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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor arrangement and method for producing the same
- Patent number 11,942,449
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Frank Sauerland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,342,276
- Issue date May 24, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for communication across a capacitively coupled channel
- Patent number 10,804,845
- Issue date Oct 13, 2020
- Texas Instruments Incorporated
- Subhashish Mukherjee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Compensation device for transistors
- Patent number 10,763,228
- Issue date Sep 1, 2020
- Infineon Technologies AG
- David Seebacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,546,819
- Issue date Jan 28, 2020
- TOSHIBA MEMORY CORPORATION
- Satoru Takaku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IGBT die structure with auxiliary P well terminal
- Patent number 10,535,760
- Issue date Jan 14, 2020
- Littelfuse, Inc.
- Kyoung Wook Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable losses on bond wire arrangement
- Patent number 10,312,905
- Issue date Jun 4, 2019
- NXP USA, INC.
- Youri Volokhine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a power module with a magnetic device having a co...
- Patent number 10,304,615
- Issue date May 28, 2019
- Enpirion, Inc.
- Ashraf W. Lotfi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding methods and systems incorporating metal nanoparticles
- Patent number 10,283,482
- Issue date May 7, 2019
- Lockheed Martin Corporation
- Randall Mark Stoltenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including package substrate and chip stack in...
- Patent number 10,283,486
- Issue date May 7, 2019
- Samsung Electronics Co., Ltd.
- Jin-Young Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor die with drain via arrangement, and methods of manufactu...
- Patent number 10,103,233
- Issue date Oct 16, 2018
- NXP USA, INC.
- Ibrahim Khalil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable losses of bond wire arrangement
- Patent number 9,979,388
- Issue date May 22, 2018
- NXP USA, INC.
- Youri Volokhine
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
IGBT die structure with auxiliary P well terminal
- Patent number 9,911,838
- Issue date Mar 6, 2018
- IXYS Corporation
- Kyoung Wook Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding methods and systems incorporating metal nanoparticles
- Patent number 9,881,895
- Issue date Jan 30, 2018
- Lockheed Martin Corporation
- Randall Mark Stoltenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit module having a first die with a power amplifier...
- Patent number 9,583,471
- Issue date Feb 28, 2017
- Qorvo US, Inc.
- Douglas Andrew Teeter
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package with multi-level die block
- Patent number 9,275,944
- Issue date Mar 1, 2016
- Infineon Technologies AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated interference shielding and me...
- Patent number 8,987,889
- Issue date Mar 24, 2015
- Skyworks Solutions, Inc.
- Patrick Lawrence Welch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and process for overcoming wire-bond originated cross-talk
- Patent number 8,922,246
- Issue date Dec 30, 2014
- Marvell Israel (M.I.S.L) Ltd.
- Liav Ben Artsi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package with integrated interference shielding and me...
- Patent number 8,748,230
- Issue date Jun 10, 2014
- Skyworks Solutions, Inc.
- Patrick L. Welch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated interference shielding and me...
- Patent number 8,373,264
- Issue date Feb 12, 2013
- Skyworks Solutions, Inc.
- Patrick L. Welch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive isolation circuitry with improved common mode detector
- Patent number 7,902,627
- Issue date Mar 8, 2011
- Silicon Laboratories Inc.
- Zhiwei Dong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
System and process for overcoming wire-bond originated cross-talk
- Patent number 7,456,655
- Issue date Nov 25, 2008
- Marvell Israel (M.I.S.L) Ltd.
- Liav Ben Artsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having optimized wire bond positioning
- Patent number 6,812,580
- Issue date Nov 2, 2004
- FREESCALE SEMICONDUCTOR, INC.
- Robert J. Wenzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spatially separated uninsulated twisted wire pair
- Patent number 5,471,010
- Issue date Nov 28, 1995
- Motorola, Inc.
- David E. Bockelman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Interconnection structure for crosstalk reduction to improve off-ch...
- Patent number 5,376,902
- Issue date Dec 27, 1994
- Motorola, Inc.
- David E. Bockelman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
PASSIVE ELEMENT AND ELECTRONIC DEVICE
- Publication number 20240282866
- Publication date Aug 22, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kento KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES U...
- Publication number 20240055395
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Manho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230411354
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Chihong SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH METAL INTERPOSER
- Publication number 20230134332
- Publication date May 4, 2023
- MEDIATEK INC.
- Chu-Chia Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH DIRECT ATTACH TO CIRCUIT BOARDS
- Publication number 20230082706
- Publication date Mar 16, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220246542
- Publication date Aug 4, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD FOR PRODUCING THE SAME
- Publication number 20210242163
- Publication date Aug 5, 2021
- INFINEON TECHNOLOGIES AG
- Frank Sauerland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR COMMUNICATION ACROSS A CAPACITIVELY COUPLED CHANNEL
- Publication number 20200044605
- Publication date Feb 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Subhashish Mukherjee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ADJUSTABLE LOSSES OF BOND WIRE ARRANGEMENT
- Publication number 20180269873
- Publication date Sep 20, 2018
- NXP USA, Inc.
- Youri VOLOKHINE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
IGBT Die Structure With Auxiliary P Well Terminal
- Publication number 20180145162
- Publication date May 24, 2018
- IXYS Corporation
- Kyoung Wook Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180145053
- Publication date May 24, 2018
- Samsung Electronics Co., Ltd.
- JIN-YOUNG JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES
- Publication number 20180138143
- Publication date May 17, 2018
- Lockheed Martin Corporation
- Randall Mark STOLTENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180076146
- Publication date Mar 15, 2018
- Toshiba Memory Corporation
- Satoru TAKAKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES
- Publication number 20170053895
- Publication date Feb 23, 2017
- Lockheed Martin Corporation
- Randall Mark STOLTENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT MODULE HAVING A FIRST DIE WITH A POWER AMPLIFIER...
- Publication number 20150200189
- Publication date Jul 16, 2015
- RF Micro Devices, Inc.
- Douglas Andrew Teeter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED INTERFERENCE SHIELDING AND ME...
- Publication number 20140353807
- Publication date Dec 4, 2014
- Patrick Lawrence Welch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IGBT DIE STRUCTURE WITH AUXILIARY P WELL TERMINAL
- Publication number 20140118055
- Publication date May 1, 2014
- IXYS Corporation
- Kyoung Wook Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED INTERFERENCE SHIELDING AND ME...
- Publication number 20140030852
- Publication date Jan 30, 2014
- SKYWORKS SOLUTIONS, INC.
- Patrick Lawrence Welch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED INTERFERENCE SHIELDING AND ME...
- Publication number 20110084378
- Publication date Apr 14, 2011
- SKYWORKS SOLUTIONS, INC.
- Patrick L. Welch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE ISOLATION CIRCUITRY WITH IMPROVED COMMON MODE DETECTOR
- Publication number 20090243028
- Publication date Oct 1, 2009
- Silicon Laboratories Inc.
- ZHIWEI DONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor arrangement and method for producing the same

Semiconductor device and method of manufacturing semiconductor device

Apparatus for communication across a capacitively coupled channel

Compensation device for transistors

Semiconductor device and method of manufacturing the same

IGBT die structure with auxiliary P well terminal

Adjustable losses on bond wire arrangement

Method of forming a power module with a magnetic device having a co...

Wire bonding methods and systems incorporating metal nanoparticles

Semiconductor package including package substrate and chip stack in...

Transistor die with drain via arrangement, and methods of manufactu...

Adjustable losses of bond wire arrangement

IGBT die structure with auxiliary P well terminal

Wire bonding methods and systems incorporating metal nanoparticles

Integrated circuit module having a first die with a power amplifier...

Semiconductor package with multi-level die block

Semiconductor package with integrated interference shielding and me...

System and process for overcoming wire-bond originated cross-talk

Semiconductor package with integrated interference shielding and me...

Semiconductor package with integrated interference shielding and me...

Capacitive isolation circuitry with improved common mode detector

System and process for overcoming wire-bond originated cross-talk

Semiconductor package having optimized wire bond positioning

Spatially separated uninsulated twisted wire pair

Interconnection structure for crosstalk reduction to improve off-ch...

Patents Applicationslast 30 patents

PASSIVE ELEMENT AND ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES U...

SEMICONDUCTOR PACKAGE

LEADFRAME PACKAGE WITH METAL INTERPOSER

MICROELECTRONIC ASSEMBLIES WITH DIRECT ATTACH TO CIRCUIT BOARDS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR ARRANGEMENT AND METHOD FOR PRODUCING THE SAME

APPARATUS FOR COMMUNICATION ACROSS A CAPACITIVELY COUPLED CHANNEL

ADJUSTABLE LOSSES OF BOND WIRE ARRANGEMENT

IGBT Die Structure With Auxiliary P Well Terminal

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES

INTEGRATED CIRCUIT MODULE HAVING A FIRST DIE WITH A POWER AMPLIFIER...

SEMICONDUCTOR PACKAGE WITH INTEGRATED INTERFERENCE SHIELDING AND ME...

IGBT DIE STRUCTURE WITH AUXILIARY P WELL TERMINAL

SEMICONDUCTOR PACKAGE WITH INTEGRATED INTERFERENCE SHIELDING AND ME...

SEMICONDUCTOR PACKAGE WITH INTEGRATED INTERFERENCE SHIELDING AND ME...

CAPACITIVE ISOLATION CIRCUITRY WITH IMPROVED COMMON MODE DETECTOR