in side view

Industry

CPC
H01L2224/29016

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29016in side view

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Die on die bonding structure
- Patent number 12,125,819
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and display device using the same
- Patent number 12,021,056
- Issue date Jun 25, 2024
- LG Display Co., Ltd.
- Chang Hyun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light emitting diode display panel, manufacturing method ther...
- Patent number 11,978,840
- Issue date May 7, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Xueru Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer on wafer bonding structure
- Patent number 11,715,723
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,626,352
- Issue date Apr 11, 2023
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure with hybrid bonding structure and method of fab...
- Patent number 11,251,157
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and dicing method
- Patent number 10,784,165
- Issue date Sep 22, 2020
- Kabushiki Kaisha Toshiba
- Shingo Masuko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing a display device
- Patent number 10,446,637
- Issue date Oct 15, 2019
- Japan Display Inc.
- Kazuhiro Odaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling bond layer and power electronics assemblies incorporating t...
- Patent number 10,388,590
- Issue date Aug 20, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low void solder joint for multiple reflow applications
- Patent number 9,468,136
- Issue date Oct 11, 2016
- Indium Corporation
- Jordan Peter Ross
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low void solder joint for multiple reflow applications
- Patent number 9,010,616
- Issue date Apr 21, 2015
- Indium Corporation
- Jordan Peter Ross
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,815,647
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, manufacturing program...
- Patent number 8,691,628
- Issue date Apr 8, 2014
- Kabushiki Kaisha Toshiba
- Yasuo Tane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,592,926
- Issue date Nov 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,058,143
- Issue date Nov 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240395774
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ON DIE BONDING STRUCTURE
- Publication number 20240387452
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332261
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20240312945
- Publication date Sep 19, 2024
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...
- Publication number 20240213197
- Publication date Jun 27, 2024
- INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Haohua MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20240178357
- Publication date May 30, 2024
- AUO Corporation
- Shih-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE
- Publication number 20240038795
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Sang-Uk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP SCALE OPTICAL SENSOR PACKAGE
- Publication number 20240030265
- Publication date Jan 25, 2024
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LIGHT EMITTING DIODE DISPLAY PANEL, MANUFACTURING METHOD THER...
- Publication number 20240030393
- Publication date Jan 25, 2024
- Shenzhen china Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Xueru MEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230299247
- Publication date Sep 21, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND TILED DISPLAY DEVICE
- Publication number 20230238373
- Publication date Jul 27, 2023
- SAMSUNG DISPLAY CO., LTD.
- Nak Cho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON CONDUCTIVE FILM, METHOD FOR FORMING NON CONDUCTIVE FILM, CHIP P...
- Publication number 20230215832
- Publication date Jul 6, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHIH-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230207432
- Publication date Jun 29, 2023
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING ELEMENTS, AND MET...
- Publication number 20220406982
- Publication date Dec 22, 2022
- LG ELECTRONICS INC.
- Hwanjoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING DIE STACK STRUCTURE
- Publication number 20220165711
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20210398933
- Publication date Dec 23, 2021
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DICING METHOD
- Publication number 20190267288
- Publication date Aug 29, 2019
- Kabushiki Kaisha Toshiba
- Shingo Masuko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING BOND LAYER AND POWER ELECTRONICS ASSEMBLIES INCORPORATING T...
- Publication number 20190237389
- Publication date Aug 1, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACK STRUCTURE AND METHOD OF FABRICATING THE SAME AND PACKAGE
- Publication number 20190131277
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING A DISPLAY DEVICE
- Publication number 20180350893
- Publication date Dec 6, 2018
- Japan Display Inc.
- Kazuhiro ODAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION ARRANGEMENT OF AN ELECTRIC AND/OR ELECTRONIC COMPONENT
- Publication number 20160064350
- Publication date Mar 3, 2016
- ROBERT BOSCH GmbH
- Christiane Frueh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD OF MAKING CONDUCTIVE CONNECTION
- Publication number 20140290059
- Publication date Oct 2, 2014
- FUJIFILM CORPORATION
- Takeaki KAWASHIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS
- Publication number 20140193658
- Publication date Jul 10, 2014
- Indium Corporation
- Jordan Peter Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS
- Publication number 20120305632
- Publication date Dec 6, 2012
- Jordan Peter Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING PROGRAM...
- Publication number 20120149151
- Publication date Jun 14, 2012
- Kabushiki Kaisha Toshiba
- Yasuo TANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20120068325
- Publication date Mar 22, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20100181676
- Publication date Jul 22, 2010
- RUBEN B. MONTEZ
- B81 - MICRO-STRUCTURAL TECHNOLOGY

in side view

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die on die bonding structure

Electronic device and display device using the same

Micro light emitting diode display panel, manufacturing method ther...

Wafer on wafer bonding structure

Semiconductor device and method for manufacturing the same

Die stack structure with hybrid bonding structure and method of fab...

Semiconductor device and dicing method

Display device and method of manufacturing a display device

Cooling bond layer and power electronics assemblies incorporating t...

Low void solder joint for multiple reflow applications

Low void solder joint for multiple reflow applications

Chip package and a method for manufacturing a chip package

Method of manufacturing semiconductor device, manufacturing program...

Substrate bonding with metal germanium silicon material

Substrate bonding with metal germanium silicon material

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

DIE ON DIE BONDING STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE

STACKED CHIP SCALE OPTICAL SENSOR PACKAGE

MICRO LIGHT EMITTING DIODE DISPLAY PANEL, MANUFACTURING METHOD THER...

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

DISPLAY DEVICE AND TILED DISPLAY DEVICE

NON CONDUCTIVE FILM, METHOD FOR FORMING NON CONDUCTIVE FILM, CHIP P...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING ELEMENTS, AND MET...

METHOD OF MANUFACTURING DIE STACK STRUCTURE

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

SEMICONDUCTOR DEVICE AND DICING METHOD

COOLING BOND LAYER AND POWER ELECTRONICS ASSEMBLIES INCORPORATING T...

DIE STACK STRUCTURE AND METHOD OF FABRICATING THE SAME AND PACKAGE

DISPLAY DEVICE AND METHOD OF MANUFACTURING A DISPLAY DEVICE

CONNECTION ARRANGEMENT OF AN ELECTRIC AND/OR ELECTRONIC COMPONENT

ANISOTROPIC CONDUCTIVE FILM AND METHOD OF MAKING CONDUCTIVE CONNECTION

LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING PROGRAM...

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL