in the upper part of the bonding apparatus

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75756in the upper part of the bonding apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball disposition system, method of disposing a ball on a substrate...
- Patent number 11,488,928
- Issue date Nov 1, 2022
- Samsung Electronics Co., Ltd.
- Sukmin Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding tools for bonding machines, bonding machines for bonding se...
- Patent number 11,342,301
- Issue date May 24, 2022
- Kulicke and Soffa Industries, Inc.
- Ai Jun Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding tools for bonding machines, bonding machines for bonding se...
- Patent number 11,049,839
- Issue date Jun 29, 2021
- Kulicke and Soffa Industries, Inc.
- Ai Jun Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit pin positioning structure, fabrication method of soldered c...
- Patent number 10,679,961
- Issue date Jun 9, 2020
- Tarng Yu Enterprise Co., Ltd.
- Tsung-Chi Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip bonding apparatus, chip bonding method and a chip package stru...
- Patent number 10,366,965
- Issue date Jul 30, 2019
- Industrial Technology Research Institute
- Shu-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 10,269,753
- Issue date Apr 23, 2019
- Toyota Jidosha Kabushiki Kaisha
- Akinori Sakakibara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,269,609
- Issue date Apr 23, 2019
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip attach frame
- Patent number 10,056,346
- Issue date Aug 21, 2018
- International Business Machines Corporation
- Martin Eckert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device, heat insulating load...
- Patent number 10,020,282
- Issue date Jul 10, 2018
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 9,892,952
- Issue date Feb 13, 2018
- Semiconductor Components Industries, LLC
- Darrell Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for molecular adhesion bonding with compensation for radi...
- Patent number 9,818,614
- Issue date Nov 14, 2017
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Au-based solder die attachment semiconductor device and method for...
- Patent number 9,698,082
- Issue date Jul 4, 2017
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for molecular adhesion bonding with compensation for radial...
- Patent number 9,123,631
- Issue date Sep 1, 2015
- Soitec
- Gweltaz Gaudin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 9,016,342
- Issue date Apr 28, 2015
- Apic Yamada Corporation
- Kazuhiko Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonding method with reduction in overlay misalignment
- Patent number 8,575,002
- Issue date Nov 5, 2013
- Soitec
- Marcel Broekaart
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for molecular adhesion bonding with compensation for radial...
- Patent number 8,475,612
- Issue date Jul 2, 2013
- Soitec
- Gweltaz Gaudin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device mounted structure and its manufacturing method...
- Patent number 8,426,965
- Issue date Apr 23, 2013
- Panasonic Corporation
- Teppei Iwase
- B30 - PRESSES
Information Patent Grant
Metallic thermal joint for high power density chips
- Patent number 8,368,205
- Issue date Feb 5, 2013
- Oracle America, Inc.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device mounted structure and its manufacturing method...
- Patent number 8,264,079
- Issue date Sep 11, 2012
- Panasonic Corporation
- Teppei Iwase
- B30 - PRESSES
Information Patent Grant
Method for packing electric components on a substrate
- Patent number 8,241,455
- Issue date Aug 14, 2012
- Sony Chemical & Information Device Corporation
- Takashi Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting method
- Patent number 8,048,254
- Issue date Nov 1, 2011
- Sony Chemical & Information Device Corporation
- Takashi Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part mounting substrate and method for producing same
- Patent number 8,039,757
- Issue date Oct 18, 2011
- Dowa Metaltech Co., Ltd.
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part mounting substrate and method for producing same
- Patent number 7,159,310
- Issue date Jan 9, 2007
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting structure of electronic part and electronic device using...
- Patent number 5,086,337
- Issue date Feb 4, 1992
- Hitachi, Ltd.
- Takanobu Noro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressive pedestal for microminiature connections
- Patent number 4,902,606
- Issue date Feb 20, 1990
- Hughes Aircraft Company
- Nils E. Patraw
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSI...
- Publication number 20240329125
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Moise AVOCI UGWIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220406747
- Publication date Dec 22, 2022
- SHINKAWA LTD.
- Hideharu NIHEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL DISPOSITION SYSTEM, METHOD OF DISPOSING A BALL ON A SUBSTRATE...
- Publication number 20210249378
- Publication date Aug 12, 2021
- Samsung Electronics Co., Ltd.
- SUKMIN OH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20200243477
- Publication date Jul 30, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOLS FOR BONDING MACHINES, BONDING MACHINES FOR BONDING SE...
- Publication number 20190229084
- Publication date Jul 25, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Ai Jun Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP BONDING APPARATUS, CHIP BONDING METHOD AND A CHIP PACKAGE STRU...
- Publication number 20190131271
- Publication date May 2, 2019
- Industrial Technology Research Institute
- Shu-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...
- Publication number 20180174881
- Publication date Jun 21, 2018
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PIN POSITIONING STRUCTURE, FABRICATION METHOD OF SOLDERED C...
- Publication number 20180082974
- Publication date Mar 22, 2018
- Tarng Yu Enterprise co.,ltd
- TSUNG-CHI CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP ATTACH FRAME
- Publication number 20170162534
- Publication date Jun 8, 2017
- International Business Machines Corporation
- Martin Eckert
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MOLECULAR ADHESION BONDING WITH COMPENSATION FOR RADIAL...
- Publication number 20130210171
- Publication date Aug 15, 2013
- SOITEC
- Gweltaz Gaudin
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD...
- Publication number 20120298310
- Publication date Nov 29, 2012
- Teppei Iwase
- B30 - PRESSES
Information Patent Application
HEATING APPARATUS AND IMPLEMENTED BODY MANUFACTURING METHOD
- Publication number 20120279653
- Publication date Nov 8, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Takashi Matsumura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20120247664
- Publication date Oct 4, 2012
- Kazuhiko KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS
- Publication number 20120153453
- Publication date Jun 21, 2012
- ORACLE AMERICA, INC.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHOD WITH REDUCTION IN OVERLAY MISALIGNMENT
- Publication number 20120077329
- Publication date Mar 29, 2012
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOLECULAR ADHESION BONDING WITH COMPENSATION FOR RADIAL...
- Publication number 20120006463
- Publication date Jan 12, 2012
- Gweltaz Gaudin
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PACKING ELECTRIC COMPONENTS ON A SUBSTRATE
- Publication number 20100186894
- Publication date Jul 29, 2010
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Takashi Matsumura
- B30 - PRESSES
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD...
- Publication number 20100181667
- Publication date Jul 22, 2010
- Teppei Iwase
- B30 - PRESSES
Information Patent Application
MOUNTING METHOD
- Publication number 20090038753
- Publication date Feb 12, 2009
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Takashi Matsumura
- B30 - PRESSES
Information Patent Application
COMPRESSION BONDING DEVICE
- Publication number 20090014498
- Publication date Jan 15, 2009
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Takashi Matsumura
- B30 - PRESSES
Information Patent Application
Electronic part mounting substrate and method for producing same
- Publication number 20070089291
- Publication date Apr 26, 2007
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic part mounting substrate and method for producing same
- Publication number 20050047101
- Publication date Mar 3, 2005
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

in the upper part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding apparatus and bonding method

Ball disposition system, method of disposing a ball on a substrate...

Bonding tools for bonding machines, bonding machines for bonding se...

Bonding tools for bonding machines, bonding machines for bonding se...

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Circuit pin positioning structure, fabrication method of soldered c...

Chip bonding apparatus, chip bonding method and a chip package stru...

Semiconductor device and manufacturing method of semiconductor device

Wafer level flat no-lead semiconductor packages and methods of manu...

Chip attach frame

Method for manufacturing semiconductor device, heat insulating load...

Wafer level flat no-lead semiconductor packages and methods of manu...

Apparatus for molecular adhesion bonding with compensation for radi...

Au-based solder die attachment semiconductor device and method for...

Method for molecular adhesion bonding with compensation for radial...

Bonding apparatus and bonding method

Direct bonding method with reduction in overlay misalignment

Method for molecular adhesion bonding with compensation for radial...

Semiconductor device mounted structure and its manufacturing method...

Metallic thermal joint for high power density chips

Semiconductor device mounted structure and its manufacturing method...

Method for packing electric components on a substrate

Mounting method

Electronic part mounting substrate and method for producing same

Electronic part mounting substrate and method for producing same

Connecting structure of electronic part and electronic device using...

Compressive pedestal for microminiature connections

Patents Applicationslast 30 patents

METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSI...

BONDING APPARATUS AND BONDING METHOD

BALL DISPOSITION SYSTEM, METHOD OF DISPOSING A BALL ON A SUBSTRATE...

DIE BONDING APPARATUS AND DIE BONDING METHOD

BONDING TOOLS FOR BONDING MACHINES, BONDING MACHINES FOR BONDING SE...

CHIP BONDING APPARATUS, CHIP BONDING METHOD AND A CHIP PACKAGE STRU...

WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...

CIRCUIT PIN POSITIONING STRUCTURE, FABRICATION METHOD OF SOLDERED C...

CHIP ATTACH FRAME

METHOD FOR MOLECULAR ADHESION BONDING WITH COMPENSATION FOR RADIAL...

SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD...

HEATING APPARATUS AND IMPLEMENTED BODY MANUFACTURING METHOD

BONDING APPARATUS AND BONDING METHOD

METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS

DIRECT BONDING METHOD WITH REDUCTION IN OVERLAY MISALIGNMENT

METHOD FOR MOLECULAR ADHESION BONDING WITH COMPENSATION FOR RADIAL...

METHOD FOR PACKING ELECTRIC COMPONENTS ON A SUBSTRATE

SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD...

MOUNTING METHOD

COMPRESSION BONDING DEVICE

Electronic part mounting substrate and method for producing same

Electronic part mounting substrate and method for producing same