Improvement of the adhesion between the insulating substrate and the metal

Industry

CPC
H05K3/38

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/38Improvement of the adhesion between the insulating substrate and the metal

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Ceramic-cladded copper plate and method for manufacturing ceramic-c...
- Patent number 12,284,766
- Issue date Apr 22, 2025
- BYD Company Limited
- Wei Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring board and display device
- Patent number 12,279,378
- Issue date Apr 15, 2025
- Kyocera Corporation
- Nobuyuki Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminate plate and printed wiring board
- Patent number 12,262,469
- Issue date Mar 25, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Daisuke Nakajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,245,366
- Issue date Mar 4, 2025
- Kyocera Corporation
- Hidetoshi Yugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing dielectric sheet, method for manufacturing...
- Patent number 12,213,249
- Issue date Jan 28, 2025
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Droplet actuator fabrication apparatus, systems, and related methods
- Patent number 12,201,980
- Issue date Jan 21, 2025
- Abbott Laboratories
- Andrew Fischer
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Support substrate and method for producing a support substrate
- Patent number 12,177,970
- Issue date Dec 24, 2024
- Rogers Germany GmbH
- Tilo Welker
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Wafer level bump stack for chip scale package
- Patent number 12,177,988
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive adhesive, electronic circuit using the same...
- Patent number 12,171,062
- Issue date Dec 17, 2024
- Toyo Aluminum Kabushiki Kaisha
- Toshio Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, ceramic copper circuit board, method for manufacturing...
- Patent number 12,160,959
- Issue date Dec 3, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal/ceramic bonding substrate and method for producing same
- Patent number 12,145,352
- Issue date Nov 19, 2024
- DOWA METALTECH CO, LTD.
- Hideyo Osanai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
System for providing dynamic feedback for selective adhesion PCB pr...
- Patent number 12,150,248
- Issue date Nov 19, 2024
- Honeywell Federal Manufacturing & Technologies, LLC
- Jonathan Douglas Hatch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-roughness surface-treated copper foil with low bending deformat...
- Patent number 12,144,124
- Issue date Nov 12, 2024
- Lotte Energy Materials Corporation
- Chang Yol Yang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Pressure-sensitive adhesive sheet-including wiring circuit board an...
- Patent number 12,144,125
- Issue date Nov 12, 2024
- Nitto Denko Corporation
- Takahiro Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition and article made therefrom
- Patent number 12,134,682
- Issue date Nov 5, 2024
- ELITE MATERIAL CO., LTD.
- Tse-Hung Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body and insulating circuit board
- Patent number 12,137,526
- Issue date Nov 5, 2024
- Mitsubishi Materials Corporation
- Marina Sakamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper/ceramic joined body and insulating circuit substrate
- Patent number 12,125,765
- Issue date Oct 22, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure, method for manufacturing same, and semiconductor...
- Patent number 12,114,437
- Issue date Oct 8, 2024
- Resonac Corporation
- Masaya Toba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate manufacturing method
- Patent number 12,108,540
- Issue date Oct 1, 2024
- AMOSENSE CO., LTD.
- Kyung Whan Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal surface treatment liquid and liquid concentrate thereof, meta...
- Patent number 12,091,430
- Issue date Sep 17, 2024
- Shikoku Chemicals Corporation
- Noriaki Yamaji
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 12,096,549
- Issue date Sep 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device with flexible and stretchable substrate
- Patent number 12,096,553
- Issue date Sep 17, 2024
- Carnegie Mellon University
- Gary K. Fedder
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Printed circuit board and fabricating method thereof, and displayin...
- Patent number 12,082,337
- Issue date Sep 3, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Jiaxiang Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated copper foil, copper-clad laminate and printed wirin...
- Patent number 12,063,747
- Issue date Aug 13, 2024
- Fukuda Metal Foil & Powder Co., Ltd.
- Takeshi Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for a printed wiring board
- Patent number 12,058,812
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Takuto Hidani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer body
- Patent number 12,058,819
- Issue date Aug 6, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for producing a metal-ceramic substrate, and metal-ceramic s...
- Patent number 12,058,816
- Issue date Aug 6, 2024
- Rogers Germany GmbH
- Andreas Meyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and manufacturing method of the wiring board
- Patent number 12,028,972
- Issue date Jul 2, 2024
- Dai Nippon Printing Co., Ltd.
- Hiroki Furushou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 12,028,988
- Issue date Jul 2, 2024
- Ibiden Co., Ltd.
- Takuya Inishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SURFACE-TREATED COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT AND METHOD F...
- Publication number 20250168969
- Publication date May 22, 2025
- Circuit Foil Luxembourg
- Roman MICHEZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND ITS MANUFACTURING METHOD
- Publication number 20250151207
- Publication date May 8, 2025
- Shanghai AVIC Optoelectronics Co., Ltd.
- Akira FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...
- Publication number 20250142722
- Publication date May 1, 2025
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126718
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126715
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Byung Hak KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL DEVICE AND PRINTED WIRING BOARD
- Publication number 20250107001
- Publication date Mar 27, 2025
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Michi OGATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DAM LAMINATE ISOLATION SUBSTRATE
- Publication number 20250096034
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chang-Yen KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING...
- Publication number 20250048563
- Publication date Feb 6, 2025
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250048562
- Publication date Feb 6, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING-FORMING MEMBER, WIRING LAYER FORMING METHOD USING WIRING-FOR...
- Publication number 20250024609
- Publication date Jan 16, 2025
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED BODY AND INSULATING CIRCUIT BOARD
- Publication number 20250024610
- Publication date Jan 16, 2025
- MITSUBISHI MATERIALS CORPORATION
- Marina Sakamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method for Manufacturing the Same Using a Des...
- Publication number 20250024611
- Publication date Jan 16, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Nina WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER SUBSTRATE, A METHOD, AND AN ELECTRONIC ASSEMBLY
- Publication number 20250016908
- Publication date Jan 9, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Agneta Ljungbro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CROSSLINKED POLYESTER RESIN, ADHESIVE AGENT COMPOSITION, AND ADHESI...
- Publication number 20240409782
- Publication date Dec 12, 2024
- Toyobo Co., Ltd.
- Shoko UCHIYAMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBS
- Publication number 20240407105
- Publication date Dec 5, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...
- Publication number 20240397635
- Publication date Nov 28, 2024
- Resonac Corporation
- Masaya TOBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...
- Publication number 20240397636
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE WITH IMPROVED INTERFACIAL ADHESION OF METAL-ORGAN...
- Publication number 20240357749
- Publication date Oct 24, 2024
- Yield Engineering Systems, Inc.
- Kenneth Sautter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...
- Publication number 20240300208
- Publication date Sep 12, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jun NAMKUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20240284593
- Publication date Aug 22, 2024
- Shinko Electric Industries Co., Ltd.
- Hikaru Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...
- Publication number 20240276636
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240276650
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for preparing novel material layer structure of high-frequen...
- Publication number 20240244757
- Publication date Jul 18, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HERMETICALLY-SEALED PACKAGES INCLUDING FEEDTHROUGH ASSEMBLIES
- Publication number 20240244782
- Publication date Jul 18, 2024
- Medtronic, Inc.
- David A. Ruben
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, LAMINATE FOR I...
- Publication number 20240235004
- Publication date Jul 11, 2024
- DAI NIPPON PRINTING CO., LTD.
- Kazuki KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Photosensitive Adhesion Promoter and Method...
- Publication number 20240237230
- Publication date Jul 11, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...
- Publication number 20240237229
- Publication date Jul 11, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF, AND DISPLAYIN...
- Publication number 20240224416
- Publication date Jul 4, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Jiaxiang ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRIN...
- Publication number 20240215172
- Publication date Jun 27, 2024
- Fukuda Metal Foil & Powder Co., Ltd.
- Takeshi OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240206079
- Publication date Jun 20, 2024
- Nitto Denko Corporation
- Takahiro IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Improvement of the adhesion between the insulating substrate and the metal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ceramic-cladded copper plate and method for manufacturing ceramic-c...

