Immersion coating

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H01L2224/03424

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/03424Immersion coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 11,296,012
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic wave resonator and method for manufacturing the same
- Patent number 10,693,438
- Issue date Jun 23, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yeong Gyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repackaged integrated circuit assembly method
- Patent number 10,177,056
- Issue date Jan 8, 2019
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remapped packaged extracted die
- Patent number 10,109,606
- Issue date Oct 23, 2018
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming post-passivation interconnect structure
- Patent number 9,953,891
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a semiconductor device
- Patent number 9,947,632
- Issue date Apr 17, 2018
- Nexperia B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repackaged integrated circuit and assembly method
- Patent number 9,870,968
- Issue date Jan 16, 2018
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency integrated circuit module
- Patent number 9,859,231
- Issue date Jan 2, 2018
- Skyworks Solutions, Inc.
- Weimin Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Interconnect structure comprising fine pitch backside metal redistr...
- Patent number 9,716,066
- Issue date Jul 25, 2017
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor workpiece and semiconductor w...
- Patent number 9,627,335
- Issue date Apr 18, 2017
- Infineon Technologies AG
- Stephan Henneck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct die solder of gallium arsenide integrated circuit dies and m...
- Patent number 9,530,719
- Issue date Dec 27, 2016
- Skyworks Solutions, Inc.
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to fabricate a radio frequency integrated circuit
- Patent number 9,472,514
- Issue date Oct 18, 2016
- Skyworks Solutions, Inc.
- Weimin Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacture of wire bondable and solderable surfaces on...
- Patent number 9,401,466
- Issue date Jul 26, 2016
- Atotech Deutschland GmbH
- Andreas Walter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming bump structure
- Patent number 9,269,682
- Issue date Feb 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating bump structure and bump structure
- Patent number 9,257,401
- Issue date Feb 9, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar bump and flip chip package using same
- Patent number 9,159,682
- Issue date Oct 13, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-passivation interconnect structure and method of forming the same
- Patent number 9,099,396
- Issue date Aug 4, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having under-bump metallization (UBM) structur...
- Patent number 9,059,158
- Issue date Jun 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating bump structure
- Patent number 8,993,431
- Issue date Mar 31, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device and power device module
- Patent number 8,963,325
- Issue date Feb 24, 2015
- Samsung Electronics Co., Ltd.
- Baik-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having under-bump metallization (UBM) structur...
- Patent number 8,803,338
- Issue date Aug 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-bump metallization (UBM) structure and method of forming the...
- Patent number 8,581,420
- Issue date Nov 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless plating of porous and non-porous nickel layers, and gol...
- Patent number 8,455,361
- Issue date Jun 4, 2013
- Texas Instruments Incorporated
- Juan Alejandro Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Remapped Packaged Extracted Die
- Publication number 20180047685
- Publication date Feb 15, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Repackaged integrated circuit assembly method
- Publication number 20180005910
- Publication date Jan 4, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE USING POLYMER-SOLDER BALL STRUCTURES AND...
- Publication number 20170271285
- Publication date Sep 21, 2017
- GLOBALFOUNDRIES INC.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Repackaged integrated circuit and assembly method
- Publication number 20160225686
- Publication date Aug 4, 2016
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING POST-PASSIVATION INTERCONNECT STRUCTURE
- Publication number 20150325539
- Publication date Nov 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS TO FABRICATE A RADIO FREQUENCY INTEGRATED CIRCUIT
- Publication number 20150044863
- Publication date Feb 12, 2015
- SKYWORKS SOLUTIONS, INC.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...
- Publication number 20140327136
- Publication date Nov 6, 2014
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING BUMP STRUCTURE
- Publication number 20140242791
- Publication date Aug 28, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME
- Publication number 20140145328
- Publication date May 29, 2014
- Georgia Tech Research Corporation
- Rao Tummala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...
- Publication number 20140042619
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE AND POWER DEVICE MODULE
- Publication number 20140021620
- Publication date Jan 23, 2014
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-PASSIVATION INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20130113094
- Publication date May 9, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND PAD SYSTEM AND METHOD
- Publication number 20120222892
- Publication date Sep 6, 2012
- SKYWORKS SOLUTIONS, INC.
- Weimin Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...
- Publication number 20120098124
- Publication date Apr 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE...
- Publication number 20120091576
- Publication date Apr 19, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING BUMP STRUCTURE
- Publication number 20110278716
- Publication date Nov 17, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS PLATING A NICKLE LAYER AND A GOLD LAYER IN A SEMICONDUC...
- Publication number 20110163454
- Publication date Jul 7, 2011
- Juan Alejandro Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS

Immersion coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Barrier structures between external electrical connectors

Acoustic wave resonator and method for manufacturing the same

Repackaged integrated circuit assembly method

Remapped packaged extracted die

Method of forming post-passivation interconnect structure

Semiconductor device and method of making a semiconductor device

Repackaged integrated circuit and assembly method

Radio frequency integrated circuit module

Interconnect structure comprising fine pitch backside metal redistr...

Method for processing a semiconductor workpiece and semiconductor w...

Direct die solder of gallium arsenide integrated circuit dies and m...

Methods to fabricate a radio frequency integrated circuit

Method for manufacture of wire bondable and solderable surfaces on...

Method of forming bump structure

Method of fabricating bump structure and bump structure

Copper pillar bump and flip chip package using same

Post-passivation interconnect structure and method of forming the same

Semiconductor device having under-bump metallization (UBM) structur...

Method of fabricating bump structure

Power device and power device module

Semiconductor device having under-bump metallization (UBM) structur...

Under-bump metallization (UBM) structure and method of forming the...

Electroless plating of porous and non-porous nickel layers, and gol...

Patents Applicationslast 30 patents

Remapped Packaged Extracted Die

Repackaged integrated circuit assembly method

INTEGRATED CIRCUIT PACKAGE USING POLYMER-SOLDER BALL STRUCTURES AND...

Repackaged integrated circuit and assembly method

METHOD OF FORMING POST-PASSIVATION INTERCONNECT STRUCTURE

SYSTEMS AND METHODS TO FABRICATE A RADIO FREQUENCY INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...

METHOD OF FORMING BUMP STRUCTURE

INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME

SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...

POWER DEVICE AND POWER DEVICE MODULE

POST-PASSIVATION INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

WIRE BOND PAD SYSTEM AND METHOD

SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...

UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE...

METHOD OF FABRICATING BUMP STRUCTURE

ELECTROLESS PLATING A NICKLE LAYER AND A GOLD LAYER IN A SEMICONDUC...