impedance transition between different types of wave guides

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H01L2924/19039

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/19039impedance transition between different types of wave guides

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure having multiple dielectric waveguide channe...
- Patent number 11,682,638
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circularly-polarized dielectric waveguide launch for millimeter-wav...
- Patent number 11,011,815
- Issue date May 18, 2021
- Texas Instruments Incorporated
- Hassan Omar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having multiple dielectric waveguide channe...
- Patent number 10,770,414
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide including first and second metal plates and having a slot...
- Patent number 10,056,672
- Issue date Aug 21, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer including an integrated waveguide for communica...
- Patent number 10,038,232
- Issue date Jul 31, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including a package substrate having an integrate...
- Patent number 10,033,081
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, transmission system, method for manufacturing...
- Patent number 9,748,664
- Issue date Aug 29, 2017
- Sony Corporation
- Hirofumi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit, method of manufacturing electronic circuit, and...
- Patent number 9,596,750
- Issue date Mar 14, 2017
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tomoari Itagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transition from a chip to a waveguide port
- Patent number 8,901,719
- Issue date Dec 2, 2014
- Optis Cellular Technology, LLC
- Per Ligander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for integrated waveguide packaging
- Patent number 8,872,333
- Issue date Oct 28, 2014
- Viasat, Inc.
- Noel A Lopez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package for housing semiconductor element and semiconductor device...
- Patent number 8,754,519
- Issue date Jun 17, 2014
- Kabushiki Kaisha Toshiba
- Tsuyoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency circuit package and high-frequency circuit device
- Patent number 8,552,304
- Issue date Oct 8, 2013
- Fujitsu Limited
- Satoshi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave module
- Patent number 8,288,864
- Issue date Oct 16, 2012
- Rohde & Schwarz GmbH & Co. KG
- Werner Perndl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with an embedded waveguide adapter and met...
- Patent number 8,283,764
- Issue date Oct 9, 2012
- Freescale Semiconductors, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simple radio frequency integrated circuit (RFIC) packages with inte...
- Patent number 8,269,671
- Issue date Sep 18, 2012
- International Business Machines Corporation
- Ho Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency circuit board, high-frequency circuit module, and ra...
- Patent number 8,179,306
- Issue date May 15, 2012
- Kyocera Corporation
- Hajime Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency amplifier
- Patent number 8,174,323
- Issue date May 8, 2012
- Mitsubishi Electric Corporation
- Toshio Okuda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Microelectronic assembly with an embedded waveguide adapter and met...
- Patent number 8,168,464
- Issue date May 1, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency amplifier
- Patent number 8,085,094
- Issue date Dec 27, 2011
- Mitsubishi Electric Corporation
- Toshio Okuda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
System and method for integrated waveguide packaging
- Patent number 8,072,065
- Issue date Dec 6, 2011
- Viasat, Inc.
- Noel A. Lopez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tapered dielectric and conductor structures and applications thereof
- Patent number 7,973,391
- Issue date Jul 5, 2011
- Samsung Electronics Co., Ltd.
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer dielectric substrate and semiconductor package
- Patent number 7,964,937
- Issue date Jun 21, 2011
- Mitsubishi Electric Corporation
- Takuya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave communication package
- Patent number 7,855,685
- Issue date Dec 21, 2010
- Delphi Technologies, Inc.
- Matthew R. Walsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter waveband transceiver, radar and vehicle using the same
- Patent number 7,804,443
- Issue date Sep 28, 2010
- Hitachi, Ltd.
- Hideyuki Nagaishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-loss interface
- Patent number 7,782,156
- Issue date Aug 24, 2010
- Viasat, Inc.
- Charles Woods
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency line-to-waveguide converter and high frequency package
- Patent number 7,522,014
- Issue date Apr 21, 2009
- Kyocera Corporation
- Shinichi Koriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer dielectric substrate and semiconductor package
- Patent number 7,504,710
- Issue date Mar 17, 2009
- Mitsubishi Electric Corporation
- Takuya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory packages having stair step interconnection layers
- Patent number 7,466,021
- Issue date Dec 16, 2008
- Interconnect Portfolio, LLP
- Joseph Charles Fjelstad
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of fabricating the routing of electrical signals
- Patent number 7,405,109
- Issue date Jul 29, 2008
- Avago Technologies General IP Pte. Ltd.
- William S Burton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tapered dielectric and conductor structures and applications thereof
- Patent number 7,388,279
- Issue date Jun 17, 2008
- Interconnect Portfolio, LLC
- Joseph C. Fjelstad
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...
- Publication number 20230268298
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-SHIANG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...
- Publication number 20200381377
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-SHIANG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...
- Publication number 20190393171
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-SHIANG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCULARLY-POLARIZED DIELECTRIC WAVEGUIDE LAUNCH FOR MILLIMETER-WAV...
- Publication number 20190334220
- Publication date Oct 31, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Hassan Omar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES HAVING INTEGRATED WAVEGUIDES FOR HIGH SPEED COMM...
- Publication number 20160336282
- Publication date Nov 17, 2016
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT, METHOD OF MANUFACTURING ELECTRONIC CIRCUIT, AND...
- Publication number 20130114218
- Publication date May 9, 2013
- SONY CORPORATION
- Tomoari Itagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECRONIC ASSEMBLY WITH AN EMBEDDED WAVEGUIDE ADAPTER AND METH...
- Publication number 20120223325
- Publication date Sep 6, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR INTEGRATED WAVEGUIDE PACKAGING
- Publication number 20120139099
- Publication date Jun 7, 2012
- ViaSat, Inc.
- Noel A. Lopez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH FREQUENCY AMPLIFIER
- Publication number 20120068773
- Publication date Mar 22, 2012
- Mitsubishi Electric Corporation
- Toshio Okuda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TRANSITION FROM A CHIP TO A WAVEGUIDE PORT
- Publication number 20120068316
- Publication date Mar 22, 2012
- TELEFONAKTIEBOLAGET L M ERICSSON (publ)
- Per Ligander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY CIRCUIT PACKAGE AND HIGH-FREQUENCY CIRCUIT DEVICE
- Publication number 20120061133
- Publication date Mar 15, 2012
- FUJITSU LIMITED
- Satoshi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE...
- Publication number 20110186983
- Publication date Aug 4, 2011
- Kabushiki Kaisha Toshiba
- Tsuyoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH AN EMBEDDED WAVEGUIDE ADAPTER AND MET...
- Publication number 20110180917
- Publication date Jul 28, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY AMPLIFIER
- Publication number 20110169576
- Publication date Jul 14, 2011
- Mitsubishi Electric Corporation
- Toshio Okuda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MICROWAVE MODULE
- Publication number 20110031595
- Publication date Feb 10, 2011
- ROHDE & SCHWARZ GMBH & CO. KG
- Werner Perndl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, TRANSMISSION SYSTEM, METHOD FOR MANUFACTURING...
- Publication number 20100231320
- Publication date Sep 16, 2010
- SONY CORPORATION
- Hirofumi Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMPLE RADIO FREQUENCY INTEGRATED CIRCUIT (RFIC) PACKAGES WITH INTE...
- Publication number 20100190464
- Publication date Jul 29, 2010
- International Business Machines Corporation
- Ho Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Frequency Circuit Board, High-Frequency Circuit Module, and Ra...
- Publication number 20100141350
- Publication date Jun 10, 2010
- KYOCERA CORPORATION
- Hajime Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and Method for Integrated Waveguide Packaging
- Publication number 20090206473
- Publication date Aug 20, 2009
- ViaSat, Inc.
- Noel A. Lopez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER DIELECTRIC SUBSTRATE AND SEMICONDUCTOR PACKAGE
- Publication number 20090127674
- Publication date May 21, 2009
- MITSUBISHI ELECTRIC CORPORATION
- Takuya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Packages Having Stair Step Interconnection Layers
- Publication number 20090091019
- Publication date Apr 9, 2009
- Joseph Charles Fjelstad
- G01 - MEASURING TESTING
Information Patent Application
Microwave communication package
- Publication number 20090085808
- Publication date Apr 2, 2009
- Matthew R. Walsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-LOSS INTERFACE
- Publication number 20090066441
- Publication date Mar 12, 2009
- ViaSat, Inc.
- Charles Woods
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPERED DIELECTRIC AND CONDUCTOR STRUCTURES AND APPLICATIONS THEREOF
- Publication number 20090027137
- Publication date Jan 29, 2009
- Joseph C. Fjelstad
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor chip mounting board with multiple ports
- Publication number 20080296050
- Publication date Dec 4, 2008
- DENSO CORPORATION
- Hisanori Uda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVEBAND TRANSCEIVER, RADAR AND VEHICLE USING THE SAME
- Publication number 20080129408
- Publication date Jun 5, 2008
- Hideyuki Nagaishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Frequency Line-To-Waveguide Converter and High Frequency Package
- Publication number 20080042773
- Publication date Feb 21, 2008
- Kyocera Corporation
- Shinichi Koriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Dielectric Substrate and Semiconductor Package
- Publication number 20070273008
- Publication date Nov 29, 2007
- MITSUBISHI ELECTRIC CORPORATION
- Takuya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thickness tapered substrate launch
- Publication number 20070035357
- Publication date Feb 15, 2007
- Northrop Grumman Corporation
- David J. Brunone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Packages Having Stair Step Interconnection Layers
- Publication number 20060244150
- Publication date Nov 2, 2006
- Joseph Charles Fjelstad
- G01 - MEASURING TESTING

impedance transition between different types of wave guides

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure having multiple dielectric waveguide channe...

Circularly-polarized dielectric waveguide launch for millimeter-wav...

Semiconductor structure having multiple dielectric waveguide channe...

Waveguide including first and second metal plates and having a slot...

Semiconductor wafer including an integrated waveguide for communica...

Package structure including a package substrate having an integrate...

Semiconductor device, transmission system, method for manufacturing...

Electronic circuit, method of manufacturing electronic circuit, and...

Transition from a chip to a waveguide port

System and method for integrated waveguide packaging

Package for housing semiconductor element and semiconductor device...

High-frequency circuit package and high-frequency circuit device

Microwave module

Microelectronic assembly with an embedded waveguide adapter and met...

Simple radio frequency integrated circuit (RFIC) packages with inte...

High-frequency circuit board, high-frequency circuit module, and ra...

High frequency amplifier

Microelectronic assembly with an embedded waveguide adapter and met...

High frequency amplifier

System and method for integrated waveguide packaging

Tapered dielectric and conductor structures and applications thereof

Multilayer dielectric substrate and semiconductor package

Microwave communication package

Millimeter waveband transceiver, radar and vehicle using the same

Low-loss interface

High frequency line-to-waveguide converter and high frequency package

Multilayer dielectric substrate and semiconductor package

Memory packages having stair step interconnection layers

Method of fabricating the routing of electrical signals

Tapered dielectric and conductor structures and applications thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...

SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...

SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...

CIRCULARLY-POLARIZED DIELECTRIC WAVEGUIDE LAUNCH FOR MILLIMETER-WAV...

PACKAGE STRUCTURES HAVING INTEGRATED WAVEGUIDES FOR HIGH SPEED COMM...

ELECTRONIC CIRCUIT, METHOD OF MANUFACTURING ELECTRONIC CIRCUIT, AND...

MICROELECRONIC ASSEMBLY WITH AN EMBEDDED WAVEGUIDE ADAPTER AND METH...

SYSTEM AND METHOD FOR INTEGRATED WAVEGUIDE PACKAGING

HIGH FREQUENCY AMPLIFIER

TRANSITION FROM A CHIP TO A WAVEGUIDE PORT

HIGH-FREQUENCY CIRCUIT PACKAGE AND HIGH-FREQUENCY CIRCUIT DEVICE

PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE...

MICROELECTRONIC ASSEMBLY WITH AN EMBEDDED WAVEGUIDE ADAPTER AND MET...

HIGH FREQUENCY AMPLIFIER

MICROWAVE MODULE

SEMICONDUCTOR DEVICE, TRANSMISSION SYSTEM, METHOD FOR MANUFACTURING...

SIMPLE RADIO FREQUENCY INTEGRATED CIRCUIT (RFIC) PACKAGES WITH INTE...

High-Frequency Circuit Board, High-Frequency Circuit Module, and Ra...

System and Method for Integrated Waveguide Packaging

MULTILAYER DIELECTRIC SUBSTRATE AND SEMICONDUCTOR PACKAGE

Memory Packages Having Stair Step Interconnection Layers

Microwave communication package

LOW-LOSS INTERFACE

TAPERED DIELECTRIC AND CONDUCTOR STRUCTURES AND APPLICATIONS THEREOF

Semiconductor chip mounting board with multiple ports

MILLIMETER WAVEBAND TRANSCEIVER, RADAR AND VEHICLE USING THE SAME

High Frequency Line-To-Waveguide Converter and High Frequency Package

Multilayer Dielectric Substrate and Semiconductor Package

Thickness tapered substrate launch

Memory Packages Having Stair Step Interconnection Layers