in the lower part of the bonding apparatus

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CPC
H01L2224/75281

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75281in the lower part of the bonding apparatus

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing an integral join and automatic placement machine
- Patent number 11,081,464
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Nicolas Heuck
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Apparatus for heating a substrate during die bonding
- Patent number 10,199,350
- Issue date Feb 5, 2019
- ASM Technology Singapore Pte. Ltd.
- Ming Yeung Luke Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermo-compression bonding system, subsystems, and methods of use
- Patent number 9,911,710
- Issue date Mar 6, 2018
- MRSI Systems, LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of transferring and bonding an array of micro devices
- Patent number 9,773,750
- Issue date Sep 26, 2017
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active matrix emissive micro LED display
- Patent number 9,159,700
- Issue date Oct 13, 2015
- LuxVue Technology Corporation
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed substrate manufacturing equipment and manufacturing method
- Patent number 8,921,157
- Issue date Dec 30, 2014
- Hitachi, Ltd.
- Noriaki Mukai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20200243477
- Publication date Jul 30, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20170365578
- Publication date Dec 21, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BONDING METHOD
- Publication number 20140263581
- Publication date Sep 18, 2014
- ALPHA DESIGN CO., LTD.
- Toshiyuki SHIRATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE MATRIX EMISSIVE MICRO LED DISPLAY
- Publication number 20140159067
- Publication date Jun 12, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR HEATING A SUBSTRATE DURING DIE BONDING
- Publication number 20130316294
- Publication date Nov 28, 2013
- Ming Yeung Luke WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING AND BONDING AN ARRAY OF MICRO DEVICES
- Publication number 20130210194
- Publication date Aug 15, 2013
- LUXVUE TECHNOLOGY CORPORATION
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED SUBSTRATE MANUFACTURING EQUIPMENT AND MANUFACTURING METHOD
- Publication number 20120244666
- Publication date Sep 27, 2012
- Noriaki MUKAI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

in the lower part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing an integral join and automatic placement machine

Apparatus for heating a substrate during die bonding

Thermo-compression bonding system, subsystems, and methods of use

Method of transferring and bonding an array of micro devices

Active matrix emissive micro LED display

Printed substrate manufacturing equipment and manufacturing method

Patents Applicationslast 30 patents

DIE BONDING APPARATUS AND DIE BONDING METHOD

DIE BONDING APPARATUS AND DIE BONDING METHOD

ELECTRONIC COMPONENT BONDING METHOD

ACTIVE MATRIX EMISSIVE MICRO LED DISPLAY

APPARATUS FOR HEATING A SUBSTRATE DURING DIE BONDING

METHOD OF TRANSFERRING AND BONDING AN ARRAY OF MICRO DEVICES

PRINTED SUBSTRATE MANUFACTURING EQUIPMENT AND MANUFACTURING METHOD