in the lower part of the bonding apparatus

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/75501in the lower part of the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for and method for aligning dipoles and method of fabrica...
- Patent number 11,728,196
- Issue date Aug 15, 2023
- Samsung Display Co., Ltd.
- Won Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using a processing oven
- Patent number 11,456,274
- Issue date Sep 27, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing oven
- Patent number 11,296,049
- Issue date Apr 5, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- Christopher Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ion beam etching chamber with etching by-product redistributor
- Patent number 11,239,060
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Hsien Hsieh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Conveying device
- Patent number 10,739,043
- Issue date Aug 11, 2020
- JTEKT Corporation
- Toshiyuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating and cooling device
- Patent number 10,583,510
- Issue date Mar 10, 2020
- Fuji Electric Co., Ltd.
- Shoji Yokoyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 10,568,245
- Issue date Feb 18, 2020
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses for high temperature bonding controlled pro...
- Patent number 10,500,661
- Issue date Dec 10, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Hannes Martin Hinrich Greve
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding machines for bonding semiconductor elements, methods of ope...
- Patent number 10,468,373
- Issue date Nov 5, 2019
- Kulicke and Sofia Industries, Inc.
- Thomas J. Colosimo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for heating a substrate during die bonding
- Patent number 10,199,350
- Issue date Feb 5, 2019
- ASM Technology Singapore Pte. Ltd.
- Ming Yeung Luke Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump stretching method
- Patent number 10,163,835
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding stage and bonding apparatus comprising the same
- Patent number 10,058,952
- Issue date Aug 28, 2018
- Samsung Electronics Co., Ltd.
- Seung-Dae Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 9,968,020
- Issue date May 8, 2018
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding machines for bonding semiconductor elements, methods of ope...
- Patent number 9,929,121
- Issue date Mar 27, 2018
- Kulicke and Soffa Industries, Inc.
- Thomas J. Colosimo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,812,418
- Issue date Nov 7, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,761,552
- Issue date Sep 12, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding tool cooling apparatus and method for cooling bonding tool
- Patent number 9,576,927
- Issue date Feb 21, 2017
- Shinkawa Ltd.
- Osamu Kakutani
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Reduced expansion thermal compression bonding process bond head
- Patent number 9,548,284
- Issue date Jan 17, 2017
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Flip chip bonder and flip chip bonding method
- Patent number 9,536,856
- Issue date Jan 3, 2017
- Shinkawa Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,530,745
- Issue date Dec 27, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,490,232
- Issue date Nov 8, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for bonding semiconductor chips
- Patent number 9,431,365
- Issue date Aug 30, 2016
- Samsung Electronics Co., Ltd.
- Seung-dae Seok
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for device packaging
- Patent number 9,120,169
- Issue date Sep 1, 2015
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint reflow process for reducing packaging failure rate
- Patent number 9,010,617
- Issue date Apr 21, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform solder reflow fixture
- Patent number 8,444,043
- Issue date May 21, 2013
- International Business Machines Corporation
- William E. Bernier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing LED light bar and manufacturing equipment t...
- Patent number 8,424,744
- Issue date Apr 23, 2013
- Hon Hai Precision Industry Co., Ltd.
- Chih-Chen Lai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 8,286,853
- Issue date Oct 16, 2012
- Tokyo Electron Limited
- Naoki Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined metallic bonding and molding for electronic assemblies inc...
- Patent number 8,278,142
- Issue date Oct 2, 2012
- Texas Instruments Incorporated
- Yoshimi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...
- Publication number 20230386878
- Publication date Nov 30, 2023
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...
- Publication number 20220005719
- Publication date Jan 6, 2022
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUX TRANSFER TOOL AND FLUX TRANSFER METHOD
- Publication number 20190267346
- Publication date Aug 29, 2019
- Powertech Technology Inc.
- Kun-Chi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPE...
- Publication number 20180174997
- Publication date Jun 21, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...
- Publication number 20170347504
- Publication date Nov 30, 2017
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Card Attachment for Enhanced Robustness of Thermal Performance
- Publication number 20170148758
- Publication date May 25, 2017
- International Business Machines Corporation
- Michael Gaynes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding Stage and Bonding Apparatus Comprising the Same
- Publication number 20170136570
- Publication date May 18, 2017
- Samsung Electronics Co., Ltd.
- Seung Dae Seok
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods And Apparatuses For High Temperature Bonding Controlled Pro...
- Publication number 20170129031
- Publication date May 11, 2017
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Hannes Martin Hinrich Greve
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPE...
- Publication number 20170062378
- Publication date Mar 2, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING SEMICONDUCTOR CHIPS
- Publication number 20160079199
- Publication date Mar 17, 2016
- Seung-dae SEOK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP BONDER AND FLIP CHIP BONDING METHOD
- Publication number 20150380381
- Publication date Dec 31, 2015
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED EXPANSION THERMAL COMPRESSION BONDING PROCESS BOND HEAD
- Publication number 20150171047
- Publication date Jun 18, 2015
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20140224862
- Publication date Aug 14, 2014
- Fuji Electric Co., Ltd.
- Takeshi MATSUSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS
- Publication number 20130248114
- Publication date Sep 26, 2013
- Samsung Electronics Co., Ltd.
- Seung Dae SEOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LED LIGHT BAR
- Publication number 20130214032
- Publication date Aug 22, 2013
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHIH-CHEN LAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP BONDING APPARATUS AND CHIP BONDING METHOD USING THE SAME
- Publication number 20130139380
- Publication date Jun 6, 2013
- Samsung Electronics Co., Ltd.
- Byung Joon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LED LIGHT BAR AND MANUFACTURING EQUIPMENT T...
- Publication number 20120175404
- Publication date Jul 12, 2012
- HON HAI Precision Industry CO., LTD.
- CHIH-CHEN LAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Joint Reflow Process for Reducing Packaging Failure Rate
- Publication number 20120175403
- Publication date Jul 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20120091186
- Publication date Apr 19, 2012
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20120091187
- Publication date Apr 19, 2012
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...
- Publication number 20110287560
- Publication date Nov 24, 2011
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for creating highly compliant thermal bonds that withstand r...
- Publication number 20110114707
- Publication date May 19, 2011
- Santa Barbara Infrared
- Gregory P. Matis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED METALLIC BONDING AND MOLDING FOR ELECTRONIC ASSEMBLIES INC...
- Publication number 20090291524
- Publication date Nov 26, 2009
- Texas Instruments Inc.
- YOSHIMI TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS

in the lower part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus for and method for aligning dipoles and method of fabrica...

Method of using a processing oven

Processing oven

Ion beam etching chamber with etching by-product redistributor

Bonding system

Conveying device

Heating and cooling device

Electronic-component mounting apparatus

Methods and apparatuses for high temperature bonding controlled pro...

Bonding machines for bonding semiconductor elements, methods of ope...

Apparatus for heating a substrate during die bonding

Solder bump stretching method

Bonding stage and bonding apparatus comprising the same

Electronic-component mounting apparatus

Bonding machines for bonding semiconductor elements, methods of ope...

Electronic apparatus and method for fabricating the same

Electronic apparatus and method for fabricating the same

Bonding tool cooling apparatus and method for cooling bonding tool

Reduced expansion thermal compression bonding process bond head

Flip chip bonder and flip chip bonding method

Electronic apparatus and method for fabricating the same

Electronic apparatus and method for fabricating the same

Apparatus for bonding semiconductor chips

Chip-on-wafer bonding method and bonding device, and structure comp...

Method for device packaging

Solder joint reflow process for reducing packaging failure rate

Uniform solder reflow fixture

Method of manufacturing LED light bar and manufacturing equipment t...

Bonding apparatus and bonding method

Combined metallic bonding and molding for electronic assemblies inc...

Patents Applicationslast 30 patents

APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...

APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...

FLUX TRANSFER TOOL AND FLUX TRANSFER METHOD

BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPE...

ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...

Circuit Card Attachment for Enhanced Robustness of Thermal Performance

Bonding Stage and Bonding Apparatus Comprising the Same

Methods And Apparatuses For High Temperature Bonding Controlled Pro...

BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPE...

APPARATUS FOR BONDING SEMICONDUCTOR CHIPS

FLIP CHIP BONDER AND FLIP CHIP BONDING METHOD

REDUCED EXPANSION THERMAL COMPRESSION BONDING PROCESS BOND HEAD

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

CHIP BONDING APPARATUS

METHOD OF MANUFACTURING LED LIGHT BAR

CHIP BONDING APPARATUS AND CHIP BONDING METHOD USING THE SAME

METHOD OF MANUFACTURING LED LIGHT BAR AND MANUFACTURING EQUIPMENT T...

Solder Joint Reflow Process for Reducing Packaging Failure Rate

BONDING APPARATUS

BONDING APPARATUS AND BONDING METHOD

IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...

Method for creating highly compliant thermal bonds that withstand r...

COMBINED METALLIC BONDING AND MOLDING FOR ELECTRONIC ASSEMBLIES INC...