in a stacked assembly with the semiconductor or solid state device

Industry

CPC
H01L2924/19102

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/19102in a stacked assembly with the semiconductor or solid state device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,132,078
- Issue date Oct 29, 2024
- TDK Corporation
- Yoshihiko Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with conductive patterns in a redistribution layer
- Patent number 12,100,682
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,009,575
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Nan-Chin Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced info POP and method of forming thereof
- Patent number 11,955,460
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,435
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly with encapsulated magnetic feature
- Patent number 11,901,115
- Issue date Feb 13, 2024
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,881,467
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Jungho Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of embedding magnetic structures in substrates
- Patent number 11,862,552
- Issue date Jan 2, 2024
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,804,461
- Issue date Oct 31, 2023
- Advanced Semiconductor Engineering, Inc.
- Yu-Ping Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly structure and package structure
- Patent number 11,798,890
- Issue date Oct 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitors embedded in package substrate
- Patent number 11,784,215
- Issue date Oct 10, 2023
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,742,565
- Issue date Aug 29, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
- Patent number 11,696,407
- Issue date Jul 4, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device packages with passive device assemblies
- Patent number 11,688,709
- Issue date Jun 27, 2023
- Analog Devices, Inc.
- Vikram Venkatadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stacked package-on-package structures
- Patent number 11,664,322
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,664,323
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,658,392
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Nan-Chin Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out stacked package with fan-out redistribution laye...
- Patent number 11,538,788
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 11,532,594
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including fully integrated voltage regulator circuitry with...
- Patent number 11,527,483
- Issue date Dec 13, 2022
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module installation on printed circuit boards with embedded trace t...
- Patent number 11,502,010
- Issue date Nov 15, 2022
- Intel Corporation
- Quan Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly with encapsulated magnetic feature
- Patent number 11,443,892
- Issue date Sep 13, 2022
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having front end under embedded radio fr...
- Patent number 11,424,195
- Issue date Aug 23, 2022
- Intel Corporation
- Eliav Shaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked decoupling capacitors with integration in a substrate
- Patent number 11,417,637
- Issue date Aug 16, 2022
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,410,958
- Issue date Aug 9, 2022
- Samsung Electronics Co., Ltd.
- Jungho Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using cavity substrate and manufacturing methods
- Patent number 11,410,935
- Issue date Aug 9, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor structures for package devices
- Patent number 11,335,632
- Issue date May 17, 2022
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with tilted interface between device die and encapsulating...
- Patent number 11,322,419
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,309,295
- Issue date Apr 19, 2022
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371814
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332261
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240194611
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240105662
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jungho SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240063163
- Publication date Feb 22, 2024
- Advanced Semiconductor Engineering, Inc.
- Yu-Pin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240047852
- Publication date Feb 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE
- Publication number 20230420494
- Publication date Dec 28, 2023
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH EMBEDDED DIE-SIDE, FACE-UP DEEP TRENCH CAPA...
- Publication number 20230215849
- Publication date Jul 6, 2023
- QUALCOMM Incorporated
- Seongryul Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Package and the Methods of Manufacturing
- Publication number 20230114652
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ASSEMBLY WITH ENCAPSULATED MAGNETIC FEATURE
- Publication number 20220359115
- Publication date Nov 10, 2022
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220352107
- Publication date Nov 3, 2022
- Samsung Electronics Co., Ltd.
- Jungho SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES
- Publication number 20220130748
- Publication date Apr 28, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210407951
- Publication date Dec 30, 2021
- Advanced Semiconductor Engineering, Inc.
- Yu-Ping TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20210376451
- Publication date Dec 2, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DECOUPLING CAPACITORS WITH INTEGRATION IN A SUBSTRATE
- Publication number 20210343684
- Publication date Nov 4, 2021
- QUALCOMM Incorporated
- Jonghae KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE
- Publication number 20210273042
- Publication date Sep 2, 2021
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210202336
- Publication date Jul 1, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210202426
- Publication date Jul 1, 2021
- Samsung Electronics Co., Ltd.
- Jungho SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-ON-SUBSTRATE STRUCTURE AND ELECTRONICS COMPRISING THE SAME
- Publication number 20210183754
- Publication date Jun 17, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Yong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR MANUFACTURING PRO...
- Publication number 20210166987
- Publication date Jun 3, 2021
- Advanced Semiconductor Engineering, Inc.
- Ian HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20210104809
- Publication date Apr 8, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210074664
- Publication date Mar 11, 2021
- Advanced Semiconductor Engineering, Inc.
- Yu-Pin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210066264
- Publication date Mar 4, 2021
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODELESS PASSIVE EMBEDDED SUBSTRATE
- Publication number 20210057397
- Publication date Feb 25, 2021
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced INFO POP and Method of Forming Thereof
- Publication number 20210020611
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Stacked Package-on-Package Structures
- Publication number 20210005556
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT CONDUCTIVE PAD FOR DEVICE TERMINAL
- Publication number 20200381344
- Publication date Dec 3, 2020
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Tilted Interface Between Device Die and Encapsulating...
- Publication number 20200365479
- Publication date Nov 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Forming the Same
- Publication number 20200279837
- Publication date Sep 3, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALVANIC CORROSION PROTECTION FOR SEMICONDUCTOR PACKAGES
- Publication number 20200266149
- Publication date Aug 20, 2020
- Intel Corporation
- Cheng XU
- H01 - BASIC ELECTRIC ELEMENTS

