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H01L2224/16052

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 11,984,405
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip semiconductor-on-insulator transistor layout
- Patent number 11,973,033
- Issue date Apr 30, 2024
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator transistor layout for radio frequency po...
- Patent number 11,804,435
- Issue date Oct 31, 2023
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 11,424,189
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 10,923,447
- Issue date Feb 16, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 10,510,670
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic component module and electronic...
- Patent number 10,177,108
- Issue date Jan 8, 2019
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
System and method for an improved fine pitch joint
- Patent number 10,062,659
- Issue date Aug 28, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 9,576,926
- Issue date Feb 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic component module and electronic...
- Patent number 9,532,495
- Issue date Dec 27, 2016
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip assembly process comprising pre-coating interconnect elem...
- Patent number 9,406,662
- Issue date Aug 2, 2016
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- François Marion
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT
- Publication number 20240404952
- Publication date Dec 5, 2024
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240282736
- Publication date Aug 22, 2024
- Japan Display Inc.
- Yoichi KAMIJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PROTECTION DEVICE
- Publication number 20240096748
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Taejun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structure Design in Fan-Out Package
- Publication number 20220352080
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT FOR RADIO FREQUENCY PO...
- Publication number 20210210415
- Publication date Jul 8, 2021
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
- Publication number 20210167030
- Publication date Jun 3, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structure Design in Fan-Out Package
- Publication number 20200091075
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for an Improved Fine Pitch Joint
- Publication number 20160148889
- Publication date May 26, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20150097286
- Publication date Apr 9, 2015
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for an Improved Fine Pitch Joint
- Publication number 20140187103
- Publication date Jul 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...
- Publication number 20140049922
- Publication date Feb 20, 2014
- MURATA MANUFACTURING CO., LTD.
- Shinya KIYONO
- H01 - BASIC ELECTRIC ELEMENTS

in top view

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device assembly with die support structures

Pad structure design in fan-out package

Flip-chip semiconductor-on-insulator transistor layout

Semiconductor-on-insulator transistor layout for radio frequency po...

Pad structure design in fan-out package

Semiconductor device assembly with die support structures

Pad structure design in fan-out package

Method of manufacturing electronic component module and electronic...

System and method for an improved fine pitch joint

Pad structure design in fan-out package

Method of manufacturing electronic component module and electronic...

Flip-chip assembly process comprising pre-coating interconnect elem...

Patents Applicationslast 30 patents

FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CHIP PROTECTION DEVICE

Pad Structure Design in Fan-Out Package

SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT FOR RADIO FREQUENCY PO...

SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES

Pad Structure Design in Fan-Out Package

System and Method for an Improved Fine Pitch Joint

CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME

System and Method for an Improved Fine Pitch Joint

METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...