horizontal transfer of a batch of workpieces

Industry

CPC
H01L21/67754

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67754horizontal transfer of a batch of workpieces

Industries

Patents Grantslast 30 patents

Information Patent Grant
Processing system having a front opening unified pod (FOUP) load lock
- Patent number 11,923,217
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- Jacob Newman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robot apparatus including dual end effectors with variable pitch an...
- Patent number 11,883,958
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Karuppasamy Muthukamatchy
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Substrate processing apparatus and recording medium
- Patent number 11,876,010
- Issue date Jan 16, 2024
- Kokusai Electric Corporation
- Tadashi Okazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate liquid processing apparatus
- Patent number 11,869,780
- Issue date Jan 9, 2024
- Tokyo Electron Limited
- Takahiro Kawazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,856,655
- Issue date Dec 26, 2023
- Tokyo Electron Limited
- Hirofumi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preparation method for bifacial perc solar cell
- Patent number 11,848,395
- Issue date Dec 19, 2023
- GUANGDONG AIKO SOLAR ENERGY TECHNOLOGY CO., LTD.
- Jiebin Fang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for attaching semiconductor parts
- Patent number 11,823,920
- Issue date Nov 21, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Substrate transport system and substrate transport method
- Patent number 11,776,831
- Issue date Oct 3, 2023
- Tokyo Electron Limited
- Takehiro Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic wafer centering method and apparatus
- Patent number 11,764,093
- Issue date Sep 19, 2023
- BROOKS AUTOMATION US, LLC
- Alexander Krupyshev
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method of manufacturing semiconductor device by setting process cha...
- Patent number 11,749,550
- Issue date Sep 5, 2023
- Kokusai Electric Corporation
- Yasuhiro Mizuguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cluster tool for selective area deposition
- Patent number 11,725,274
- Issue date Aug 15, 2023
- Applied Materials, Inc.
- Tobin Kaufman-Osborn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High pressure and high temperature anneal chamber
- Patent number 11,694,912
- Issue date Jul 4, 2023
- Applied Materials, Inc.
- Jean Delmas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch processing oven and operating methods
- Patent number 11,688,621
- Issue date Jun 27, 2023
- YIELD ENGINEERING SYSTEMS, INC.
- Mark William Curry
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Grant
Substrate liquid processing apparatus
- Patent number 11,637,026
- Issue date Apr 25, 2023
- Tokyo Electron Limited
- Hiroyuki Masutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing system and operating method of the same
- Patent number 11,538,705
- Issue date Dec 27, 2022
- ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA
- Larry Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Load lock device having optical measuring device for acquiring dist...
- Patent number 11,521,883
- Issue date Dec 6, 2022
- NANYA TECHNOLOGY CORPORATION
- Chia-Fu Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and methods for automatically handling die carriers
- Patent number 11,508,596
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing method, substr...
- Patent number 11,426,834
- Issue date Aug 30, 2022
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and method of manufacturing semicond...
- Patent number 11,404,291
- Issue date Aug 2, 2022
- Kokusai Electric Corporation
- Hiroshi Hirotani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate transfer mechanism, substrate processing apparatus, and s...
- Patent number 11,404,299
- Issue date Aug 2, 2022
- Tokyo Electron Limited
- Shinji Wakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 11,380,540
- Issue date Jul 5, 2022
- Kokusai Electric Corporation
- Takashi Nakagawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processing system having a front opening unified pod (FOUP) load lock
- Patent number 11,380,564
- Issue date Jul 5, 2022
- Applied Materials, Inc.
- Jacob Newman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device by setting process cha...
- Patent number 11,355,372
- Issue date Jun 7, 2022
- Kokusai Electric Corporation
- Yasuhiro Mizuguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system
- Patent number 11,355,384
- Issue date Jun 7, 2022
- Samsung Display Co., Ltd.
- Dongseok Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device by setting process cha...
- Patent number 11,342,212
- Issue date May 24, 2022
- Kokusai Electric Corporation
- Yasuhiro Mizuguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer holder and wafer transfer apparatus, system and method
- Patent number 11,309,209
- Issue date Apr 19, 2022
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Gang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transport carrier docking device
- Patent number 11,302,553
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thickness compensation by modulation of number of deposition cycles...
- Patent number 11,286,560
- Issue date Mar 29, 2022
- Lam Research Corporation
- Richard Phillips
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Buffer chamber wafer heating mechanism and supporting robots
- Patent number 11,264,258
- Issue date Mar 1, 2022
- Applied Materials, Inc.
- William T. Weaver
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing a thin film and a method therefor
- Patent number 11,244,822
