Holmium [Ho]

Industry

CPC
H01L2924/01067

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01067Holmium [Ho]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Adhesive member, display device, and manufacturing method of displa...
- Patent number 11,923,330
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Jung Hoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 11,760,059
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Resin molding, surface mounted light emitting apparatus and methods...
- Patent number 11,631,790
- Issue date Apr 18, 2023
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable form of single crystal silicon for high performance ele...
- Patent number 11,456,258
- Issue date Sep 27, 2022
- The Board of Trustees of the University of Illinois
- John A. Rogers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Modulated inductance module
- Patent number 11,201,007
- Issue date Dec 14, 2021
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Resin molding, surface mounted light emitting apparatus and methods...
- Patent number 10,971,656
- Issue date Apr 6, 2021
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molding, surface mounted light emitting apparatus and methods...
- Patent number 10,686,102
- Issue date Jun 16, 2020
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,490,486
- Issue date Nov 26, 2019
- Renesas Electronics Corporation
- Hajime Hasebe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power management module and method of manufacture
- Patent number 10,475,568
- Issue date Nov 12, 2019
- L. Pierre de Rochemont
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 10,434,749
- Issue date Oct 8, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Resin molding, surface mounted light emitting apparatus and methods...
- Patent number 10,263,161
- Issue date Apr 16, 2019
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,115,658
- Issue date Oct 30, 2018
- Renesas Electronics Corporation
- Hajime Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molding, surface mounted light emitting apparatus and methods...
- Patent number 9,929,318
- Issue date Mar 27, 2018
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical components and method of manufacture
- Patent number 9,905,928
- Issue date Feb 27, 2018
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,728,631
- Issue date Aug 8, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Takuya Tsurume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molding, surface mounted light emitting apparatus and methods...
- Patent number 9,634,204
- Issue date Apr 25, 2017
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molding, surface mounted light emitting apparatus and methods...
- Patent number 9,502,624
- Issue date Nov 22, 2016
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,496,204
- Issue date Nov 15, 2016
- Renesas Electronics Corporation
- Hajime Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced structure for a stack of layers in a semiconductor compo...
- Patent number 9,466,579
- Issue date Oct 11, 2016
- NXP B.V.
- Hendrik Pieter Hochstenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Geometry of contact sites at brittle inorganic layers in electronic...
- Patent number 9,449,939
- Issue date Sep 20, 2016
- Koninklijke Philips N.V.
- Petrus Cornelis Paulus Bouten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support mounted electrically interconnected die assembly
- Patent number 9,305,862
- Issue date Apr 5, 2016
- Invensas Corporation
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of automatic fluid dispensing for imprint lithography processes
- Patent number 9,223,202
- Issue date Dec 29, 2015
- Board of Regents, The University of Texas System
- Byung-Jin Choi
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Stacked dual chip package having leveling projections
- Patent number 9,165,866
- Issue date Oct 20, 2015
- Alpha and Omega Semiconductor Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 9,159,656
- Issue date Oct 13, 2015
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Light emitting device and display comprising a plurality of light e...
- Patent number 9,130,130
- Issue date Sep 8, 2015
- Nichia Corporation
- Yoshinori Shimizu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Stretchable form of single crystal silicon for high performance ele...
- Patent number 9,105,555
- Issue date Aug 11, 2015
- The Board of Trustees of the University of Illinois
- John A. Rogers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light-emitting device and method for manufacturing same
- Patent number 9,034,671
- Issue date May 19, 2015
- Nichia Corporation
- Masafumi Kuramoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Methods for wafer bonding, and for nucleating bonding nanophases
- Patent number 9,018,077
- Issue date Apr 28, 2015
- Arizona Board of Regents, a body corporate of the State of Arizona, acting fo...
- Nicole Herbots
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interconnection structure
- Patent number 9,006,910
- Issue date Apr 14, 2015
- Renesas Electronics Corporation
- Ryuichi Oikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for multi-row leadframe and semiconductor package thereof...
- Patent number 8,956,919
- Issue date Feb 17, 2015
- LG Innotek Co., Ltd
- Hyun A. Chun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20240128224
- Publication date Apr 18, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20220216172
- Publication date Jul 7, 2022
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stretchable Form of Single Crystal Silicon for High Performance Ele...
- Publication number 20200013720
- Publication date Jan 9, 2020
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John A. ROGERS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF ROOM TEMPERATURE COVALENT BONDING
- Publication number 20190344534
- Publication date Nov 14, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF ROOM TEMPERATURE COVALENT BONDING
- Publication number 20190344533
- Publication date Nov 14, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027427
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- Hajime HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN MOLDING, SURFACE MOUNTED LIGHT EMITTING APPARATUS AND METHODS...
- Publication number 20180175253
- Publication date Jun 21, 2018
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INSPECTION METHOD AND A SUBSTRATE PROCESSING METHOD
- Publication number 20140367570
- Publication date Dec 18, 2014
- EBARA CORPORATION
- Toshifumi Kimba
- G01 - MEASURING TESTING
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140315338
- Publication date Oct 23, 2014
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140284668
- Publication date Sep 25, 2014
- Takuya TSURUME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20140167238
- Publication date Jun 19, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140084440
- Publication date Mar 27, 2014
- HITACHI HOKKAI SEMICONDUCTOR LTD.
- Hajime HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND DISPLAY COMPRISING A PLURALITY OF LIGHT E...
- Publication number 20140084323
- Publication date Mar 27, 2014
- Nichia Corporation.
- Yoshinori Shimizu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
STACKED DUAL CHIP PACKAGE HAVING LEVELING PROJECTIONS
- Publication number 20140054758
- Publication date Feb 27, 2014
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140035115
- Publication date Feb 6, 2014
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140027780
- Publication date Jan 30, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF LEAD FRAME SUBSTRATE
- Publication number 20140021162
- Publication date Jan 23, 2014
- Toppan Printing Co., Ltd.
- Susumu Maniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ILLUMINATING DEVICE
- Publication number 20130221866
- Publication date Aug 29, 2013
- Akeo Kasakura
- F21 - LIGHTING
Information Patent Application
RESIN MOLDING, SURFACE MOUNTED LIGHT EMITTING APPARATUS AND METHODS...
- Publication number 20130193436
- Publication date Aug 1, 2013
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE S...
- Publication number 20130193467
- Publication date Aug 1, 2013
- Nichia Corporation.
- Takeshi KUSUSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Management Module and Method of Manufacture
- Publication number 20130175664
- Publication date Jul 11, 2013
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Application
Support mounted electrically interconnected die assembly
- Publication number 20130099392
- Publication date Apr 25, 2013
- Vertical Circuits, Inc.
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stretchable Form of Single Crystal Silicon for High Performance Ele...
- Publication number 20130100618
- Publication date Apr 25, 2013
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOI
- John A. ROGERS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE MEMBER, PRODUCTION METHOD OF SEMICONDUCTOR-DEV...
- Publication number 20130037748
- Publication date Feb 14, 2013
- MITSUBISHI CHEMICAL CORPORATION
- Hanako Kato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PHOTOVOLTAIC DEVICE ELECTRICAL CONTACTS
- Publication number 20130000709
- Publication date Jan 3, 2013
- E I DU PONT DE NEMOURS AND COMPANY NORTH CAROLINA STATE UNIVERSITY
- WILLIAM J. BORLAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...
- Publication number 20130001280
- Publication date Jan 3, 2013
- SHINKAWA LTD.
- Toru MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Making Solder-top Enhanced Semiconductor Device of Low P...
- Publication number 20120289001
- Publication date Nov 15, 2012
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUC...
- Publication number 20120273974
- Publication date Nov 1, 2012
- HITACHI CHEMICAL CO., Ltd.
- Shigeki Katogi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WAFERSCALE SPACER
- Publication number 20120261810
- Publication date Oct 18, 2012
- Sang-Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR DC-DC CONVERTER
- Publication number 20120248593
- Publication date Oct 4, 2012
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS

Holmium [Ho]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Adhesive member, display device, and manufacturing method of displa...

Method of room temperature covalent bonding

Resin molding, surface mounted light emitting apparatus and methods...

Stretchable form of single crystal silicon for high performance ele...

Modulated inductance module

Resin molding, surface mounted light emitting apparatus and methods...

Resin molding, surface mounted light emitting apparatus and methods...

Semiconductor device

Power management module and method of manufacture

Method of room temperature covalent bonding

Resin molding, surface mounted light emitting apparatus and methods...

Semiconductor device

Resin molding, surface mounted light emitting apparatus and methods...

Electrical components and method of manufacture

Semiconductor device and method for manufacturing the same

Resin molding, surface mounted light emitting apparatus and methods...

Resin molding, surface mounted light emitting apparatus and methods...

Semiconductor device

Reinforced structure for a stack of layers in a semiconductor compo...

Geometry of contact sites at brittle inorganic layers in electronic...

Support mounted electrically interconnected die assembly

Method of automatic fluid dispensing for imprint lithography processes

Stacked dual chip package having leveling projections

Semiconductor die package and method for making the same

Light emitting device and display comprising a plurality of light e...

Stretchable form of single crystal silicon for high performance ele...

Light-emitting device and method for manufacturing same

Methods for wafer bonding, and for nucleating bonding nanophases

Interconnection structure

Structure for multi-row leadframe and semiconductor package thereof...

Patents Applicationslast 30 patents

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

Stretchable Form of Single Crystal Silicon for High Performance Ele...

METHOD OF ROOM TEMPERATURE COVALENT BONDING

METHOD OF ROOM TEMPERATURE COVALENT BONDING

SEMICONDUCTOR DEVICE

RESIN MOLDING, SURFACE MOUNTED LIGHT EMITTING APPARATUS AND METHODS...

SUBSTRATE INSPECTION METHOD AND A SUBSTRATE PROCESSING METHOD

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DEVICE

LIGHT EMITTING DEVICE AND DISPLAY COMPRISING A PLURALITY OF LIGHT E...

STACKED DUAL CHIP PACKAGE HAVING LEVELING PROJECTIONS

SEMICONDUCTOR DEVICE

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME

MANUFACTURING METHOD OF LEAD FRAME SUBSTRATE

ILLUMINATING DEVICE

RESIN MOLDING, SURFACE MOUNTED LIGHT EMITTING APPARATUS AND METHODS...

SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE S...

Power Management Module and Method of Manufacture

Support mounted electrically interconnected die assembly

Stretchable Form of Single Crystal Silicon for High Performance Ele...

SEMICONDUCTOR DEVICE MEMBER, PRODUCTION METHOD OF SEMICONDUCTOR-DEV...

PHOTOVOLTAIC DEVICE ELECTRICAL CONTACTS

METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...

Method for Making Solder-top Enhanced Semiconductor Device of Low P...

ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUC...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WAFERSCALE SPACER

PACKAGE STRUCTURE FOR DC-DC CONVERTER