Hierarchy auxiliary PCB

Industry

CPC
H05K2201/045

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/045Hierarchy auxiliary PCB

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power module and power device
- Patent number 11,901,108
- Issue date Feb 13, 2024
- Delta Electronics (Shanghai) Co., Ltd.
- Jin-Fa Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electro-optical flexible circuit board
- Patent number 11,553,598
- Issue date Jan 10, 2023
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inner module with a retainer
- Patent number 11,178,766
- Issue date Nov 16, 2021
- Concraft Holding Co., Ltd.
- Chin-Hsing Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 11,160,176
- Issue date Oct 26, 2021
- Samsung Display Co., Ltd.
- Minsoo Kang
- G02 - OPTICS
Information Patent Grant
Integrated electro-optical flexible circuit board
- Patent number 11,076,491
- Issue date Jul 27, 2021
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printable 3D electronic structure
- Patent number 11,064,609
- Issue date Jul 13, 2021
- X Display Company Technology Limited
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a component embedded package carrier
- Patent number 10,798,822
- Issue date Oct 6, 2020
- Subtron Technology Co., Ltd.
- Jing-Cyuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 10,785,873
- Issue date Sep 22, 2020
- HONG FU JIN PRECISION INDUSTRY (WuHan) CO., I
- Hou-Yuan Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless interconnects on flexible cables between computing platforms
- Patent number 10,498,379
- Issue date Dec 3, 2019
- Intel Corporation
- Telesphor Kamgaing
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device for electrically coupling a plurality of semiconductor devic...
- Patent number 10,257,937
- Issue date Apr 9, 2019
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive device assembly for accurate ground plane control
- Patent number 10,154,591
- Issue date Dec 11, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mountable power delivery bus board
- Patent number 10,123,419
- Issue date Nov 6, 2018
- Intel Corporation
- Jeffrey A. Pihlman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for intrinsically safe circuit board arrangeme...
- Patent number 9,980,381
- Issue date May 22, 2018
- MOTOROLA SOLUTIONS, INC.
- Seng Huan Chuah
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board assembly and method of manufacturing same
- Patent number 9,693,459
- Issue date Jun 27, 2017
- Delphi Technologies, Inc.
- Rodrigo Franco
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board comprising an electronic component integrated...
- Patent number 9,674,960
- Issue date Jun 6, 2017
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 9,042,108
- Issue date May 26, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuhiro Nobori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and manufacturing method of the same
- Patent number 8,557,633
- Issue date Oct 15, 2013
- Renesas Electronics Corporation
- Kunio Shigemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display card assembly
- Patent number 8,550,824
- Issue date Oct 8, 2013
- HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
- Kang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory system
- Patent number 8,537,563
- Issue date Sep 17, 2013
- Hewlett-Packard Development Company, L.P.
- Brian T. Purcell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane for an electronic mounting rack
- Patent number 8,456,857
- Issue date Jun 4, 2013
- ADVA Optical Networking SE
- Uwe Gröschner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory module with vertically accessed interposer assemblies
- Patent number 8,379,391
- Issue date Feb 19, 2013
- SMART Modular Technologies, Inc.
- Mike H. Amidi
- G11 - INFORMATION STORAGE
Information Patent Grant
Electro-optical apparatus, flexible printed circuit board, manufact...
- Patent number 8,144,473
- Issue date Mar 27, 2012
- Seiko Epson Corporation
- Masanori Yumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-channel memory connection system and method
- Patent number 8,131,903
- Issue date Mar 6, 2012
- Hewlett-Packard Development Company, L.P.
- Roger A. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and component mounting method thereof
- Patent number 8,122,598
- Issue date Feb 28, 2012
- Ibiden Co., Ltd.
- Toshihiko Yokomaku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electro-optical apparatus, flexible printed circuit board, manufact...
- Patent number 8,072,765
- Issue date Dec 6, 2011
- Seiko Epson Corporation
- Masanori Yumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Active dual in line memory module connector with re-driven propagat...
- Patent number 8,040,683
- Issue date Oct 18, 2011
- Urenschi Assets Limited Liability Company
- Chris Karabatsos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Disk unit-integrated display and disk unit-integrated television
- Patent number 8,027,570
- Issue date Sep 27, 2011
- Funai Electric Co., Ltd.
- Tomokazu Sugamura
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Solder composition for electronic devices
- Patent number 8,022,551
- Issue date Sep 20, 2011
- Renesas Electronics Corporation
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Communication semiconductor chip, calibration method, and program
- Patent number 7,995,966
- Issue date Aug 9, 2011
- Sony Corporation
- Shunichi Sukegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and daughterboard
- Patent number 7,961,468
- Issue date Jun 14, 2011
- Kabushiki Kaisha Toshiba
- Masahiko Takakusaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Circuit Board Assembly and Radio Unit Comprising the Same