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsai-Fu Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240128111
- Publication date Apr 18, 2024
- SEMES CO., LTD.
- Byungin AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATIC WAFER CENTERING METHOD AND APPARATUS
- Publication number 20240087938
- Publication date Mar 14, 2024
- BROOKS AUTOMATION US, LLC
- Alexander KRUPYSHEV
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SUBSTRATE TREATING APPARATUS
- Publication number 20230420280
- Publication date Dec 28, 2023
- SCREEN Holdings Co., Ltd.
- Tadashi MAEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY SETTING PROCESS CHA...
- Publication number 20230360942
- Publication date Nov 9, 2023
- Kokusai Electric Corporation
- Yasuhiro MIZUGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLY DEVICE
- Publication number 20230361077
- Publication date Nov 9, 2023
- LG ELECTRONICS INC.
- Byungjun KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STATION PROCESSING CHAMBER FOR SEMICONDUCTOR
- Publication number 20230274957
- Publication date Aug 31, 2023
- PIOTECH CO., LTD.
- HUAQIANG TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
- Publication number 20230268202
- Publication date Aug 24, 2023
- TOKYO ELECTRON LIMITED
- Keita HIRASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LOCKING MECHANISM, WAFER POSITIONING DEVICE AND WAFER CONVEYI...
- Publication number 20230223293
- Publication date Jul 13, 2023
- Zhongke Jingyuan Electron Limited, Beijing (CN)
- Lei JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TRANSFER METHOD
- Publication number 20230215754
- Publication date Jul 6, 2023
- Tokyo Electron Limited
- Satoru KAWAKAMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF HEAT-TREATING SILICON WAFER USING LATERAL HEAT TREATMENT...
- Publication number 20230212786
- Publication date Jul 6, 2023
- SUMCO CORPORATION
- Yoshihiro KUWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH PROCESSING OVEN FOR MAGNETIC ANNEAL
- Publication number 20230117184
- Publication date Apr 20, 2023
- Yield Engineering Systems, Inc.
- M. Ziaul Karim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR AUTOMATICALLY HANDLING DIE CARRIERS
- Publication number 20230063707
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM HAVING A FRONT OPENING UNIFIED POD (FOUP) LOAD LOCK
- Publication number 20220406630
- Publication date Dec 22, 2022
- Applied Materials, Inc.
- Jacob NEWMAN
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20220319876
- Publication date Oct 6, 2022
- TOKYO ELECTRON LIMITED
- Shinichi Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Load Lock Device Having Optical Measuring Device for Acquiring Dist...
- Publication number 20220285195
- Publication date Sep 8, 2022
- NANYA TECHNOLOGY CORPORATION
- CHIA-FU CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE HOLDING APPARATUS, AND ME...
- Publication number 20220246463
- Publication date Aug 4, 2022
- Kokusai Electric Corporation
- Keishin YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPORT CARRIER DOCKING DEVICE
- Publication number 20220223449
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS MODULE, SUBSTRATE PROCESSING SYSTEM, AND PROCESSING METHOD
- Publication number 20220213594
- Publication date Jul 7, 2022
- TOKYO ELECTRON LIMITED
- Takayuki YAMAGISHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BATCH PROCESSING OVEN AND OPERATING METHODS
- Publication number 20220189809
- Publication date Jun 16, 2022
- Yield Engineering Systems, Inc.
- Mark William Curry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MANUFACTURING A THIN FILM AND A METHOD THEREFOR
- Publication number 20220181143
- Publication date Jun 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Fu HSIAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE AND METHOD FOR TREATING WAFERS
- Publication number 20220173265
- Publication date Jun 2, 2022
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Martin ZIMMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY SETTING PROCESS CHA...
- Publication number 20220115254
- Publication date Apr 14, 2022
- Kokusai Electric Corporation
- Yasuhiro MIZUGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20220088793
- Publication date Mar 24, 2022
- SCREEN Holdings Co., Ltd.
- Tomoyuki SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER APPARATUS AND TRANSFER METHOD
- Publication number 20220076977
- Publication date Mar 10, 2022
- TOKYO ELECTRON LIMITED
- Tomonori HORIUCHI
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Automated Batch Production Thin Film Deposition Systems and Methods...
- Publication number 20220076976
- Publication date Mar 10, 2022
- VEECO INSTRUMENTS INC.
- Michael W. Pacier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSPORT SYSTEM AND SUBSTRATE TRANSPORT METHOD
- Publication number 20220020622
- Publication date Jan 20, 2022
- TOKYO ELECTRON LIMITED
- Takehiro Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PRESSURE AND HIGH TEMPERATURE ANNEAL CHAMBER
- Publication number 20220013375
- Publication date Jan 13, 2022
- Applied Materials, Inc.
- Jean DELMAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROBOT APPARATUS AND SYSTEMS, AND METHODS FOR TRANSPORTING SUBSTRATE...
- Publication number 20210407837
- Publication date Dec 30, 2021
- Applied Materials, Inc.
- Jeffrey C. Hudgens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATIC WAFER CENTERING METHOD AND APPARATUS
- Publication number 20210375657
- Publication date Dec 2, 2021
- Brooks Automation, Inc.
- Alexander KRUPYSHEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR AUTOMATICALLY HANDLING DIE CARRIERS
- Publication number 20210375653
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Sheng KUO
- H01 - BASIC ELECTRIC ELEMENTS

horizontal transfer of a batch of workpieces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Processing system having a front opening unified pod (FOUP) load lock

Robot apparatus including dual end effectors with variable pitch an...

Substrate processing apparatus and recording medium

Substrate liquid processing apparatus

Substrate processing apparatus and substrate processing method

Preparation method for bifacial perc solar cell

Apparatus for attaching semiconductor parts

Substrate transport system and substrate transport method

Automatic wafer centering method and apparatus

Method of manufacturing semiconductor device by setting process cha...

Integrated cluster tool for selective area deposition

High pressure and high temperature anneal chamber

Batch processing oven and operating methods

Substrate liquid processing apparatus

Plasma processing system and operating method of the same

Load lock device having optical measuring device for acquiring dist...

Apparatus and methods for automatically handling die carriers

Substrate processing apparatus, substrate processing method, substr...

Substrate processing apparatus and method of manufacturing semicond...

Substrate transfer mechanism, substrate processing apparatus, and s...

Substrate processing apparatus

Processing system having a front opening unified pod (FOUP) load lock

Method of manufacturing semiconductor device by setting process cha...

Substrate processing system

Method of manufacturing semiconductor device by setting process cha...

Wafer holder and wafer transfer apparatus, system and method

Transport carrier docking device

Thickness compensation by modulation of number of deposition cycles...

Buffer chamber wafer heating mechanism and supporting robots

Apparatus for manufacturing a thin film and a method therefor

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

AUTOMATIC WAFER CENTERING METHOD AND APPARATUS

SUBSTRATE TREATING APPARATUS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY SETTING PROCESS CHA...

SELF-ASSEMBLY DEVICE

MULTI-STATION PROCESSING CHAMBER FOR SEMICONDUCTOR

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

WAFER LOCKING MECHANISM, WAFER POSITIONING DEVICE AND WAFER CONVEYI...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TRANSFER METHOD

METHOD OF HEAT-TREATING SILICON WAFER USING LATERAL HEAT TREATMENT...

BATCH PROCESSING OVEN FOR MAGNETIC ANNEAL

APPARATUS AND METHODS FOR AUTOMATICALLY HANDLING DIE CARRIERS

PROCESSING SYSTEM HAVING A FRONT OPENING UNIFIED POD (FOUP) LOAD LOCK

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Load Lock Device Having Optical Measuring Device for Acquiring Dist...

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE HOLDING APPARATUS, AND ME...

TRANSPORT CARRIER DOCKING DEVICE

PROCESS MODULE, SUBSTRATE PROCESSING SYSTEM, AND PROCESSING METHOD

BATCH PROCESSING OVEN AND OPERATING METHODS

APPARATUS FOR MANUFACTURING A THIN FILM AND A METHOD THEREFOR

DEVICE AND METHOD FOR TREATING WAFERS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY SETTING PROCESS CHA...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

TRANSFER APPARATUS AND TRANSFER METHOD

Automated Batch Production Thin Film Deposition Systems and Methods...

SUBSTRATE TRANSPORT SYSTEM AND SUBSTRATE TRANSPORT METHOD

HIGH PRESSURE AND HIGH TEMPERATURE ANNEAL CHAMBER

ROBOT APPARATUS AND SYSTEMS, AND METHODS FOR TRANSPORTING SUBSTRATE...

AUTOMATIC WAFER CENTERING METHOD AND APPARATUS

APPARATUS AND METHODS FOR AUTOMATICALLY HANDLING DIE CARRIERS