Immersion coating

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H01L2224/11823

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/11823Immersion coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and bump formation process
- Patent number 11,348,889
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bump formation process
- Patent number 10,522,491
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,510,731
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,157,893
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bump formation process
- Patent number 9,960,134
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of self-confinement of conductive b...
- Patent number 9,899,286
- Issue date Feb 20, 2018
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package (PoP) structure including stud bulbs
- Patent number 9,812,427
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Improving the strength of micro-bump joints
- Patent number 9,768,138
- Issue date Sep 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure comprising fine pitch backside metal redistr...
- Patent number 9,716,066
- Issue date Jul 25, 2017
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit device including a pillar c...
- Patent number 9,627,339
- Issue date Apr 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a cylindrical shaped conductive portion
- Patent number 9,576,925
- Issue date Feb 21, 2017
- Kabushiki Kaisha Toshiba
- Nobuto Managaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-Package (PoP) structure including stud bulbs and method
- Patent number 9,502,394
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D interconnect structure comprising fine pitch single damascene ba...
- Patent number 9,449,913
- Issue date Sep 20, 2016
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treating copper surfaces for packaging
- Patent number 9,425,180
- Issue date Aug 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of self-confinement of conductive b...
- Patent number 9,379,084
- Issue date Jun 28, 2016
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front side copper post joint structure for temporary bond in TSV ap...
- Patent number 9,349,699
- Issue date May 24, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hon-Lin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture of coated copper pillars
- Patent number 9,331,040
- Issue date May 3, 2016
- Atotech Deutschland GmbH
- Thomas Beck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar bump with cobalt-containing sidewall protection layer
- Patent number 9,275,965
- Issue date Mar 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure design for 3DIC testing
- Patent number 9,219,016
- Issue date Dec 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices employing semiconductor die having hydrophobic coatings, an...
- Patent number 9,220,183
- Issue date Dec 22, 2015
- International Business Machines Corporation
- Daniel J. Buvid
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Strength of micro-bump joints
- Patent number 9,219,046
- Issue date Dec 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 9,165,888
- Issue date Oct 20, 2015
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device including a copper pillar capped by barri...
- Patent number 9,142,521
- Issue date Sep 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate
- Patent number 9,111,818
- Issue date Aug 18, 2015
- Unimicron Technology Corporation
- Chun-Ting Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper pillar bump with cobalt-containing sidewall protection
- Patent number 9,048,135
- Issue date Jun 2, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu pillar bump with electrolytic metal sidewall protection
- Patent number 9,006,097
- Issue date Apr 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs and method
- Patent number 8,912,651
- Issue date Dec 16, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front side copper post joint structure for temporary bond in TSV ap...
- Patent number 8,736,050
- Issue date May 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hon-Lin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,680,654
- Issue date Mar 25, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device including a copper pillar capped by barri...
- Patent number 8,653,659
- Issue date Feb 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20240332033
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coating of Nanowires
- Publication number 20240304581
- Publication date Sep 12, 2024
- NanoWired GmbH
- Olav Birlem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...
- Publication number 20230090693
- Publication date Mar 23, 2023
- Fasford Technology Co., Ltd.
- Geonju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Bump Formation Process
- Publication number 20200126937
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device And Bump Formation Process
- Publication number 20180247907
- Publication date Aug 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20180047709
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Self-Confinement of Conductive B...
- Publication number 20160260646
- Publication date Sep 8, 2016
- STATS ChipPAC Pte Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20160218076
- Publication date Jul 28, 2016
- KABUSHIKI KAISHA TOSHIBA
- Nobuto MANAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURE OF COATED COPPER PILLARS
- Publication number 20150279797
- Publication date Oct 1, 2015
- ATOTECH DEUTSCHLAND GMBH
- Thomas Beck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Self-Confinement of Conductive B...
- Publication number 20150214182
- Publication date Jul 30, 2015
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ELEMENT AND CHIP PACKAGE
- Publication number 20150171041
- Publication date Jun 18, 2015
- MUTUAL-PAK TECHNOLOGY CO., LTD.
- Po Ching CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Treating Copper Surfaces for Packaging
- Publication number 20150104903
- Publication date Apr 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION LAYER
- Publication number 20140342546
- Publication date Nov 20, 2014
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Treating Copper Surfaces for Packaging
- Publication number 20140252600
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Front Side Copper Post Joint Structure for Temporary Bond in TSV Ap...
- Publication number 20140227831
- Publication date Aug 14, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hon-Lin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20140206145
- Publication date Jul 24, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Metal Bump Die Assembly
- Publication number 20140193952
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE
- Publication number 20140182912
- Publication date Jul 3, 2014
- Unimicron Technology Corporation
- Chun-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING A COPPER PILLAR CAPPED BY BARRI...
- Publication number 20140124924
- Publication date May 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME
- Publication number 20130307144
- Publication date Nov 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION
- Publication number 20130295762
- Publication date Nov 7, 2013
- Wen-Hsiung LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTERCONNECT STRUCTURE COMPRISING FINE PITCH SINGLE DAMASCENE BA...
- Publication number 20130256910
- Publication date Oct 3, 2013
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20130234296
- Publication date Sep 12, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure and Method
- Publication number 20130134588
- Publication date May 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure Design for 3DIC Testing
- Publication number 20130077272
- Publication date Mar 28, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING A COPPER PILLAR CAPPED BY BARRI...
- Publication number 20120273945
- Publication date Nov 1, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING COPPER PILLAR BUMPS USING PATTERNED ANODES
- Publication number 20120267781
- Publication date Oct 25, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION
- Publication number 20120091577
- Publication date Apr 19, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING COPPER PILLAR BUMPS USING PATTERNED ANODES
- Publication number 20120043654
- Publication date Feb 23, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Immersion coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and bump formation process

Semiconductor device and bump formation process

Package-on-package (PoP) structure including stud bulbs

Package-on-package (PoP) structure including stud bulbs

Semiconductor device and bump formation process

Semiconductor device and method of self-confinement of conductive b...

Package on-package (PoP) structure including stud bulbs

Improving the strength of micro-bump joints

Interconnect structure comprising fine pitch backside metal redistr...

Method of forming an integrated circuit device including a pillar c...

Semiconductor device having a cylindrical shaped conductive portion

Package on-Package (PoP) structure including stud bulbs and method

3D interconnect structure comprising fine pitch single damascene ba...

Treating copper surfaces for packaging

Semiconductor device and method of self-confinement of conductive b...

Front side copper post joint structure for temporary bond in TSV ap...

Manufacture of coated copper pillars

Copper pillar bump with cobalt-containing sidewall protection layer

Structure design for 3DIC testing

Devices employing semiconductor die having hydrophobic coatings, an...

Strength of micro-bump joints

Interconnect structures for stacked dies, including penetrating str...

Integrated circuit device including a copper pillar capped by barri...

Packaging substrate

Copper pillar bump with cobalt-containing sidewall protection

Cu pillar bump with electrolytic metal sidewall protection

Package-on-package (PoP) structure including stud bulbs and method

Front side copper post joint structure for temporary bond in TSV ap...

Interconnect structures for stacked dies, including penetrating str...

Integrated circuit device including a copper pillar capped by barri...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

Coating of Nanowires

DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...

Semiconductor Device and Bump Formation Process

Package-On-Package (PoP) Structure Including Stud Bulbs

Semiconductor Device And Bump Formation Process

Package-On-Package (PoP) Structure Including Stud Bulbs

Semiconductor Device and Method of Self-Confinement of Conductive B...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

MANUFACTURE OF COATED COPPER PILLARS

Semiconductor Device and Method of Self-Confinement of Conductive B...

CHIP ELEMENT AND CHIP PACKAGE

Treating Copper Surfaces for Packaging

COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION LAYER

Treating Copper Surfaces for Packaging

Front Side Copper Post Joint Structure for Temporary Bond in TSV Ap...

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

Methods for Metal Bump Die Assembly

PACKAGING SUBSTRATE

INTEGRATED CIRCUIT DEVICE INCLUDING A COPPER PILLAR CAPPED BY BARRI...

THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME

CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION

3D INTERCONNECT STRUCTURE COMPRISING FINE PITCH SINGLE DAMASCENE BA...

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

Package-On-Package (PoP) Structure and Method

Structure Design for 3DIC Testing

INTEGRATED CIRCUIT DEVICE INCLUDING A COPPER PILLAR CAPPED BY BARRI...

MECHANISMS FOR FORMING COPPER PILLAR BUMPS USING PATTERNED ANODES

COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION

MECHANISMS FOR FORMING COPPER PILLAR BUMPS USING PATTERNED ANODES