in a stacked assembly with the semiconductor or solid state device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated fan-out package and the methods of manufacturing

Thin film capacitor and electronic circuit substrate having the same

Package structure with conductive patterns in a redistribution layer

Package structure

Advanced info POP and method of forming thereof

Semiconductor package and method

Substrate assembly with encapsulated magnetic feature

Semiconductor package

Methods of embedding magnetic structures in substrates

Semiconductor package structure and method of manufacturing the same

Assembly structure and package structure

Deep trench capacitors embedded in package substrate

Semiconductor devices and methods of manufacturing semiconductor de...

Core layer with fully encapsulated co-axial magnetic material aroun...

Integrated device packages with passive device assemblies

Multi-stacked package-on-package structures

Semiconductor package and method

Package structure

Integrated fan-out stacked package with fan-out redistribution laye...

Integrated fan-out package and the methods of manufacturing

Package including fully integrated voltage regulator circuitry with...

Module installation on printed circuit boards with embedded trace t...

Substrate assembly with encapsulated magnetic feature

Microelectronic assemblies having front end under embedded radio fr...

Stacked decoupling capacitors with integration in a substrate

Semiconductor package

Semiconductor package using cavity substrate and manufacturing methods

Magnetic inductor structures for package devices

Package with tilted interface between device die and encapsulating...

Semiconductor device package

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE

PACKAGE SUBSTRATES WITH EMBEDDED DIE-SIDE, FACE-UP DEEP TRENCH CAPA...

Integrated Fan-Out Package and the Methods of Manufacturing

SUBSTRATE ASSEMBLY WITH ENCAPSULATED MAGNETIC FEATURE

SEMICONDUCTOR PACKAGE

METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

STACKED DECOUPLING CAPACITORS WITH INTEGRATION IN A SUBSTRATE

DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SUBSTRATE-ON-SUBSTRATE STRUCTURE AND ELECTRONICS COMPRISING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR MANUFACTURING PRO...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRODELESS PASSIVE EMBEDDED SUBSTRATE

Advanced INFO POP and Method of Forming Thereof

Multi-Stacked Package-on-Package Structures

SPLIT CONDUCTIVE PAD FOR DEVICE TERMINAL

Package with Tilted Interface Between Device Die and Encapsulating...

Semiconductor Devices and Methods of Forming the Same

GALVANIC CORROSION PROTECTION FOR SEMICONDUCTOR PACKAGES