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H01L2224/2731

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/2731in liquid form

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing electronic device
- Patent number 11,742,319
- Issue date Aug 29, 2023
- Innolux Corporation
- Yi-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 11,640,932
- Issue date May 2, 2023
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,626,352
- Issue date Apr 11, 2023
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 11,557,530
- Issue date Jan 17, 2023
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Coating method, coating apparatus and method for manufacturing comp...
- Patent number 11,305,311
- Issue date Apr 19, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mitsumi Itou
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Die bonder incorporating rotatable adhesive dispenser head
- Patent number 11,289,445
- Issue date Mar 29, 2022
- ASM Technology Singapore Pte. Ltd.
- Wan Yin Yau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package, an electronic circuit package, and methods for enc...
- Patent number 11,189,537
- Issue date Nov 30, 2021
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED chips and methods for manufacturing the same and display...
- Patent number 11,081,632
- Issue date Aug 3, 2021
- CHENGDU VISTAR OPTOELECTRONICS CO., LTD.
- Feng Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 11,024,564
- Issue date Jun 1, 2021
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,961,411
- Issue date Mar 30, 2021
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metering apparatus
- Patent number 10,946,406
- Issue date Mar 16, 2021
- Marco Systemanalyse und Entwicklung GmbH
- Martin Reuter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus and method of manufacturing the same
- Patent number 10,914,992
- Issue date Feb 9, 2021
- Samsung Display Co., Ltd.
- Minseok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating method, coating apparatus and method for manufacturing comp...
- Patent number 10,906,061
- Issue date Feb 2, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mitsumi Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively cross-linked thermal interface materials
- Patent number 10,903,188
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid top terminal for discrete power devices
- Patent number 10,872,846
- Issue date Dec 22, 2020
- RENESAS ELECTRONICS AMERICA INC.
- Jean Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film with conductive particles forming repea...
- Patent number 10,854,571
- Issue date Dec 1, 2020
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Display panel, method for manufacturing the display panel, and disp...
- Patent number 10,818,634
- Issue date Oct 27, 2020
- HKC CORPORATION LIMITED
- Shishuai Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for a semiconductor device having bi-material...
- Patent number 10,784,188
- Issue date Sep 22, 2020
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for improved delamination characteristics in a...
- Patent number 10,763,130
- Issue date Sep 1, 2020
- Microchip Technology Incorporated
- Taweesak Laevohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application mechanism, application apparatus, method for manufactur...
- Patent number 10,751,747
- Issue date Aug 25, 2020
- NTN Corporation
- Akihiro Yamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and method of manufacturing the same
- Patent number 10,725,351
- Issue date Jul 28, 2020
- Samsung Display Co., Ltd.
- Minseok Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,727,170
- Issue date Jul 28, 2020
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240321809
- Publication date Sep 26, 2024
- STMicroelectronics International N.V.
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20240194629
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Liquid Metal as Heat-Dissipation Media and Method For...
- Publication number 20240038627
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...
- Publication number 20230307407
- Publication date Sep 28, 2023
- Tohru YASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Electronic Device With Film Isolated Power Stack
- Publication number 20230268253
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230207432
- Publication date Jun 29, 2023
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220104343
- Publication date Mar 31, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Ji-Young OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Electronic Device With Film Isolated Power Stack
- Publication number 20210265246
- Publication date Aug 26, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING METHOD, COATING APPARATUS AND METHOD FOR MANUFACTURING COMP...
- Publication number 20210107029
- Publication date Apr 15, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- MITSUMI ITOU
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PACKAGED ELECTRONIC DEVICE WITH FILM ISOLATED POWER STACK
- Publication number 20200402894
- Publication date Dec 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200292864
- Publication date Sep 17, 2020
- SAMSUNG DISPLAY CO., LTD.
- Minseok KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-LED CHIPS AND METHODS FOR MANUFACTURING THE SAME AND DISPLAY...
- Publication number 20200251641
- Publication date Aug 6, 2020
- Kunshan New Flat Panel Display Technology Center Co., Ltd.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDER INCORPORATING ROTATABLE ADHESIVE DISPENSER HEAD
- Publication number 20200203305
- Publication date Jun 25, 2020
- ASM Technology Singapore Pte Ltd
- Wan Yin YAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, METHOD FOR MANUFACTURING THE DISPLAY PANEL, AND DISP...
- Publication number 20200111762
- Publication date Apr 9, 2020
- HKC Corporation Limited
- Shishuai Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20190348347
- Publication date Nov 14, 2019
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY CROSS-LINKED THERMAL INTERFACE MATERIALS
- Publication number 20190326253
- Publication date Oct 24, 2019
- International Business Machines Corporation
- ERIC J. CAMPBELL
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Methods and Apparatus for a Semiconductor Device Having Bi-Material...
- Publication number 20190304881
- Publication date Oct 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING METHOD, COATING APPARATUS AND METHOD FOR MANUFACTURING COMP...
- Publication number 20190262856
- Publication date Aug 29, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- MITSUMI ITOU
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190204653
- Publication date Jul 4, 2019
- SAMSUNG DISPLAY CO., LTD.
- Minseok KIM
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONDUCTIVE PASTE AND DIE BONDING METHOD
- Publication number 20190139930
- Publication date May 9, 2019
- KAKEN TECH CO., LTD.
- Shigeo Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATION MECHANISM, APPLICATION APPARATUS, METHOD FOR MANUFACTUR...
- Publication number 20190060948
- Publication date Feb 28, 2019
- NTN CORPORATION
- Akihiro YAMANAKA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METERING APPARATUS
- Publication number 20190054491
- Publication date Feb 21, 2019
- MARCO SYSTEMANALYSE UND ENTWICKLUNG GMBH
- Martin Reuter
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...
- Publication number 20190048238
- Publication date Feb 14, 2019
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...
- Publication number 20180346777
- Publication date Dec 6, 2018
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
- Publication number 20180344245
- Publication date Dec 6, 2018
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES
- Publication number 20180342463
- Publication date Nov 29, 2018
- Intel Corporation
- Taylor GAINES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SANDWICH STRUCTURE WITH TWO PARTS JOINED TOGETHER BY MEA...
- Publication number 20180331065
- Publication date Nov 15, 2018
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SUBSTRATE ARRANGEMENT, SUBSTRATE ARRANGEMENT...
- Publication number 20180286831
- Publication date Oct 4, 2018
- Heraeus Deutschland GmbH & Co. KG
- Andreas HINRICH
- H01 - BASIC ELECTRIC ELEMENTS

