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in the upper part of the bonding apparatus
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H01L2224/77702
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/77702
in the upper part of the bonding apparatus
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last 30 patents
Information
Patent Grant
Method of manufacturing a semiconductor device
Patent number
10,403,616
Issue date
Sep 3, 2019
Fuji Electric Co., Ltd.
Kenichiro Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
Patent number
9,991,242
Issue date
Jun 5, 2018
Fuji Electric Co., Ltd.
Kenichiro Sato
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Ultrasonic bonding systems and methods of using the same
Patent number
8,746,537
Issue date
Jun 10, 2014
Orthodyne Electronics Corporation
Christoph B. Luechinger
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
Publication number
20180254267
Publication date
Sep 6, 2018
Fuji Electric Co., Ltd.
Kenichiro SATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
Publication number
20140048584
Publication date
Feb 20, 2014
Orthodyne Electronics Corporation
Christoph B. Luechinger
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR