICE, METHOD OF MANUFACTURING THE SAME, FLAT...

Lidless semiconductor cooling

Integrated heat sink