in liquid form

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fingerprint sensor and manufacturing method thereof

Method of manufacturing electronic device

Packaged electronic device with film isolated power stack

Semiconductor device and method for manufacturing the same

Semiconductor devices and methods of making the same

Alternative compositions for high temperature soldering applications

Sintering materials and attachment methods using same

Fingerprint sensor and manufacturing method thereof

Coating method, coating apparatus and method for manufacturing comp...

Die bonder incorporating rotatable adhesive dispenser head

Circuit package, an electronic circuit package, and methods for enc...

Micro-LED chips and methods for manufacturing the same and display...

Packaged electronic device with film isolated power stack

Inkjet adhesive, manufacturing method for semiconductor device, and...

Metering apparatus

Display apparatus and method of manufacturing the same

Coating method, coating apparatus and method for manufacturing comp...

Selectively cross-linked thermal interface materials

Solid top terminal for discrete power devices

Semiconductor packaging structure and process

Anisotropic conductive film with conductive particles forming repea...

Display panel, method for manufacturing the display panel, and disp...

Methods and apparatus for a semiconductor device having bi-material...

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Systems and methods for improved delamination characteristics in a...

Application mechanism, application apparatus, method for manufactur...

Display apparatus and method of manufacturing the same

Semiconductor devices and methods of making the same

Wafer level flat no-lead semiconductor packages and methods of manu...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Making a Semiconductor Package w...

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

Packages with Liquid Metal as Heat-Dissipation Media and Method For...

MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...

Packaged Electronic Device With Film Isolated Power Stack

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

STRETCHABLE ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Packaged Electronic Device With Film Isolated Power Stack

COATING METHOD, COATING APPARATUS AND METHOD FOR MANUFACTURING COMP...

PACKAGED ELECTRONIC DEVICE WITH FILM ISOLATED POWER STACK

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

MICRO-LED CHIPS AND METHODS FOR MANUFACTURING THE SAME AND DISPLAY...

DIE BONDER INCORPORATING ROTATABLE ADHESIVE DISPENSER HEAD

DISPLAY PANEL, METHOD FOR MANUFACTURING THE DISPLAY PANEL, AND DISP...

Die Attach Methods and Semiconductor Devices Manufactured based on...

SELECTIVELY CROSS-LINKED THERMAL INTERFACE MATERIALS

Methods and Apparatus for a Semiconductor Device Having Bi-Material...

COATING METHOD, COATING APPARATUS AND METHOD FOR MANUFACTURING COMP...

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE PASTE AND DIE BONDING METHOD

APPLICATION MECHANISM, APPLICATION APPARATUS, METHOD FOR MANUFACTUR...

METERING APPARATUS

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...

VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING

CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES

ELECTRONIC SANDWICH STRUCTURE WITH TWO PARTS JOINED TOGETHER BY MEA...

METHOD FOR PRODUCING A SUBSTRATE ARRANGEMENT, SUBSTRATE ARRANGEMENT...