Housing with external bump or bump-like connectors

Industry

CPC
H01L2225/06586

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06586Housing with external bump or bump-like connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 12,148,735
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separate inter-die connectors for data and error correction informa...
- Patent number 12,141,084
- Issue date Nov 12, 2024
- Lodestar Licensing Group LLC
- Vijayakrishna J. Vankayala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package having an interposer in which one or more die...
- Patent number 12,136,597
- Issue date Nov 5, 2024
- Mediatek Inc.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method forming same
- Patent number 12,125,833
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-dielectric vias for direct connection and method forming same
- Patent number 12,125,820
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation of microelectronic components with direct bonding inter...
- Patent number 12,119,317
- Issue date Oct 15, 2024
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,119,329
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Eunkyul Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device and shielding housing o...
- Patent number 12,107,054
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Nuo Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with re-fill layer
- Patent number 12,100,634
- Issue date Sep 24, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Command and address interface regions, and associated devices and s...
- Patent number 12,100,471
- Issue date Sep 24, 2024
- Kazuhiro Yoshida
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,094,794
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold compound dispensing system and method
- Patent number 12,083,715
- Issue date Sep 10, 2024
- Morgan, Lewis & Bockius LLP
- Xianlu Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,087,745
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation in semiconductor packages and methods of forming same
- Patent number 12,074,148
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,062,627
- Issue date Aug 13, 2024
- Renesas Electronics Corporation
- Yoshihiro Ohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory package, storage device including memory package, and storag...
- Patent number 12,057,191
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Ji-Yeon Shin
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit packages
- Patent number 12,057,439
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with glass spacer
- Patent number 12,046,581
- Issue date Jul 23, 2024
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method for manufacturing the same
- Patent number 12,040,313
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a through intervia through the molding...
- Patent number 12,033,976
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,033,946
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 12,033,929
- Issue date Jul 9, 2024
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking semiconductor assemblies with near zero...
- Patent number 12,027,498
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor module including the same
- Patent number 12,015,015
- Issue date Jun 18, 2024
- SK hynix Inc.
- Byung Jun Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D package structure and methods of forming same
- Patent number 12,009,345
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,002,778
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,996,387
- Issue date May 28, 2024
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,996,392
- Issue date May 28, 2024
- SK hynix Inc.
- Eun Hye Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging semiconductor, semiconductor package structure...
- Patent number 11,990,451
- Issue date May 21, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jie Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual RDL stacked die package using vertical wire
- Patent number 11,990,449
- Issue date May 21, 2024
- Intel Corporation
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240387467
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387417
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME
- Publication number 20240387465
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387454
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240379478
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240379429
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379627
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND SHIELDING HOUSING O...
- Publication number 20240371786
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Nuo Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD FORMING SAME
- Publication number 20240371843
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipation in Semiconductor Packages and Methods of Forming Same
- Publication number 20240371839
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371840
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240363557
- Publication date Oct 31, 2024
- RENESAS ELECTRONICS CORPORATION
- Yoshihiro OHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...
- Publication number 20240355783
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240355782
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240355744
- Publication date Oct 24, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...
- Publication number 20240339390
- Publication date Oct 10, 2024
- Lodestar Licensing Group LLC
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20240332255
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- HYUEKJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240332266
- Publication date Oct 3, 2024
- MEDIATEK INC.
- Che-Hung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE OF STACKED CHIPS T...
- Publication number 20240321854
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240324112
- Publication date Sep 26, 2024
- KIOXIA Corporation
- Takuya OKISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240314929
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Kiyokazu ISHIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED VOLTAGE REGULATOR AND PASSIVE COMPONENTS
- Publication number 20240312957
- Publication date Sep 19, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20240306403
- Publication date Sep 12, 2024
- Micron Technology, Inc.
- Yeon Seung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240290751
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240284684
- Publication date Aug 22, 2024
- KIOXIA Corporation
- Shinya WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240284685
- Publication date Aug 22, 2024
- KIOXIA Corporation
- Ryoya HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH STACKED DIES AND METHODS OF FORMING THE...
- Publication number 20240282732
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MEMORY AND CONTROL DIES
- Publication number 20240276740
- Publication date Aug 15, 2024
- SANDISK TECHNOLOGIES LLC
- Srinivasan Sivaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY PACKAGE, STORAGE DEVICE INCLUDING MEMORY PACKAGE, AND STORAG...
- Publication number 20240274172
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- JI-YEON SHIN
- G11 - INFORMATION STORAGE
Information Patent Application
LEGGED SUPPORT STRUCTURE TO MITIGATE STACKED DIE OVERHANG DEFLECTION
- Publication number 20240268132
- Publication date Aug 8, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS

Housing with external bump or bump-like connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Memory device and manufacturing method thereof

Separate inter-die connectors for data and error correction informa...

Semiconductor package having an interposer in which one or more die...

Integrated circuit package and method forming same

Through-dielectric vias for direct connection and method forming same

Singulation of microelectronic components with direct bonding inter...

Semiconductor package and method of fabricating the same

Semiconductor package, semiconductor device and shielding housing o...

Semiconductor device with re-fill layer

Command and address interface regions, and associated devices and s...

Semiconductor package and method of fabricating the same

Mold compound dispensing system and method

Package structure and manufacturing method thereof

Heat dissipation in semiconductor packages and methods of forming same

Semiconductor device

Memory package, storage device including memory package, and storag...

Integrated circuit packages

Integrated circuit package with glass spacer

Semiconductor package and a method for manufacturing the same

Semiconductor package having a through intervia through the molding...

Semiconductor devices and methods of manufacturing semiconductor de...

Package-on-package semiconductor assemblies and methods of manufact...

Three-dimensional stacking semiconductor assemblies with near zero...

Semiconductor package and semiconductor module including the same

3D package structure and methods of forming same

Semiconductor packages and methods of forming the same

Semiconductor package

Semiconductor package including stacked semiconductor chips

Method for packaging semiconductor, semiconductor package structure...

Dual RDL stacked die package using vertical wire

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND SHIELDING HOUSING O...

INTEGRATED CIRCUIT PACKAGE AND METHOD FORMING SAME

Heat Dissipation in Semiconductor Packages and Methods of Forming Same

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...

INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE OF STACKED CHIPS T...

SEMICONDUCTOR STORAGE DEVICE

SEMICONDUCTOR STORAGE DEVICE

INTEGRATED VOLTAGE REGULATOR AND PASSIVE COMPONENTS

STACKED SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES WITH STACKED DIES AND METHODS OF FORMING THE...

INTEGRATED MEMORY AND CONTROL DIES

MEMORY PACKAGE, STORAGE DEVICE INCLUDING MEMORY PACKAGE, AND STORAG...

LEGGED SUPPORT STRUCTURE TO MITIGATE STACKED DIE OVERHANG DEFLECTION