Wiring board and display device

Copper-clad laminate plate and printed wiring board

Wiring board

Method for manufacturing dielectric sheet, method for manufacturing...

Droplet actuator fabrication apparatus, systems, and related methods

Support substrate and method for producing a support substrate

Wafer level bump stack for chip scale package

Electrically conductive adhesive, electronic circuit using the same...

Bonded body, ceramic copper circuit board, method for manufacturing...

Metal/ceramic bonding substrate and method for producing same

System for providing dynamic feedback for selective adhesion PCB pr...

Low-roughness surface-treated copper foil with low bending deformat...

Pressure-sensitive adhesive sheet-including wiring circuit board an...

Resin composition and article made therefrom

Bonded body and insulating circuit board

Hermetic metallized via with improved reliability

Copper/ceramic joined body and insulating circuit substrate

Wiring structure, method for manufacturing same, and semiconductor...

Ceramic substrate manufacturing method

Metal surface treatment liquid and liquid concentrate thereof, meta...

Panel molded electronic assemblies with multi-surface conductive co...

Integrated electronic device with flexible and stretchable substrate

Printed circuit board and fabricating method thereof, and displayin...

Surface-treated copper foil, copper-clad laminate and printed wirin...

Substrate for a printed wiring board

Multilayer body

Method for producing a metal-ceramic substrate, and metal-ceramic s...

Wiring board and manufacturing method of the wiring board

Printed wiring board

Patents Applicationslast 30 patents

SURFACE-TREATED COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT AND METHOD F...

WIRING SUBSTRATE AND ITS MANUFACTURING METHOD

MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

COIL DEVICE AND PRINTED WIRING BOARD

DAM LAMINATE ISOLATION SUBSTRATE

BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING...

WIRING SUBSTRATE

WIRING-FORMING MEMBER, WIRING LAYER FORMING METHOD USING WIRING-FOR...

BONDED BODY AND INSULATING CIRCUIT BOARD

Component Carrier and Method for Manufacturing the Same Using a Des...

CARRIER SUBSTRATE, A METHOD, AND AN ELECTRONIC ASSEMBLY

CROSSLINKED POLYESTER RESIN, ADHESIVE AGENT COMPOSITION, AND ADHESI...

X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBS

WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...

METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...

ELECTRONIC DEVICE WITH IMPROVED INTERFACIAL ADHESION OF METAL-ORGAN...

PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...

WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE

CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Method for preparing novel material layer structure of high-frequen...

HERMETICALLY-SEALED PACKAGES INCLUDING FEEDTHROUGH ASSEMBLIES

WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, LAMINATE FOR I...

Component Carrier With Photosensitive Adhesion Promoter and Method...

RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...

PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF, AND DISPLAYIN...

SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRIN...

WIRING CIRCUIT BOARD