in the lower part of the bonding apparatus

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H01L2224/78281

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78281in the lower part of the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing thereof
- Patent number 6,458,609
- Issue date Oct 1, 2002
- Rohm Co., Ltd.
- Junichi Hikita
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device having a plurality of semiconductor chips
- Patent number 6,133,637
- Issue date Oct 17, 2000
- Rohm Co., Ltd.
- Junichi Hikita
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents