Hollow pieces of metal

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CPC
H05K2201/10257

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10257Hollow pieces of metal

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Biocompatible electromechanical connection for ceramic substrate el...
- Patent number 11,904,073
- Issue date Feb 20, 2024
- Verily Life Sciences LLC
- Alexander Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rectangular waveguide communication between memory and processor
- Patent number 11,728,555
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- Yoshihito Koya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connection assembly and pin with a welding section
- Patent number 11,641,071
- Issue date May 2, 2023
- TE CONNECTIVITY SOLUTIONS GmbH
- Yiyang Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biocompatible electromechanical connection for ceramic substrate el...
- Patent number 11,504,453
- Issue date Nov 22, 2022
- Verily Life Sciences LLC
- Alexander Loo
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Connectors for interconnecting microelectronic circuits
- Patent number 11,431,115
- Issue date Aug 30, 2022
- Centipede Systems, Inc.
- Thomas H. Di Stefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and glass with undercut plastic frame
- Patent number 11,392,175
- Issue date Jul 19, 2022
- Apple Inc.
- Douglas G. Fournier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Battery architecture in an electronic device
- Patent number 11,132,024
- Issue date Sep 28, 2021
- Apple Inc.
- David A. Pakula
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Rectangular waveguide communication between memory and processor
- Patent number 11,108,127
- Issue date Aug 31, 2021
- Micron Technology, Inc.
- Yoshihito Koya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of making single reflow power pin connections
- Patent number 10,897,821
- Issue date Jan 19, 2021
- Semiconductor Components Industries, LLC
- Yushuang Yao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery architecture in an electronic device
- Patent number 10,701,833
- Issue date Jun 30, 2020
- Apple Inc.
- David A. Pakula
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive driver board for light bulb
- Patent number 10,655,795
- Issue date May 19, 2020
- Technical Consumer Products, Inc.
- George J. Uhler
- F21 - LIGHTING
Information Patent Grant
Component cooling device
- Patent number 10,638,637
- Issue date Apr 28, 2020
- ZKW GROUP GMBH
- Erik Edlinger
- F21 - LIGHTING
Information Patent Grant
Display module and glass with undercut plastic frame
- Patent number 10,631,437
- Issue date Apr 21, 2020
- Apple Inc.
- Douglas G. Fournier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical assemblies for downhole use
- Patent number 10,631,409
- Issue date Apr 21, 2020
- Baker Hughes, a GE company, LLC
- Rocco Difoggio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and display device including the same
- Patent number 10,624,210
- Issue date Apr 14, 2020
- LG Display Co., Ltd.
- Jaeseung Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Stacked circuit board architecture in an electronic device
- Patent number 10,455,738
- Issue date Oct 22, 2019
- Apple Inc.
- David A. Pakula
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Assembly and lighting device comprising the assembly
- Patent number 10,433,418
- Issue date Oct 1, 2019
- SIGNIFY HOLDING B.V.
- Durandus Kornelius Dijken
- F21 - LIGHTING
Information Patent Grant
Mounting jig for semiconductor device
- Patent number 10,405,434
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Rikihiro Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus having a waveguide formed by the bottom chassis f...
- Patent number 10,383,227
- Issue date Aug 13, 2019
- Samsung Electronics Co., Ltd.
- Sang-Gi Oh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Single reflow power pin connections
- Patent number 10,231,340
- Issue date Mar 12, 2019
- Semiconductor Components Industries, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and power supply apparatus
- Patent number 9,942,988
- Issue date Apr 10, 2018
- TDK Corporation
- Kazuharu Kitatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting jig for semiconductor device
- Patent number 9,877,397
- Issue date Jan 23, 2018
- Fuji Electric Co., Ltd.
- Rikihiro Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and image forming apparatus
- Patent number 9,606,496
- Issue date Mar 28, 2017
- Canon Kabushiki Kaisha
- Satoshi Ogawara
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Printed circuit board, semiconductor device connection structure, a...
- Patent number 9,549,472
- Issue date Jan 17, 2017
- Canon Kabushiki Kaisha
- Ryuichi Shibutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and mounting jig
- Patent number 9,204,559
- Issue date Dec 1, 2015
- Fuji Electric Co., Ltd.
- Rikihiro Maruyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire-printed circuit board or card comprising conductors with a rec...
- Patent number 8,354,594
- Issue date Jan 15, 2013
- Jumatech, GmbH
- Markus Wolfel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and arrangements for forming solder joint connections
- Patent number 7,755,200
- Issue date Jul 13, 2010
- National Semiconductor Corporation
- Hau Nguyen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible ring interconnection system
- Patent number 7,273,380
- Issue date Sep 25, 2007
- Molex Incorporated
- Atsuhito Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible ring interconnection system
- Patent number 7,229,291
- Issue date Jun 12, 2007
- Molex Incorporated
- Atsuhito Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electro-formed ring interconnection system
- Patent number 7,189,079
- Issue date Mar 13, 2007
- Molex Incorporated
- Atsuhito Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING MODULE
- Publication number 20240405379
- Publication date Dec 5, 2024
- AUTONETWORKS TECHNOLOGIES, LTD.
- Shuya IKEDA
- B60 - VEHICLES IN GENERAL
Information Patent Application
BIOCOMPATIBLE ELECTROMECHANICAL CONNECTION FOR CERAMIC SUBSTRATE EL...
- Publication number 20230049960
- Publication date Feb 16, 2023
- Verily Life Sciences LLC
- Alexander Loo
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
DISPLAY MODULE & GLASS WITH UNDERCUT PLASTIC FRAME
- Publication number 20220317728
- Publication date Oct 6, 2022
- Apple Inc.
- Douglas G. FOURNIER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Connectors for Interconnecting Microelectronic Circuits
- Publication number 20210257758
- Publication date Aug 19, 2021
- Centipede Systems, Inc.
- Thomas H. Di Stefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY ARCHITECTURE IN AN ELECTRONIC DEVICE
- Publication number 20200281097
- Publication date Sep 3, 2020
- Apple Inc.
- David A. PAKULA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY MODULE & GLASS WITH UNDERCUT PLASTIC FRAME
- Publication number 20200221609
- Publication date Jul 9, 2020
- Apple Inc.
- Douglas G. FOURNIER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BIOCOMPATIBLE ELECTROMECHANICAL CONNECTION FOR CERAMIC SUBSTRATE EL...
- Publication number 20200171212
- Publication date Jun 4, 2020
- Verily Life Sciences LLC
- Alexander Loo
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
TEMPERATURE-INDIFFERENT LENS MODULE WITH DEPTH-PERCEPTION FUNCTION...
- Publication number 20200137273
- Publication date Apr 30, 2020
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- SHENG-JIE DING
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COMPONENT COOLING DEVICE
- Publication number 20190132988
- Publication date May 2, 2019
- ZKW GROUP GMBH
- Erik EDLINGER
- F21 - LIGHTING
Information Patent Application
SINGLE REFLOW POWER PIN CONNECTIONS
- Publication number 20190116669
- Publication date Apr 18, 2019
- Semiconductor Components Industries, LLC
- Yushuang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE DRIVER BOARD FOR LIGHT BULB
- Publication number 20190101247
- Publication date Apr 4, 2019
- TECHNICAL CONSUMER PRODUCTS, INC.
- George J. UHLER
- F21 - LIGHTING
Information Patent Application
ASSEMBLY AND LIGHTING DEVICE COMPRISING THE ASSEMBLY
- Publication number 20180352650
- Publication date Dec 6, 2018
- PHILIPS LIGHTING HOLDING B.V.
- Durandus Kornelius DIJKEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR CONFIGURING A VERTICAL INTERCONNECTION ACC...
- Publication number 20170359896
- Publication date Dec 14, 2017
- Board of Regents, The University of Texas System
- Chi Yen Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING JIG FOR SEMICONDUCTOR DEVICE
- Publication number 20170339794
- Publication date Nov 23, 2017
- Fuji Electric Co., Ltd.
- Rikihiro MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board Having Longitudinally Tolerant Component Vias
- Publication number 20170164475
- Publication date Jun 8, 2017
- Delphi Technologies, Inc.
- Mark Wayne Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR CONNECTING A CABLE TO A HIGH TEMPERATURE C...
- Publication number 20160233595
- Publication date Aug 11, 2016
- ADVANTEC SENSING AS
- Tore Gundersen
- G01 - MEASURING TESTING
Information Patent Application
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD...
- Publication number 20150092357
- Publication date Apr 2, 2015
- IBIDEN CO., LTD.
- Kazuhiro YOSHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD...
- Publication number 20150092356
- Publication date Apr 2, 2015
- IBIDEN CO., LTD.
- Kazuhiro YOSHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, SEMICONDUCTOR DEVICE CONNECTION STRUCTURE, A...
- Publication number 20140376202
- Publication date Dec 25, 2014
- Ryuichi Shibutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND MOUNTING JIG
- Publication number 20140317896
- Publication date Oct 30, 2014
- Fuji Electric Co., Ltd.
- Rikihiro MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND E...
- Publication number 20110063812
- Publication date Mar 17, 2011
- FUJITSU LIMITED
- Teru NAKANISHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHODS AND ARRANGEMENTS FOR FORMING SOLDER JOINT CONNECTIONS
- Publication number 20100068466
- Publication date Mar 18, 2010
- National Semiconductor Corporation
- Hau NGUYEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire-Printed Circuit Board or Card Comprising Conductors with a Rec...
- Publication number 20080128158
- Publication date Jun 5, 2008
- Markus Wolfel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible ring interconnection system
- Publication number 20070123067
- Publication date May 31, 2007
- Atsuhito Noda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flexible ring interconnection system
- Publication number 20050266702
- Publication date Dec 1, 2005
- Atsuhito Noda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electro-formed ring interconnection system
- Publication number 20050266703
- Publication date Dec 1, 2005
- Atsuhito Noda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Metallic surface mount technology power connector
- Publication number 20040048498
- Publication date Mar 11, 2004
- Hong Huang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder ball and interconnection structure using the same
- Publication number 20030060066
- Publication date Mar 27, 2003
- NEC Corporation
- Tomoko Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array attaching means having improved reliability and met...
- Publication number 20030051909
- Publication date Mar 20, 2003
- Sang-Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLLOW SOLDER STRUCTURE HAVING IMPROVED RELIABILITY AND METHOD OF M...
- Publication number 20030052156
- Publication date Mar 20, 2003
- Sang-Young Kim
- H01 - BASIC ELECTRIC ELEMENTS

Hollow pieces of metal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Biocompatible electromechanical connection for ceramic substrate el...

Rectangular waveguide communication between memory and processor

Connection assembly and pin with a welding section

Biocompatible electromechanical connection for ceramic substrate el...

Connectors for interconnecting microelectronic circuits

Display module and glass with undercut plastic frame

Battery architecture in an electronic device

Rectangular waveguide communication between memory and processor

Method of making single reflow power pin connections

Battery architecture in an electronic device

Conductive driver board for light bulb

Component cooling device

Display module and glass with undercut plastic frame

Electrical assemblies for downhole use

Printed circuit board and display device including the same

Stacked circuit board architecture in an electronic device

Assembly and lighting device comprising the assembly

Mounting jig for semiconductor device

Display apparatus having a waveguide formed by the bottom chassis f...

Single reflow power pin connections

Circuit board and power supply apparatus

Mounting jig for semiconductor device

Printed circuit board and image forming apparatus

Printed circuit board, semiconductor device connection structure, a...

Manufacturing method of semiconductor device and mounting jig

Wire-printed circuit board or card comprising conductors with a rec...

Methods and arrangements for forming solder joint connections

Flexible ring interconnection system

Flexible ring interconnection system

Electro-formed ring interconnection system

Patents Applicationslast 30 patents

WIRING MODULE

BIOCOMPATIBLE ELECTROMECHANICAL CONNECTION FOR CERAMIC SUBSTRATE EL...

DISPLAY MODULE & GLASS WITH UNDERCUT PLASTIC FRAME

Connectors for Interconnecting Microelectronic Circuits

BATTERY ARCHITECTURE IN AN ELECTRONIC DEVICE

DISPLAY MODULE & GLASS WITH UNDERCUT PLASTIC FRAME

BIOCOMPATIBLE ELECTROMECHANICAL CONNECTION FOR CERAMIC SUBSTRATE EL...

TEMPERATURE-INDIFFERENT LENS MODULE WITH DEPTH-PERCEPTION FUNCTION...

COMPONENT COOLING DEVICE

SINGLE REFLOW POWER PIN CONNECTIONS

CONDUCTIVE DRIVER BOARD FOR LIGHT BULB

ASSEMBLY AND LIGHTING DEVICE COMPRISING THE ASSEMBLY

APPARATUS AND METHOD FOR CONFIGURING A VERTICAL INTERCONNECTION ACC...

MOUNTING JIG FOR SEMICONDUCTOR DEVICE

Printed Circuit Board Having Longitudinally Tolerant Component Vias

APPARATUS AND METHOD FOR CONNECTING A CABLE TO A HIGH TEMPERATURE C...

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD...

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD...

PRINTED CIRCUIT BOARD, SEMICONDUCTOR DEVICE CONNECTION STRUCTURE, A...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND MOUNTING JIG

ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND E...

METHODS AND ARRANGEMENTS FOR FORMING SOLDER JOINT CONNECTIONS

Wire-Printed Circuit Board or Card Comprising Conductors with a Rec...

Flexible ring interconnection system

Flexible ring interconnection system

Electro-formed ring interconnection system

Metallic surface mount technology power connector

Solder ball and interconnection structure using the same

Ball grid array attaching means having improved reliability and met...

HOLLOW SOLDER STRUCTURE HAVING IMPROVED RELIABILITY AND METHOD OF M...