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Improvement of the adhesion between the insulating substrate and the metal

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  • H05K3/38
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/38Improvement of the adhesion between the insulating substrate and the metal
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING CIRCUIT BOARD
    • Publication number 20240164017
    • Publication date May 16, 2024
    • Nitto Denko Corporation
    • Hideki MATSUI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
    • Publication number 20240155760
    • Publication date May 9, 2024
    • Shinko Electric Industries Co., Ltd.
    • Yuji YUKIIRI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    ELECTRONIC DEVICE
    • Publication number 20240155777
    • Publication date May 9, 2024
    • InnoLux Corporation
    • Yuan-Lin WU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...
    • Publication number 20240138075
    • Publication date Apr 25, 2024
    • YMT CO>< LTD.
    • Sung Wook CHUN
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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    LOW-ROUGHNESS SURFACE-TREATED COPPER FOIL WITH LOW BENDING DEFORMAT...
    • Publication number 20240121902
    • Publication date Apr 11, 2024
    • Lotte Energy Materials Corporation
    • Chang Yol YANG
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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    METHOD OF MANUFACTURING BONDED SUBSTRATE, METHOD OF MANUFACTURING C...
    • Publication number 20240107678
    • Publication date Mar 28, 2024
    • NGK Electronics Devices, Inc.
    • Kota KITAJIMA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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    Carrier Substrate
    • Publication number 20240107658
    • Publication date Mar 28, 2024
    • Solid-tech Co., Ltd.
    • Tzu Chien Hung
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
    • Publication number 20240098884
    • Publication date Mar 21, 2024
    • LG Innotek Co., Ltd.
    • Do Hyuk YOO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HYBRID SOFT-RIGID ELECTRICAL INTERCONNECTION SYSTEM
    • Publication number 20240091528
    • Publication date Mar 21, 2024
    • ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)
    • Florian FALLEGGER
    • A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
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    PREPREG WITH METAL LAYER, METHOD FOR MANUFACTURING LAMINATE, AND ME...
    • Publication number 20240090138
    • Publication date Mar 14, 2024
    • Beji SASAKI
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
    • Publication number 20240090139
    • Publication date Mar 14, 2024
    • LX Semicon Co., Ltd.
    • Jun Ho LEE
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240063104
    • Publication date Feb 22, 2024
    • LG Innotek Co., Ltd.
    • Se Woong NA
    • H01 - BASIC ELECTRIC ELEMENTS
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    METHOD AND SYSTEMS FOR COLD FORMING FEATURES ON FLEX CIRCUITS
    • Publication number 20240057250
    • Publication date Feb 15, 2024
    • Koninklijke Philips N.V.
    • FRANCIS KUSTI MAKIE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20240049384
    • Publication date Feb 8, 2024
    • DAI NIPPON PRINTING CO., LTD.
    • Hiroki FURUSHOU
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    LIQUID METAL CIRCUITS AND METHODS OF MAKING THE SAME
    • Publication number 20240032189
    • Publication date Jan 25, 2024
    • Carnegie Mellon University
    • O Burak Ozdoganlar
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD AND DISPLAY DEVICE
    • Publication number 20240023248
    • Publication date Jan 18, 2024
    • KYOCERA CORPORATION
    • Nobuyuki HASEGAWA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20230422406
    • Publication date Dec 28, 2023
    • IBIDEN CO., LTD.
    • Takuya INISHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20230422393
    • Publication date Dec 28, 2023
    • KYOCERA CORPORATION
    • Hidetoshi YUGAWA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Ceramic Circuit Board And Semiconductor Device Using Same
    • Publication number 20230380060
    • Publication date Nov 23, 2023
    • Kabushiki Kaisha Toshiba
    • Takayuki NABA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE SUBSTRATE STRUCTURE
    • Publication number 20230371187
    • Publication date Nov 16, 2023
    • AMAZING COOL TECHNOLOGY CORPORATION
    • Shiann-Tsong TSAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RESIN COMPOSITION AND ARTICLE MADE THEREFROM
    • Publication number 20230331916
    • Publication date Oct 19, 2023
    • ELITE MATERIAL CO., LTD.
    • Tse-Hung LIU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...
    • Publication number 20230328897
    • Publication date Oct 12, 2023
    • Showa Denko Materials Co., Ltd.
    • Hiroyuki IZAWA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BOARD
    • Publication number 20230328898
    • Publication date Oct 12, 2023
    • Toyota Jidosha Kabushiki Kaisha
    • Miwako SHIONOYA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SILVER COATING FOR HIGH TEMPERATURE APPLICATIONS
    • Publication number 20230328899
    • Publication date Oct 12, 2023
    • DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
    • Adolphe FOYET
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRICALLY CONDUCTIVE ADHESIVE, ELECTRONIC CIRCUIT USING THE SAME...
    • Publication number 20230319988
    • Publication date Oct 5, 2023
    • TOYO ALUMINIUM KABUSHIKI KAISHA
    • Toshio NAKATANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...
    • Publication number 20230292445
    • Publication date Sep 14, 2023
    • LANDA LABS (2012) LTD.
    • Benzion LANDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20230292448
    • Publication date Sep 14, 2023
    • IBIDEN CO., LTD.
    • Kentaro WADA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LAMINATE FOR CIRCUIT BOARD
    • Publication number 20230292433
    • Publication date Sep 14, 2023
    • Tokuyama Corporation
    • Eiki TSUSHIMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MANUFACTURING METHODS FOR COPPER-CLAD LAMINATE AND PRINTED WIRING B...
    • Publication number 20230276579
    • Publication date Aug 31, 2023
    • Mitsui Mining and Smelting Co., Ltd.
    • Daisuke NAKAJIMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COPPER-CLAD LAMINATE PLATE AND PRINTED WIRING BOARD
    • Publication number 20230276571
    • Publication date Aug 31, 2023
    • Mitsui Mining and Smelting Co., Ltd.
    • Daisuke NAKAJIMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR