in the lower part of the bonding apparatus

Industry

CPC
H01L2224/75251

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75251in the lower part of the bonding apparatus

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Contaminant control in thermocompression bonding of semiconductors...
- Patent number 11,908,828
- Issue date Feb 20, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for and method for aligning dipoles and method of fabrica...
- Patent number 11,728,196
- Issue date Aug 15, 2023
- Samsung Display Co., Ltd.
- Won Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for releasing ultra-small or ultra-thin discrete components...
- Patent number 11,728,201
- Issue date Aug 15, 2023
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,705,425
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal compression bonder nozzle with vacuum relief features
- Patent number 11,652,080
- Issue date May 16, 2023
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 11,651,983
- Issue date May 16, 2023
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package and apparatus for p...
- Patent number 11,646,294
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Ungkeol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform pressure gang bonding method
- Patent number 11,637,082
- Issue date Apr 25, 2023
- eLux, Inc.
- Wei-Yuan Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow method and system
- Patent number 11,610,859
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive for semiconductor device, and high productivity method for...
- Patent number 11,608,455
- Issue date Mar 21, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method and mounting device
- Patent number 11,495,571
- Issue date Nov 8, 2022
- Toray Engineering Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for bonding a chip to a substrate
- Patent number 11,476,228
- Issue date Oct 18, 2022
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contaminant control in thermocompression bonding of semiconductors...
- Patent number 11,410,964
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sintering press and method for sintering electronic components on a...
- Patent number 11,380,647
- Issue date Jul 5, 2022
- AMX—AUTOMATRIX S.R.L.
- Nicola Schivalocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for semi-flexible eutectic bonder piece arraneg...
- Patent number 11,211,354
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hang Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and related techniques for handling aligned substrate pairs
- Patent number 11,183,401
- Issue date Nov 23, 2021
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for constructing micro-LED display module
- Patent number 11,177,157
- Issue date Nov 16, 2021
- LUMENS CO., LTD.
- Kihyun An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for uniform pressure gang bonding
- Patent number 11,152,328
- Issue date Oct 19, 2021
- eLux, Inc.
- Wei-Yuan Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,024,595
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 10,971,471
- Issue date Apr 6, 2021
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Setting up ultra-small or ultra-thin discrete components for easy a...
- Patent number 10,937,680
- Issue date Mar 2, 2021
- Uniqarta, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate processing apparatus and manufacturing method of substrat...
- Patent number 10,833,045
- Issue date Nov 10, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack tool for reflow and stack apparatus having the same
- Patent number 10,833,046
- Issue date Nov 10, 2020
- Samsung Electronics Co., Ltd.
- Tea Geon Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 10,825,705
- Issue date Nov 3, 2020
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting Method of a semiconductor device using a colored auxiliary...
- Patent number 10,786,876
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMOCOMPRESSION APPARATUS AND METHOD FOR BONDING ELECTRICAL COMPO...
- Publication number 20240421118
- Publication date Dec 19, 2024
- MB Automation GmbH & Co. KG
- Benjamin Holzner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Wafer Oxide Removal and Reflow Treatment
- Publication number 20240282734
- Publication date Aug 22, 2024
- Air Products and Chemicals, Inc.
- Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVI...
- Publication number 20240186279
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...
- Publication number 20240186280
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...
- Publication number 20230386878
- Publication date Nov 30, 2023
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...
- Publication number 20230377936
- Publication date Nov 23, 2023
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES
- Publication number 20230238352
- Publication date Jul 27, 2023
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRANGEMENT FOR FORMING A CONNECTION
- Publication number 20220238478
- Publication date Jul 28, 2022
- Arthur Unrau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLOW METHOD AND SYSTEM
- Publication number 20220130795
- Publication date Apr 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...
- Publication number 20220005719
- Publication date Jan 6, 2022
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES
- Publication number 20210288021
- Publication date Sep 16, 2021
- Intel Corporation
- Mihir Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20210233887
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTAMINANT CONTROL IN THERMOCOMPRESSION BONDING OF SEMICONDUCTORS...
- Publication number 20210159206
- Publication date May 27, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS
- Publication number 20210013079
- Publication date Jan 14, 2021
- SUSS MICROTEC LITHOGRAPHY GMBH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONSTRUCTING MICRO-LED DISPLAY MODULE
- Publication number 20200294976
- Publication date Sep 17, 2020
- LUMENS CO., LTD
- Kihyun AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20200243477
- Publication date Jul 30, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20200212001
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...
- Publication number 20200135534
- Publication date Apr 30, 2020
- UNIQARTA, INC.
- Val Marinov
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20200095481
- Publication date Mar 26, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHODS FOR IMPROVED DIE BONDING
- Publication number 20200006283
- Publication date Jan 2, 2020
- SKYWORKS SOLUTIONS, INC.
- José Manuel FLORES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING PRESS AND METHOD FOR SINTERING ELECTRONIC COMPONENTS ON A...
- Publication number 20190326250
- Publication date Oct 24, 2019
- AMX - AUTOMATRIX S.R.L.
- Nicola SCHIVALOCCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TOOL FOR REFLOW AND STACK APPARATUS HAVING THE SAME
- Publication number 20190252343
- Publication date Aug 15, 2019
- Samsung Electronics Co., Ltd.
- Tea Geon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR SEMI-FLEXIBLE EUTECTIC BONDER PIECE ARRANGM...
- Publication number 20190164929
- Publication date May 30, 2019
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chih-Hang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD
- Publication number 20190164928
- Publication date May 30, 2019
- KAIJO CORPORATION
- Hideki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...
- Publication number 20190048238
- Publication date Feb 14, 2019
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20190027462
- Publication date Jan 24, 2019
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...
- Publication number 20180346777
- Publication date Dec 6, 2018
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND MANUFACTURING METHOD OF SUBSTRAT...
- Publication number 20180342479
- Publication date Nov 29, 2018
- TOKYO ELECTRON LIMITED
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS

in the lower part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Contaminant control in thermocompression bonding of semiconductors...

Apparatus for and method for aligning dipoles and method of fabrica...

Methods for releasing ultra-small or ultra-thin discrete components...

Thermocompression bond tips and related apparatus and methods

Thermal compression bonder nozzle with vacuum relief features

Apparatus, system, and method for handling aligned wafer pairs

Method of manufacturing a semiconductor package and apparatus for p...

Uniform pressure gang bonding method

Reflow method and system

Adhesive for semiconductor device, and high productivity method for...

Chip assembly

Mounting method and mounting device

Method and system for bonding a chip to a substrate

Contaminant control in thermocompression bonding of semiconductors...

Sintering materials and attachment methods using same

Sintering press and method for sintering electronic components on a...

Systems and methods for semi-flexible eutectic bonder piece arraneg...

System and related techniques for handling aligned substrate pairs

Method for constructing micro-LED display module

System and method for uniform pressure gang bonding

Thermocompression bond tips and related apparatus and methods

Methods and systems for manufacturing semiconductor devices

Setting up ultra-small or ultra-thin discrete components for easy a...

Bonding system

Substrate processing apparatus and manufacturing method of substrat...

Stack tool for reflow and stack apparatus having the same

Apparatus, system, and method for handling aligned wafer pairs

Mounting Method of a semiconductor device using a colored auxiliary...

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Patents Applicationslast 30 patents

THERMOCOMPRESSION APPARATUS AND METHOD FOR BONDING ELECTRICAL COMPO...

Apparatus and Method for Wafer Oxide Removal and Reflow Treatment

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVI...

THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...

APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...

Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...

THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES

ARRANGEMENT FOR FORMING A CONNECTION

REFLOW METHOD AND SYSTEM

APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...

THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

CONTAMINANT CONTROL IN THERMOCOMPRESSION BONDING OF SEMICONDUCTORS...

APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS

METHOD FOR CONSTRUCTING MICRO-LED DISPLAY MODULE

DIE BONDING APPARATUS AND DIE BONDING METHOD

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...

ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

METHODS FOR IMPROVED DIE BONDING

SINTERING PRESS AND METHOD FOR SINTERING ELECTRONIC COMPONENTS ON A...

STACK TOOL FOR REFLOW AND STACK APPARATUS HAVING THE SAME

SYSTEMS AND METHODS FOR SEMI-FLEXIBLE EUTECTIC BONDER PIECE ARRANGM...

BONDING METHOD

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...

SUBSTRATE PROCESSING APPARATUS AND MANUFACTURING METHOD OF SUBSTRAT...