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H01L2224/08052

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 11,996,399
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and method for forming the same
- Patent number 11,848,270
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 11,257,805
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dun-Nian Yaung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing chip cards and chip card obtained by said...
- Patent number 10,804,226
- Issue date Oct 13, 2020
- Linxens Holding
- Cyril Proye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Array substrate, method for fabricating the same and display device
- Patent number 10,403,651
- Issue date Sep 3, 2019
- BOE Technology Group Co., Ltd.
- Heecheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 10,388,642
- Issue date Aug 20, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dun-Nian Yaung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and method for binding the same
- Patent number 9,960,132
- Issue date May 1, 2018
- BOE Technology Group Co., Ltd.
- Liqiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 9,299,736
- Issue date Mar 29, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID BONDING WITH UNIFORM PATTERN DENSITY
- Publication number 20240266341
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240170429
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Sangho Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE
- Publication number 20240120277
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Seng SHUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding with Uniform Pattern Density
- Publication number 20220173092
- Publication date Jun 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding with Uniform Pattern Density
- Publication number 20190371780
- Publication date Dec 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dun-Nian Yaung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Chip Cards and Chip Card Obtained by Said...
- Publication number 20190157223
- Publication date May 23, 2019
- LINXENS HOLDING
- Cyril PROYE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND METHOD FOR BINDING THE SAME
- Publication number 20180122758
- Publication date May 3, 2018
- BOE TECHNOLOGY GROUP CO., LTD.
- Liqiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE, METHOD FOR FABRICATING THE SAME AND DISPLAY DEVICE
- Publication number 20160027812
- Publication date Jan 28, 2016
- BOE TECHNOLOGY GROUP CO., LTD.
- HeecheoI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MOUNTING STRUCTURE OF THE SAME
- Publication number 20160007464
- Publication date Jan 7, 2016
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH UNIFORM PATTERN DENSITY
- Publication number 20150279888
- Publication date Oct 1, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS

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Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hybrid bonding with uniform pattern density

Chip structure and method for forming the same

Hybrid bonding with uniform pattern density

Method for manufacturing chip cards and chip card obtained by said...

Array substrate, method for fabricating the same and display device

Hybrid bonding with uniform pattern density

Display apparatus and method for binding the same

Hybrid bonding with uniform pattern density

Patents Applicationslast 30 patents

HYBRID BONDING WITH UNIFORM PATTERN DENSITY

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

CHIP STRUCTURE

Hybrid Bonding with Uniform Pattern Density

Hybrid Bonding with Uniform Pattern Density

Method for Manufacturing Chip Cards and Chip Card Obtained by Said...

DISPLAY APPARATUS AND METHOD FOR BINDING THE SAME

ARRAY SUBSTRATE, METHOD FOR FABRICATING THE SAME AND DISPLAY DEVICE

ELECTRONIC DEVICE AND MOUNTING STRUCTURE OF THE SAME

HYBRID BONDING WITH UNIFORM PATTERN DENSITY