Hermetically sealing an opening in the lid

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CPC
B81C2203/0145

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/0145Hermetically sealing an opening in the lid

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Micro electro mechanical system (MEMs) device having metal sealing...
- Patent number 12,202,724
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS cavity with non-contaminating seal
- Patent number 12,187,606
- Issue date Jan 7, 2025
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device having decreased contact resistance
- Patent number 12,077,431
- Issue date Sep 3, 2024
- Qorvo US, Inc.
- Shibajyoti Ghosh Dastider
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical structure including a functional element sit...
- Patent number 11,939,215
- Issue date Mar 26, 2024
- Robert Bosch GmbH
- Penny Weir
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed housing with a semiconductor component and meth...
- Patent number 11,876,007
- Issue date Jan 16, 2024
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for sealing entries in a MEMS element
- Patent number 11,851,324
- Issue date Dec 26, 2023
- Robert Bosch GmbH
- Christoph Hermes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for manufacturing thereof
- Patent number 11,807,520
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming dielectric and metal sealing layers on capping st...
- Patent number 11,772,960
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electromechanical system and method for producing same
- Patent number 11,685,645
- Issue date Jun 27, 2023
- LYNRED
- Sylvain Lemettre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical electronics device
- Patent number 11,667,523
- Issue date Jun 6, 2023
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS cavity with non-contaminating seal
- Patent number 11,618,675
- Issue date Apr 4, 2023
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for fabricating the same
- Patent number 11,434,129
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component with a thin-layer covering and method for its production
- Patent number 11,296,673
- Issue date Apr 5, 2022
- Snaptrack, Inc.
- Thomas Metzger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed housing with a semiconductor component and meth...
- Patent number 11,289,353
- Issue date Mar 29, 2022
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated packaging devices and methods with backside interconnect...
- Patent number 11,282,760
- Issue date Mar 22, 2022
- OBSIDIAN SENSORS, INC.
- Yaoling Pan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS cavity with non-contaminating seal
- Patent number 11,220,425
- Issue date Jan 11, 2022
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices and methods of forming same
- Patent number 11,180,365
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chih Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system (MEMS) structures and design struct...
- Patent number 11,167,980
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Michael T. Brigham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic component and module including the same
- Patent number 11,139,795
- Issue date Oct 5, 2021
- Murata Manufacturing Co., Ltd.
- Koichiro Kawasaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor, complex sensor, inertial measurement unit...
- Patent number 11,112,424
- Issue date Sep 7, 2021
- Seiko Epson Corporation
- Juichiro Matsuzawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress reduction during laser resealing through a temperature increase
- Patent number 11,084,716
- Issue date Aug 10, 2021
- Robert Bosch GmbH
- Julia Amthor
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-layer sealing film for high seal yield
- Patent number 11,034,578
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor, physical quantity sensor device, portable...
- Patent number 11,035,875
- Issue date Jun 15, 2021
- Seiko Epson Corporation
- Satoru Tanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a microelectromechanical component and wafer s...
- Patent number 10,994,989
- Issue date May 4, 2021
- Robert Bosch GmbH
- Vijaye Rajaraman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level integrated MEMS device enabled by silicon pillar and sm...
- Patent number 10,961,118
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor generating a transduced signal with reduced ambient...
- Patent number 10,962,431
- Issue date Mar 30, 2021
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method for the same
- Patent number 10,961,114
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing MEMS switches with reduced switching voltage
- Patent number 10,941,036
- Issue date Mar 9, 2021
- International Business Machines Corporation
- Stephen E. Luce
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for sealing an access opening to a cavity and MEMS component...
- Patent number 10,913,656
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Gerhard Metzger-Brueckl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level integrated MEMS device enabled by silicon pillar and sm...
- Patent number 10,899,608
- Issue date Jan 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Packaging of microelectromechanical system devices
- Publication number 20240391762
- Publication date Nov 28, 2024
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES
- Publication number 20240228267
- Publication date Jul 11, 2024
- ROBERT BOSCH GmbH
- Bo CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Systems of Getters for Microelectronics and Methods for Production...
- Publication number 20240174515
- Publication date May 30, 2024
- Mesoline Inc.
- Marnix P. Rebergen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES
- Publication number 20240132342
- Publication date Apr 25, 2024
- ROBERT BOSCH GmbH
- Bo CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE INCLUDI...
- Publication number 20240124299
- Publication date Apr 18, 2024
- STMicroelectronics S.r.l.
- Paolo FERRARI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20230382718
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-CHUAN TENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20230382719
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLUG FOR MEMS CAVITY
- Publication number 20230365399
- Publication date Nov 16, 2023
- Murata Manufacturing Co., Ltd.
- Petteri KILPINEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS CAVITY WITH NON-CONTAMINATING SEAL
- Publication number 20230286798
- Publication date Sep 14, 2023
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Making a MEMS Semiconductor Package
- Publication number 20230192478
- Publication date Jun 22, 2023
- UTAC Headquarters Pte. Ltd.
- Phongsak Sawasdee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED PACKAGE AND METHOD FOR PRODUCING SAME
- Publication number 20230128755
- Publication date Apr 27, 2023
- SCHOTT AG
- Antti Määttänen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20220411260
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-CHUAN TENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220315414
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE HAVING DECREASED CONTACT RESISTANCE
- Publication number 20220289565
- Publication date Sep 15, 2022
- Qorvo US, Inc.
- Shibajyoti Ghosh Dastider
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED HOUSING WITH A SEMICONDUCTOR COMPONENT AND METH...
- Publication number 20220172971
- Publication date Jun 2, 2022
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS CAVITY WITH NON-CONTAMINATING SEAL
- Publication number 20220162063
- Publication date May 26, 2022
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR SEALING ENTRIES IN A MEMS ELEMENT
- Publication number 20220002147
- Publication date Jan 6, 2022
- ROBERT BOSCH GmbH
- Christoph Hermes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE CONTAINING A MEMS DEVICE AND METHOD FO...
- Publication number 20210249371
- Publication date Aug 12, 2021
- Advanced Semiconductor Engineering, Inc.
- Jia-Zhe LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL STRUCTURE INCLUDING A FUNCTIONAL ELEMENT SIT...
- Publication number 20210229986
- Publication date Jul 29, 2021
- ROBERT BOSCH GmbH
- Penny Weir
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING MEMS DEVICE AND MEMS DEVICE
- Publication number 20210229985
- Publication date Jul 29, 2021
- TOHOKU UNIVERSITY
- Yukio SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20210206627
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL ELECTRONICS DEVICE
- Publication number 20210139320
- Publication date May 13, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS CAVITY WITH NON-CONTAMINATING SEAL
- Publication number 20200391997
- Publication date Dec 17, 2020
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20200377362
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED PACKAGING DEVICES AND METHODS WITH BACKSIDE INTERCONNECT...
- Publication number 20200294878
- Publication date Sep 17, 2020
- Obsidian Sensors, Inc.
- Yaoling Pan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS REDUCTION DURING LASER RESEALING THROUGH A TEMPERATURE INCREASE
- Publication number 20200270124
- Publication date Aug 27, 2020
- ROBERT BOSCH GmbH
- Julia AMTHOR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-LAYER SEALING FILM FOR HIGH SEAL YIELD
- Publication number 20200270121
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE AND METHOD FOR SEALING THROUGH-HOLE, AND TRANSFER SUBSTRA...
- Publication number 20200230701
- Publication date Jul 23, 2020
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori OGASHIWA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHODS FOR CMOS-MEMS INTEGRATED DEVICES WITH MULTIPLE SEALED CAVIT...
- Publication number 20200109045
- Publication date Apr 9, 2020
- InvenSense, Inc.
- Michael DANEMAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Devices and Methods of Forming Same
- Publication number 20200062588
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chih Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Hermetically sealing an opening in the lid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Micro electro mechanical system (MEMs) device having metal sealing...

MEMS cavity with non-contaminating seal

MEMS device having decreased contact resistance

Microelectromechanical structure including a functional element sit...

Hermetically sealed housing with a semiconductor component and meth...

Method for sealing entries in a MEMS element

Semiconductor structure and method for manufacturing thereof

Method of forming dielectric and metal sealing layers on capping st...

Micro-electromechanical system and method for producing same

Optical electronics device

MEMS cavity with non-contaminating seal

Semiconductor structure and method for fabricating the same

Component with a thin-layer covering and method for its production

Hermetically sealed housing with a semiconductor component and meth...

Integrated packaging devices and methods with backside interconnect...

MEMS cavity with non-contaminating seal

MEMS devices and methods of forming same

Micro-electro-mechanical system (MEMS) structures and design struct...

Electronic component and module including the same

Physical quantity sensor, complex sensor, inertial measurement unit...

Stress reduction during laser resealing through a temperature increase

Multi-layer sealing film for high seal yield

Physical quantity sensor, physical quantity sensor device, portable...

Method for producing a microelectromechanical component and wafer s...

Wafer level integrated MEMS device enabled by silicon pillar and sm...

Pressure sensor generating a transduced signal with reduced ambient...

Semiconductor structure and manufacturing method for the same

Method of manufacturing MEMS switches with reduced switching voltage

Method for sealing an access opening to a cavity and MEMS component...

Wafer level integrated MEMS device enabled by silicon pillar and sm...

Patents Applicationslast 30 patents

Packaging of microelectromechanical system devices

LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES

Systems of Getters for Microelectronics and Methods for Production...

LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES

PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE INCLUDI...

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

PLUG FOR MEMS CAVITY

MEMS CAVITY WITH NON-CONTAMINATING SEAL

Semiconductor Device and Method of Making a MEMS Semiconductor Package

HERMETICALLY SEALED PACKAGE AND METHOD FOR PRODUCING SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

MEMS DEVICE HAVING DECREASED CONTACT RESISTANCE

HERMETICALLY SEALED HOUSING WITH A SEMICONDUCTOR COMPONENT AND METH...

MEMS CAVITY WITH NON-CONTAMINATING SEAL

METHOD FOR SEALING ENTRIES IN A MEMS ELEMENT

SEMICONDUCTOR DEVICE PACKAGE CONTAINING A MEMS DEVICE AND METHOD FO...

MICROELECTROMECHANICAL STRUCTURE INCLUDING A FUNCTIONAL ELEMENT SIT...

METHOD FOR MANUFACTURING MEMS DEVICE AND MEMS DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

OPTICAL ELECTRONICS DEVICE

MEMS CAVITY WITH NON-CONTAMINATING SEAL

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

INTEGRATED PACKAGING DEVICES AND METHODS WITH BACKSIDE INTERCONNECT...

STRESS REDUCTION DURING LASER RESEALING THROUGH A TEMPERATURE INCREASE

MULTI-LAYER SEALING FILM FOR HIGH SEAL YIELD

STRUCTURE AND METHOD FOR SEALING THROUGH-HOLE, AND TRANSFER SUBSTRA...

METHODS FOR CMOS-MEMS INTEGRATED DEVICES WITH MULTIPLE SEALED CAVIT...

MEMS Devices and Methods of Forming Same