Holding means

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CPC
H01L2224/75621

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75621Holding means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Solder member mounting system
- Patent number 11,583,948
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Soo-Hwan Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 11,521,950
- Issue date Dec 6, 2022
- Kioxia Corporation
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder member mounting method and system
- Patent number 11,278,979
- Issue date Mar 22, 2022
- Samsung Electronics Co., Ltd.
- Soo-Hwan Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive pattern printer for downhole tools
- Patent number 10,799,908
- Issue date Oct 13, 2020
- Halliburton Energy Services, Inc.
- Robert L. Reynolds
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method of mounting conductive ball
- Patent number 10,804,240
- Issue date Oct 13, 2020
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting method
- Patent number 9,780,514
- Issue date Oct 3, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihiro Mimura
- G02 - OPTICS
Information Patent Grant
Flip chip bonder and flip chip bonding method
- Patent number 9,536,856
- Issue date Jan 3, 2017
- Shinkawa Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device including grinding sem...
- Patent number 9,425,177
- Issue date Aug 23, 2016
- Micron Technology, Inc.
- Tadashi Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package method
- Patent number 8,900,926
- Issue date Dec 2, 2014
- Hon Hai Precision Industry Co., Ltd.
- Chen-Yu Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING EQUIPMENT
- Publication number 20240234362
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Cheolan KWON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING EQUIPMENT
- Publication number 20240136321
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Cheolan KWON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PIN ARRAYING DEVICE, ARRAY FOR PIN ARRAYING, AND PIN ARRAYING METHOD
- Publication number 20230420407
- Publication date Dec 28, 2023
- TOYAMA PREFECTURAL UNIVERSITY
- Isao SHIMOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20230187285
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- SANG-WON LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTROLLING BOAT/STRIP TYPE SOLDER BALL PLACEMENT SYSTEM
- Publication number 20230086461
- Publication date Mar 23, 2023
- S.S.P. INC.
- Kyouho LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20230054378
- Publication date Feb 23, 2023
- KIOXIA Corporation
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20210082867
- Publication date Mar 18, 2021
- Kioxia Corporation
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING CONDUCTIVE BALL
- Publication number 20200144220
- Publication date May 7, 2020
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MEMBER MOUNTING METHOD AND SYSTEM
- Publication number 20200108459
- Publication date Apr 9, 2020
- Samsung Electronics Co., Ltd.
- Soo-Hwan LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD
- Publication number 20160336291
- Publication date Nov 17, 2016
- Kabushiki Kaisha Toshiba
- Masayuki MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICKHEAD FOR SOLDER BALL PLACEMENT ON AN INTEGRATED CIRCUIT PACKAGE
- Publication number 20160181222
- Publication date Jun 23, 2016
- Mohit Sood
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die Bonder and Bonding Method
- Publication number 20160099225
- Publication date Apr 7, 2016
- Fasford Technology Co., Ltd.
- Kazuo NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Placing and Mounting Solder Balls on an In...
- Publication number 20150228613
- Publication date Aug 13, 2015
- Zen Voce Corporation
- Tu-Chen Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING GRINDING SEM...
- Publication number 20140377886
- Publication date Dec 25, 2014
- Tadashi Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND CHIP PACKAGE METHOD
- Publication number 20130147058
- Publication date Jun 13, 2013
- HON HAI Precision Industry CO., LTD.
- CHEN-YU YU
- H01 - BASIC ELECTRIC ELEMENTS

Holding means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder member mounting system

Semiconductor manufacturing apparatus and method of manufacturing s...

Solder member mounting method and system

Electrically conductive pattern printer for downhole tools

Method of mounting conductive ball

Component mounting method

Flip chip bonder and flip chip bonding method

Method of manufacturing semiconductor device including grinding sem...

Chip package method

Patents Applicationslast 30 patents

SEMICONDUCTOR MANUFACTURING EQUIPMENT

SEMICONDUCTOR MANUFACTURING EQUIPMENT

PIN ARRAYING DEVICE, ARRAY FOR PIN ARRAYING, AND PIN ARRAYING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

METHOD FOR CONTROLLING BOAT/STRIP TYPE SOLDER BALL PLACEMENT SYSTEM

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

METHOD OF MOUNTING CONDUCTIVE BALL

SOLDER MEMBER MOUNTING METHOD AND SYSTEM

SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD

PICKHEAD FOR SOLDER BALL PLACEMENT ON AN INTEGRATED CIRCUIT PACKAGE

Die Bonder and Bonding Method

Apparatus and Method for Placing and Mounting Solder Balls on an In...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING GRINDING SEM...

CHIP PACKAGE AND CHIP PACKAGE METHOD