Holding mechanisms

Industry

CPC
H01J2237/2007

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J2237/00Discharge tubes exposing object to beam

Current Industry

H01J2237/2007Holding mechanisms

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wafer placement table
- Patent number 12,211,671
- Issue date Jan 28, 2025
- NGK Insulators, Ltd.
- Tatsuya Kuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charged particle beam device
- Patent number 12,211,665
- Issue date Jan 28, 2025
- HITACHI HIGH-TECH CORPORATION
- Akito Tanokuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck assembly
- Patent number 12,211,725
- Issue date Jan 28, 2025
- NGK Insulators, Ltd.
- Hiroshi Takebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rating substrate support assemblies based on impedance circuit elec...
- Patent number 12,205,791
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Arvind Shankar Raman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,205,801
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Toshiaki Saijo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method of fabricating same
- Patent number 12,205,802
- Issue date Jan 21, 2025
- Semes Co., Ltd.
- Dong Mok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sample holder
- Patent number 12,205,839
- Issue date Jan 21, 2025
- Kyocera Corporation
- Yoshinori Narazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support designs for a deposition chamber
- Patent number 12,198,967
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Kaushik Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck and substrate fixing device
- Patent number 12,198,968
- Issue date Jan 14, 2025
- Shinko Electric Industries Co., Ltd.
- Kentaro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring device and optical fiber strain measuring jig thereof
- Patent number 12,196,629
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Tong Wu
- G01 - MEASURING TESTING
Information Patent Grant
Wafer placement table
- Patent number 12,191,123
- Issue date Jan 7, 2025
- NGK Insulators, Ltd.
- Hiroshi Takebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inert gas sample transfer for beam systems
- Patent number 12,183,539
- Issue date Dec 31, 2024
- FEI Company
- Libor Novák
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for inspecting electrostatic chuck
- Patent number 12,181,504
- Issue date Dec 31, 2024
- Semes Co., Ltd.
- Su Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon beam angle adjustment in an ion implantation system
- Patent number 12,170,182
- Issue date Dec 17, 2024
- Advanced Ion Beam Technology, Inc.
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck
- Patent number 12,170,219
- Issue date Dec 17, 2024
- Kyocera Corporation
- Naoki Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment apparatus, a method of monitoring a process of man...
- Patent number 12,170,233
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Meehyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer support table and RF rod
- Patent number 12,170,190
- Issue date Dec 17, 2024
- NGK Insulators, Ltd.
- Yutaka Unno
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate support and substrate processing apparatus
- Patent number 12,165,854
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Nobutaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sample holder
- Patent number 12,162,110
- Issue date Dec 10, 2024
- Kyocera Corporation
- Hiromasa Takemori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for performing sample lift-out for highly react...
- Patent number 12,165,832
- Issue date Dec 10, 2024
- FEI Company
- Adam Stokes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and transfer method
- Patent number 12,165,893
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Norihiko Amikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching device and method of manufacturing display device using the...
- Patent number 12,161,041
- Issue date Dec 3, 2024
- Samsung Display Co., Ltd.
- Dae Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing leakage of heat transfer gas and plasma processi...
- Patent number 12,142,462
- Issue date Nov 12, 2024
- Tokyo Electron Limited
- Shinsuke Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing chambers configured for tunable substrate and edg...
- Patent number 12,142,469
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck with multiple radio frequency meshes to control...
- Patent number 12,136,536
- Issue date Nov 5, 2024
- Applied Materials, Inc.
- Edward P. Hammond
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing device and method for manufacturing same
- Patent number 12,136,540
- Issue date Nov 5, 2024
- LG Display Co., Ltd.
- Young Gon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for conditioning semiconductor processing chamber components
- Patent number 12,129,569
- Issue date Oct 29, 2024
- Lam Research Corporation
- Lin Xu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chuck for plasma processing chamber
- Patent number 12,131,890
- Issue date Oct 29, 2024
- Lam Research Corporation
- Ann Erickson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer placement table
- Patent number 12,131,891
- Issue date Oct 29, 2024
- NGK Insulators, Ltd.
- Seiya Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer support device
- Patent number 12,119,212
- Issue date Oct 15, 2024
- Sumitomo Osaka Cement Co., Ltd.
- Masaki Hirayama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER PROCESSING METHOD
- Publication number 20250038033
- Publication date Jan 30, 2025
- Hitachi High-Tech Corporation
- Nozomu YOSHIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR RADIO FREQUENCY GRID DESIGN IN AN ESC TO R...
- Publication number 20250038034
- Publication date Jan 30, 2025
- LAM RESEARCH CORPORATION
- Stephen Topping
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FIXING DEVICE
- Publication number 20250022741
- Publication date Jan 16, 2025
- Shinko Electric Industries Co., Ltd.
- Yuma Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANIPULATING A MICROSCOPIC SAMPLE
- Publication number 20250022677
- Publication date Jan 16, 2025
- FEI Company
- Joseph M. Lebow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENVIRONMENTAL CELL AND ELECTRON MICROSCOPE
- Publication number 20250022678
- Publication date Jan 16, 2025
- Hitachi, Ltd
- Fumiaki ICHIHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK DEVICE AND SUBSTRATE PROCESSING APPARATUS INCLU...
- Publication number 20250022692
- Publication date Jan 16, 2025
- ASM IP HOLDING B.V.
- Koji Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCKS AND SUBSTRATE PROCESSING APPARATUS INCLUDING T...
- Publication number 20250022693
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Iksu BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS, SUBSTRATE PROCESSING APPARATUS, AND TE...
- Publication number 20250022695
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Kazuki HOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS
- Publication number 20250014874
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Takahiko SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING APPARATUS USING PLASMA
- Publication number 20250014871
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Sungwon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER WITH VERTICAL GRID FOR SUPPORTING SUBSTRATES IN COATER
- Publication number 20250014873
- Publication date Jan 9, 2025
- View, Inc.
- Bo Neilan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER EDGE PROFILE CONTROL USING CONNECTED EDGE RING HARDWARE
- Publication number 20250014878
- Publication date Jan 9, 2025
- Applied Materials, Inc.
- Andreas SCHMID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK DEVICE
- Publication number 20250014933
- Publication date Jan 9, 2025
- Sumitomo Osaka Cement Co., Ltd.
- Keisuke MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING MEMBER, FLUID SUPPLYING DEVICE INCLUDING SEALING MEMBER, AN...
- Publication number 20250003536
- Publication date Jan 2, 2025
- SEMES CO., LTD.
- Joon Hee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYOGENIC ELECTROSTATIC CHUCK SYSTEM AND METHOD FOR CONTROLLING SAME
- Publication number 20250006538
- Publication date Jan 2, 2025
- Kwangwoon University Industry-Academic Collaboration Foundation
- Gi Chung KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DIAGNOSTIC APPARATUS, AND APPARATUS FOR FABRICATING SEMICOND...
- Publication number 20250006477
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Haewook PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
- Publication number 20240429033
- Publication date Dec 26, 2024
- TOKYO ELECTRON LIMITED
- Chishio Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SUPPORT DEVICE
- Publication number 20240429032
- Publication date Dec 26, 2024
- Sumitomo Osaka Cement Co., Ltd.
- Masaki HIRAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER EDGE INSPECTION OF CHARGED PARTICLE INSPECTION SYSTEM
- Publication number 20240420916
- Publication date Dec 19, 2024
- ASML NETHERLANDS B.V.
- Xiaoyu JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTIVITY-CONTROLLED DIELECTRIC MATERIALS FOR SUBSTRATE SUPPORTS...
- Publication number 20240420933
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Amir H. Tavakoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOFOCUS METHOD FOR SINGLE BEAM AND MULTI-BEAM SYSTEMS
- Publication number 20240412944
- Publication date Dec 12, 2024
- KLA Corporation
- Weijie Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TEMPERATURE BIASABLE HEATER WITH ADVANCED FAR EDGE ELECTRODE,...
- Publication number 20240412957
- Publication date Dec 12, 2024
- Applied Materials, Inc.
- Gautam PISHARODY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLDING DEVICE
- Publication number 20240404796
- Publication date Dec 5, 2024
- Niterra Co., Ltd.
- Yasuaki KIMIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE, METHOD OF MANUFACTURING THE SAME, ELECTROSTATIC...
- Publication number 20240404862
- Publication date Dec 5, 2024
- Shinko Electric Industries Co., Ltd.
- Ryosuke Hori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240404799
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Shota EZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DEVICE AND OPERATION METHOD THEREFOR
- Publication number 20240387153
- Publication date Nov 21, 2024
- INNOVATION FOR CREATIVE DEVICES CO., LTD.
- Pyung-Woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AFE (ACTIVE FAR EDGE) HEATER/BIPOLAR ESC WITH SIMPLIFIED AND OPTIMI...
- Publication number 20240387154
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Juan Carlos ROCHA-ALVAREZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPER...
- Publication number 20240379400
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Jung Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRESSURE SEAL METHOD AND APPARATUS
- Publication number 20240371607
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR MONITORING SUBSTRATE PROCESSING APPARATUS
- Publication number 20240371611
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- SEJIN OH
- H01 - BASIC ELECTRIC ELEMENTS

Holding mechanisms

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer placement table

Charged particle beam device

Electrostatic chuck assembly

Rating substrate support assemblies based on impedance circuit elec...

Plasma processing apparatus and plasma processing method

Substrate processing apparatus and method of fabricating same

Sample holder

Substrate support designs for a deposition chamber

Electrostatic chuck and substrate fixing device

Measuring device and optical fiber strain measuring jig thereof

Wafer placement table

Inert gas sample transfer for beam systems

Apparatus and method for inspecting electrostatic chuck

Ribbon beam angle adjustment in an ion implantation system

Electrostatic chuck

Plasma treatment apparatus, a method of monitoring a process of man...

Wafer support table and RF rod

Substrate support and substrate processing apparatus

Sample holder

Systems and methods for performing sample lift-out for highly react...

Substrate processing system and transfer method

Etching device and method of manufacturing display device using the...

Method of reducing leakage of heat transfer gas and plasma processi...

Plasma processing chambers configured for tunable substrate and edg...

Electrostatic chuck with multiple radio frequency meshes to control...

Substrate processing device and method for manufacturing same

Method for conditioning semiconductor processing chamber components

Chuck for plasma processing chamber

Wafer placement table

Wafer support device

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER PROCESSING METHOD

METHOD AND APPARATUS FOR RADIO FREQUENCY GRID DESIGN IN AN ESC TO R...

SUBSTRATE FIXING DEVICE

APPARATUS AND METHOD FOR MANIPULATING A MICROSCOPIC SAMPLE

ENVIRONMENTAL CELL AND ELECTRON MICROSCOPE

ELECTROSTATIC CHUCK DEVICE AND SUBSTRATE PROCESSING APPARATUS INCLU...

ELECTROSTATIC CHUCKS AND SUBSTRATE PROCESSING APPARATUS INCLUDING T...

PLASMA PROCESSING APPARATUS, SUBSTRATE PROCESSING APPARATUS, AND TE...

ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS

SEMICONDUCTOR PROCESSING APPARATUS USING PLASMA

CARRIER WITH VERTICAL GRID FOR SUPPORTING SUBSTRATES IN COATER

WAFER EDGE PROFILE CONTROL USING CONNECTED EDGE RING HARDWARE

ELECTROSTATIC CHUCK DEVICE

SEALING MEMBER, FLUID SUPPLYING DEVICE INCLUDING SEALING MEMBER, AN...

CRYOGENIC ELECTROSTATIC CHUCK SYSTEM AND METHOD FOR CONTROLLING SAME

PLASMA DIAGNOSTIC APPARATUS, AND APPARATUS FOR FABRICATING SEMICOND...

PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

WAFER SUPPORT DEVICE

WAFER EDGE INSPECTION OF CHARGED PARTICLE INSPECTION SYSTEM

RESISTIVITY-CONTROLLED DIELECTRIC MATERIALS FOR SUBSTRATE SUPPORTS...

AUTOFOCUS METHOD FOR SINGLE BEAM AND MULTI-BEAM SYSTEMS

HIGH TEMPERATURE BIASABLE HEATER WITH ADVANCED FAR EDGE ELECTRODE,...

HOLDING DEVICE

CERAMIC SUBSTRATE, METHOD OF MANUFACTURING THE SAME, ELECTROSTATIC...

PLASMA PROCESSING APPARATUS

ELECTROSTATIC DEVICE AND OPERATION METHOD THEREFOR

AFE (ACTIVE FAR EDGE) HEATER/BIPOLAR ESC WITH SIMPLIFIED AND OPTIMI...

WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPER...

PRESSURE SEAL METHOD AND APPARATUS

METHOD AND SYSTEM FOR MONITORING SUBSTRATE PROCESSING APPARATUS