- Publication number 20240080981
- Publication date Mar 7, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Donghai Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Electro-Optical Flexible Circuit Board
- Publication number 20210315108
- Publication date Oct 7, 2021
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Electro-Optical Flexible Circuit Board
- Publication number 20210120680
- Publication date Apr 22, 2021
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20200323080
- Publication date Oct 8, 2020
- HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
- HOU-YUAN CHOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INNER MODULE WITH A RETAINER
- Publication number 20200205287
- Publication date Jun 25, 2020
- CONCRAFT HOLDING CO., LTD.
- Chin-Hsing LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200084899
- Publication date Mar 12, 2020
- SAMSUNG DISPLAY CO., LTD.
- Minsoo KANG
- G02 - OPTICS
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING SAME
- Publication number 20170019998
- Publication date Jan 19, 2017
- Delphi Technologies, Inc.
- Rodrigo Franco
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WIRING BOARD UNIT, METHOD OF MANUFACTURING...
- Publication number 20140312488
- Publication date Oct 23, 2014
- Fujitsu Limited
- Takashi FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY CARD ASSEMBLY
- Publication number 20130164952
- Publication date Jun 27, 2013
- HON HAI Precision Industry CO., LTD.
- KANG WU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY DEVICE
- Publication number 20130141881
- Publication date Jun 6, 2013
- PANASONIC CORPORATION
- Kazuhiro Nobori
- G02 - OPTICS
Information Patent Application
ELECTRONIC APPARATUS AND DAUGHTERBOARD
- Publication number 20110205714
- Publication date Aug 25, 2011
- Kabushiki Kaisha Toshiba
- Masahiko Takakusaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20110183474
- Publication date Jul 28, 2011
- RENESAS ELECTRONICS CORPORATION
- Kunio Shigemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Active Dual in Line Memory Module Connector with Re-driven Propagat...
- Publication number 20110143579
- Publication date Jun 16, 2011
- Chris Karabatsos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRO-OPTICAL APPARATUS, FLEXIBLE PRINTED CIRCUIT BOARD, MANUFACT...
- Publication number 20110051382
- Publication date Mar 3, 2011
- SEIKO EPSON CORPORATION
- Masanori YUMOTO
- G02 - OPTICS
Information Patent Application
BACKPLANE FOR AN ELECTRONIC MOUNTING RACK
- Publication number 20100214755
- Publication date Aug 26, 2010
- Uwe Gröschner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS AND DAUGHTERBOARD
- Publication number 20100172097
- Publication date Jul 8, 2010
- Kabushiki Kaisha Toshiba
- Masahiko Takakusaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY MODULE HAVING VOLTAGE REGULATOR MODULE
- Publication number 20100128447
- Publication date May 27, 2010
- Tyco Electronics Corporation
- ALAN ROBERT MACDOUGALL
- G11 - INFORMATION STORAGE
Information Patent Application
Horizontal Dual In-line Memory Modules
- Publication number 20100062621
- Publication date Mar 11, 2010
- MICHAEL BRUENNERT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Memory Module with Vertically Accessed Interposer Assemblies
- Publication number 20090279243
- Publication date Nov 12, 2009
- Mike H. Amidi
- G11 - INFORMATION STORAGE
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND COMPONENT MOUNTING METHOD THEREOF
- Publication number 20090229873
- Publication date Sep 17, 2009
- IBIDEN CO., LTD.
- Toshihiko Yokomaku
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit board and power amplifier provided thereon
- Publication number 20090163152
- Publication date Jun 25, 2009
- Mike Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY SYSTEM AND METHOD
- Publication number 20090080164
- Publication date Mar 26, 2009
- Hewlett-Packard Development Company, L.P.
- Brian T. Purcell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Three dimensional packaging optimized for high frequency circuitry
- Publication number 20090078456
- Publication date Mar 26, 2009
- William Macropoulos
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC APPARATUS AND DAUGHTERBOARD
- Publication number 20090073655
- Publication date Mar 19, 2009
- Kabushiki Kaisha Toshiba
- Masahiko Takakusaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TEMPORARY CHIP ATTACH TEST CARRIER UTILIZING AN INTERPOSER
- Publication number 20090033337
- Publication date Feb 5, 2009
- Robert W. Pasco
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Coplanar angle mate straddle mount connector
- Publication number 20090017664
- Publication date Jan 15, 2009
- Tyco Electronics Corporation
- Matthew Richard McAlonis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated system on module
- Publication number 20080288906
- Publication date Nov 20, 2008
- Troy D. Kopischke
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of Assembling Electronic Components of an Electronic System,...
- Publication number 20080274587
- Publication date Nov 6, 2008
- International Business Machines Corporation
- Bert J. Offrein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-channel memory connection system and method
- Publication number 20080270649
- Publication date Oct 30, 2008
- Roger A. Pearson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20080253100
- Publication date Oct 16, 2008
- Kunio Shigemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hierarchy auxiliary PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module and power device

Integrated electro-optical flexible circuit board

Inner module with a retainer

Display device and manufacturing method thereof

Integrated electro-optical flexible circuit board

Printable 3D electronic structure

Method of manufacturing a component embedded package carrier

Circuit board

Wireless interconnects on flexible cables between computing platforms

Device for electrically coupling a plurality of semiconductor devic...

Passive device assembly for accurate ground plane control

Surface-mountable power delivery bus board

Method and apparatus for intrinsically safe circuit board arrangeme...

Circuit board assembly and method of manufacturing same

Printed circuit board comprising an electronic component integrated...

Display device

Electronic device and manufacturing method of the same

Display card assembly

Memory system

Backplane for an electronic mounting rack

Memory module with vertically accessed interposer assemblies

Electro-optical apparatus, flexible printed circuit board, manufact...

Multi-channel memory connection system and method

Multilayer printed wiring board and component mounting method thereof

Electro-optical apparatus, flexible printed circuit board, manufact...

Active dual in line memory module connector with re-driven propagat...

Disk unit-integrated display and disk unit-integrated television

Solder composition for electronic devices

Communication semiconductor chip, calibration method, and program

Electronic apparatus and daughterboard

Patents Applicationslast 30 patents

Circuit Board Assembly and Radio Unit Comprising the Same

Integrated Electro-Optical Flexible Circuit Board

Integrated Electro-Optical Flexible Circuit Board

CIRCUIT BOARD

INNER MODULE WITH A RETAINER

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING SAME

METHOD OF MANUFACTURING WIRING BOARD UNIT, METHOD OF MANUFACTURING...

DISPLAY CARD ASSEMBLY

DISPLAY DEVICE

ELECTRONIC APPARATUS AND DAUGHTERBOARD

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

Active Dual in Line Memory Module Connector with Re-driven Propagat...

ELECTRO-OPTICAL APPARATUS, FLEXIBLE PRINTED CIRCUIT BOARD, MANUFACT...

BACKPLANE FOR AN ELECTRONIC MOUNTING RACK

ELECTRONIC APPARATUS AND DAUGHTERBOARD

MEMORY MODULE HAVING VOLTAGE REGULATOR MODULE

Horizontal Dual In-line Memory Modules

Memory Module with Vertically Accessed Interposer Assemblies

MULTILAYER PRINTED WIRING BOARD AND COMPONENT MOUNTING METHOD THEREOF

Circuit board and power amplifier provided thereon

MEMORY SYSTEM AND METHOD

Three dimensional packaging optimized for high frequency circuitry

ELECTRONIC APPARATUS AND DAUGHTERBOARD

TEMPORARY CHIP ATTACH TEST CARRIER UTILIZING AN INTERPOSER

Coplanar angle mate straddle mount connector

Integrated system on module

Method of Assembling Electronic Components of an Electronic System,...

Multi-channel memory connection system and method

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME